Abstract: An acoustic resonator filter package includes an acoustic resonator including a piezoelectric layer, a first electrode disposed on a first surface of the piezoelectric layer, and a second electrode disposed on a second surface of the piezoelectric layer; a first substrate having an upper surface on which the acoustic resonator is disposed, the first substrate comprising a first coupling member surrounding the acoustic resonator; a filter spaced apart from the acoustic resonator in an upward direction; a second substrate having a lower surface on which the filter is disposed, the second substrate including a second coupling member disposed above the first coupling member; and a connection member connecting the first coupling member and the second coupling member to each other, the connection member being made of a material different from a material of which the first coupling member and the second coupling member are made.

Abstract: A front end module includes a base filter configured to operate as a bandpass filter passing a pass band of an input radio frequency signal; a switch connected to the base filter, and a first notch filter and a second notch filter selectively connected to the base filter through the switch, wherein a stop band of the first notch filter and a stop band of the second notch filter overlap the pass band of the base filter in a band equal to or higher than a center frequency of the pass band of the base filter.

Abstract: An acoustic resonator filter package includes an acoustic resonator including a piezoelectric layer, a first electrode disposed on a first surface of the piezoelectric layer, and a second electrode disposed on a second surface of the piezoelectric layer; a first substrate having an upper surface on which the acoustic resonator is disposed, the first substrate comprising a first coupling member surrounding the acoustic resonator; a filter spaced apart from the acoustic resonator in an upward direction; a second substrate having a lower surface on which the filter is disposed, the second substrate including a second coupling member disposed above the first coupling member; and a connection member connecting the first coupling member and the second coupling member to each other, the connection member being made of a material different from a material of which the first coupling member and the second coupling member are made.

Abstract: A high pass filter includes: a first resonant circuit including an inductor and a capacitor in parallel between first and second terminals; a second resonant circuit including an inductor and a capacitor in series between a first end of the first resonant circuit and a ground; a third resonant circuit including an inductor and a capacitor in series between a second end of the first resonant circuit and the ground; a fourth resonant circuit disposed between the first end of the first resonant circuit and the first terminal, and including a first acoustic resonator; and a fifth resonant circuit disposed between the second end of the first resonant circuit and the second terminal, and including a second acoustic resonator. Attenuation regions respectively formed by the first, second, and third resonant circuits are arranged in lower frequency regions than attenuation regions respectively formed by the fourth and fifth resonant circuits.

Abstract: A band pass filter includes: a first circuit unit including a first series LC resonant circuit disposed between a first terminal and a second terminal; a second circuit unit disposed between the first circuit unit and the second terminal, and including a first parallel LC resonant circuit; and a third circuit unit disposed between the first terminal and a ground, and including a second series LC resonant circuit, wherein a resonant frequency of the first circuit unit is in a pass band.

Abstract: A front end module includes a base filter configured to operate as a bandpass filter passing a pass band of an input radio frequency signal; a switch connected to the base filter, and a first notch filter and a second notch filter selectively connected to the base filter through the switch, wherein a stop band of the first notch filter and a stop band of the second notch filter overlap the pass band of the base filter in a band equal to or higher than a center frequency of the pass band of the base filter.

Abstract: A band pass filter includes: a first circuit unit including a first series LC resonant circuit disposed between a first terminal and a second terminal; a second circuit unit disposed between the first circuit unit and the second terminal, and including a first parallel LC resonant circuit; and a third circuit unit disposed between the first terminal and a ground, and including a second series LC resonant circuit, wherein a resonant frequency of the first circuit unit is in a pass band.

Abstract: A printed circuit board includes a board portion and an electronic element. The board portion includes a first substrate having an element accommodating portion and second substrates laminated on outer surfaces of the first substrate. The electronic element is disposed in the element accommodating part. The electronic element includes a heat generating element and a heat radiating member coupled to an inactive surface of the heat generating element.

Abstract: A high pass filter includes: a first resonant circuit including an inductor and a capacitor in parallel between first and second terminals; a second resonant circuit including an inductor and a capacitor in series between a first end of the first resonant circuit and a ground; a third resonant circuit including an inductor and a capacitor in series between a second end of the first resonant circuit and the ground; a fourth resonant circuit disposed between the first end of the first resonant circuit and the first terminal, and including a first acoustic resonator; and a fifth resonant circuit disposed between the second end of the first resonant circuit and the second terminal, and including a second acoustic resonator. Attenuation regions respectively formed by the first, second, and third resonant circuits are arranged in lower frequency regions than attenuation regions respectively formed by the fourth and fifth resonant circuits.

Abstract: A hybrid inductor includes a board, a first inductor provided in the board and including conductive patterns disposed at different heights, and a second inductor mounted on the board and an end of the second inductor being connected to the conductive patterns. Since mutual inductance is generated, inductance higher than a capacity value of a single inductor may be obtained.

Abstract: A hybrid inductor includes a board, a first inductor provided in the board and including conductive patterns disposed at different heights, and a second inductor mounted on the board and an end of the second inductor being connected to the conductive patterns. Since mutual inductance is generated, inductance higher than a capacity value of a single inductor may be obtained.

Abstract: A printed circuit board includes a board portion and an electronic element. The board portion includes a first substrate having an element accommodating portion and second substrates laminated on outer surfaces of the first substrate. The electronic element is disposed in the element accommodating part. The electronic element includes a heat generating element and a heat radiating member coupled to an inactive surface of the heat generating element.

Abstract: There are provided a printed circuit board and a manufacturing method thereof. The printed circuit board includes: a core layer having a cavity provided therein; an electronic component included in the cavity; a conductive partition disposed on a side of the cavity; and insulating layers disposed on and below the core layer.

Abstract: There are provided a printed circuit board and a manufacturing method thereof. The printed circuit board includes: a core layer having a cavity provided therein; an electronic component included in the cavity; a conductive partition disposed on a side of the cavity; and insulating layers disposed on and below the core layer.