Abstract: A wearable device which is mountable on a wrist of a user includes a housing including a metal structure, a display positioned within the housing, wherein the display includes a metal layer positioned within the metal structure and spaced apart from the metal structure by a given gap, a printed circuit board (PCB) positioned within the housing and including a ground region, and a control circuit positioned on the PCB and configured to feed a first point of the metal structure. The metal layer is electrically connected with the ground region of the PCB at a second point spaced from the first point by a given angle.

Abstract: A wearable device which is mountable on a wrist of a user includes a housing including a metal structure, a display positioned within the housing, wherein the display includes a metal layer positioned within the metal structure and spaced apart from the metal structure by a given gap, a printed circuit board (PCB) positioned within the housing and including a ground region, and a control circuit positioned on the PCB and configured to feed a first point of the metal structure. The metal layer is electrically connected with the ground region of the PCB at a second point spaced from the first point by a given angle.

Abstract: A wearable device which is mountable on a wrist of a user includes a housing including a metal structure, a display positioned within the housing, wherein the display includes a metal layer positioned within the metal structure and spaced apart from the metal structure by a given gap, a printed circuit board (PCB) positioned within the housing and including a ground region, and a control circuit positioned on the PCB and configured to feed a first point of the metal structure. The metal layer is electrically connected with the ground region of the PCB at a second point spaced from the first point by a given angle.

Abstract: A wearable device which is mountable on a wrist of a user includes a housing including a metal structure, a display positioned within the housing, wherein the display includes a metal layer positioned within the metal structure and spaced apart from the metal structure by a given gap, a printed circuit board (PCB) positioned within the housing and including a ground region, and a control circuit positioned on the PCB and configured to feed a first point of the metal structure. The metal layer is electrically connected with the ground region of the PCB at a second point spaced from the first point by a given angle.

Abstract: A wearable device which is mountable on a wrist of a user includes a housing including a metal structure, a display positioned within the housing, wherein the display includes a metal layer positioned within the metal structure and spaced apart from the metal structure by a given gap, a printed circuit board (PCB) positioned within the housing and including a ground region, and a control circuit positioned on the PCB and configured to feed a first point of the metal structure. The metal layer is electrically connected with the ground region of the PCB at a second point spaced from the first point by a given angle.

Abstract: A method of automatic defect classification (ADC) includes detecting defective parts from a substrate wherein at least one unit process is performed; and classifying defect types of the respective defective parts, wherein the classifying includes obtaining a scanning electron microscope (SEM) image of each of the defective parts; registering information about the substrate in a graphic data system (GDS) image corresponding to each SEM image; defining a plurality of defects of interest (DOIs) categorizing defects of the respective defective parts; defining a DOI rule that is a criterion for determining which defects of the respective defective parts correspond to which DOI from among the DOIs; and analyzing the image to classify which defects of the respective defective parts correspond to which DOI from among the DOIs according to the DOI rule.

Abstract: Provided is a wafer inspection apparatus using three-dimensional (3D) images, which apparatus may acquire a 3D image by adjusting a focal position at a high speed, and inspect a wafer by using the 3D image so that a 3D inspection operation may be precisely performed on patterns formed on the wafer at a high speed. The wafer inspection apparatus may include a stage on which a wafer is disposed, an optical apparatus configured to acquire an image of a pattern formed on the wafer by using a scan method, a focus adjusting unit configured to change a focal position of light irradiated to the wafer according to a scan speed of the optical apparatus, and an image processor configured to integrate images corresponding to focal positions and generate and analyze 3D images.

Abstract: A method of automatic defect classification (ADC) includes detecting defective parts from a substrate wherein at least one unit process is performed; and classifying defect types of the respective defective parts, wherein the classifying includes obtaining a scanning electron microscope (SEM) image of each of the defective parts; registering information about the substrate in a graphic data system (GDS) image corresponding to each SEM image; defining a plurality of defects of interest (DOIs) categorizing defects of the respective defective parts; defining a DOI rule that is a criterion for determining which defects of the respective defective parts correspond to which DOI from among the DOIs; and analyzing the image to classify which defects of the respective defective parts correspond to which DOI from among the DOIs according to the DOI rule.

Abstract: Methods of analyzing photolithography processes are provided. The methods may include obtaining an image from a pattern formed on a wafer and obtaining dimensions of the image. The methods may further include converting the dimensions into a profile graph and then dividing the profile graph into a low-frequency band profile graph and a high-frequency band profile graph.

Abstract: Apparatuses and methods for extracting defect depth information and methods of improving semiconductor device manufacturing processes using defect depth information are provided. The apparatuses may include an inspection assembly configured to obtain a plurality of optical images of a portion of an inspection object including a defect along a depth direction and a processor circuit configured to generate defect data using the plurality of optical images and provide defect depth information by comparing the defect data with comparison data in a library database.

Abstract: Provided are an apparatus and a method for estimating a depth of a buried defect in a substrate. The apparatus for estimating a depth of a buried defect in a substrate includes a light source providing a source of light, an aperture through which only a part of the source of light passes, a reflecting mirror receiving and reflecting the source of light that has passed through the aperture as a first light, a lens receiving and condensing the first light, the substrate receiving and reflecting the condensed first light as a second light, a light sensor receiving the second light and sensing a brightness of the second light, and a position adjustment portion adjusting a distance between the lens and the substrate.

Abstract: Methods of analyzing photolithography processes are provided. The methods may include obtaining an image from a pattern formed on a wafer and obtaining dimensions of the image. The methods may further include converting the dimensions into a profile graph and then dividing the profile graph into a low-frequency band profile graph and a high-frequency band profile graph.

Abstract: An apparatus and method for manufacturing ultra-fine particles using an electrospray device is disclosed. One or more capillary provided at its tip with a nozzle is positioned within a guide duct and precursors such as metal organic materials and metal halogen compounds, or nonvolatile substances or volatile substances are supplied to the capillary. Voltages are applied to the capillary and the guide duct, respectively, so that a voltage difference is generated therebetween and the highly charged liquid droplets from the capillary are sprayed. The sprayed liquid droplets are carried along the guide duct together with carrier gas injected into the guide duct. When heat energy is applied to the liquid droplets, chemical reactions of the liquid droplets occur. A collecting plate positioned in front of the guide duct collects ultra-fine particles formed by the chemical reactions.

Abstract: An apparatus and method for manufacturing particles using corona discharge is disclosed. A discharge electrode is provided within a guide duct and reaction gases are supplied into the guide duct. A high voltage is applied to the discharge electrode and a low voltage is applied to the guide duct to generate a voltage difference therebetween. When heat energy is applied to the reaction gases, chemical reactions occur in the gases and particles are made by the chemical reactions. The particles form new particles centering around ions as nuclei which are generated by corona discharge and moves along the guide duct. A collecting plate positioned in front of the guide duct collects the particles.

Abstract: An apparatus and method for manufacturing ultra-fine particles using an electrospray device is disclosed. One or more capillary provided at its tip with a nozzle is positioned within a guide duct and precursors such as metal organic materials and metal halogen compounds, or nonvolatile substances or volatile substances are supplied to the capillary. Voltages are applied to the capillary and the guide duct, respectively, so that a voltage difference is generated therebetween and the highly charged liquid droplets from the capillary are sprayed. The sprayed liquid droplets are carried along the guide duct together with carrier gas injected into the guide duct. When heat energy is applied to the liquid droplets, chemical reactions of the liquid droplets occur. A collecting plate positioned in front of the guide duct collects ultra-fine particles formed by the chemical reactions.

Abstract: An apparatus and method for manufacturing ultra-fine particles using an electrospray device is disclosed. One or more capillary provided at its tip with a nozzle is positioned within a guide duct and precursors such as metal organic materials and metal halogen compounds, or nonvolatile substances or volatile substances are supplied to the capillary. Voltages are applied to the capillary and the guide duct, respectively, so that a voltage difference is generated therebetween and the highly charged liquid droplets from the capillary are sprayed. The sprayed liquid droplets are carried along the guide duct together with carrier gas injected into the guide duct. When heat energy is applied to the liquid droplets, chemical reactions of the liquid droplets occur. A collecting plate positioned in front of the guide duct collects ultra-fine particles formed by the chemical reactions.

Abstract: A device for collecting dust using highly charged hyperfine liquid droplets formed through an electro-hydrodynamic atomization process is disclosed. In the dust collecting device of this invention, a high voltage is applied to capillaries, set within a dust guide duct and having nozzles at their tips. An electric field is thus formed between the capillaries and the duct, and allows the nozzles to spray highly charged hyperfine liquid droplets. Such liquid droplets absorb dust laden in air, flowing in the duct by suction force of a fan. An electrostatic dust collector is detachably coupled to the duct while being insulated from the duct, and forms an electric field having polarity opposite to that of the highly charged liquid droplets, thus electrostatically collecting and removing the dust absorbed by the highly charged liquid droplets. The dust collecting device of this invention easily and effectively removes fine dust having a size smaller than 0.1 cm.

Abstract: Disclosed is concrete comprising: a plurality of fiber rings for reinforcing a tensile strength of the concrete, each of the plurality of fiber rings forming a closed loop. The plurality of fiber rings included in concrete according to the present invention can remarkably increase a tensile strength of the concrete, are prevented from being entangled and poorly distributed, and do not hurt the human body and prevent an object from being damaged and thereby being broken.

Abstract: The present invention provides a method and apparatus for the manipulating computer-based representations of objects of complex and unique geometry. A computer acquires data describing an object and its surroundings, constructs a computer-based three dimensional model of the object from that data, superimposes an ideal geometry on the computer-based model, and alters the ideal geometry to fit the form and function required of the reproduction. The present invention presents two embodiments for manipulating computer-based representations of three dimensional objects.

Abstract: The present invention provides a method and apparatus for the automated reproduction of three dimensional objects of complex and unique geometry. A computer acquires data describing an object and its surroundings, constructs a computer-based three dimensional model of the object from that data, superimposes an ideal geometry on the computer-based model, alters the ideal geometry to fit the form and function required of the reproduction, and then guides a milling machine in the fabrication of the reproduction. In contrast to the prior art, the present invention does not require human intervention in the reproduction process. The present invention provides two preferred embodiments for the automated high precison reproduction of objects of complex and unique geometry. Both embodiments can machine reproductions solely from generic forms stored in the computer, thus eliminating the need for scanning.