Patents by Inventor Jeong Ho Lim

Jeong Ho Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9143710
    Abstract: The present invention relates to a sensor-integrated chip for a CCD camera in which a CCD sensor, an H/V driver for driving the CCD sensor, and an ISP (Image Signal Process) chip, which inputs a control signal for driving the CCD sensor to the H/V driver and allows a video to be displayed on a monitor (not shown) in response to an output signal from the CCD sensor, are stacked and connected with each other by inter-pad wire bonding into one IC package to be one chip, by an SIP (system In Package) method.
    Type: Grant
    Filed: April 21, 2012
    Date of Patent: September 22, 2015
    Assignee: SEMISOLUTION CO., LTD.
    Inventors: Jung Won Lee, Seok Yong Hong, Jeong Ho Lim
  • Publication number: 20150176729
    Abstract: A hydraulic tube for a vehicle may include a pipe having a pipe rib which may be formed integrally on and protrudes outward from a terminal end of the pipe, a connector fitted around the pipe such that the pipe extends through opposite ends of the connector, and a sealer fitted into a first end of the connector, a first end of the sealer being coupled with the terminal end of the pipe through coupling with the pipe rib, and a second end of the sealer being coupled with the first end of the connector.
    Type: Application
    Filed: September 17, 2014
    Publication date: June 25, 2015
    Applicants: Hyundai Motor Company, Hanil Tube Corp.
    Inventors: Bum Jun KIM, Min Keun KWON, Eun Sik KIM, Seong Hwa CHOO, Jeong Ho LIM
  • Publication number: 20140043513
    Abstract: The present invention relates to a sensor-integrated chip for a CCD camera in which a CCD sensor, an H/V driver for driving the CCD sensor, and an ISP (Image Signal Process) chip, which inputs a control signal for driving the CCD sensor to the H/V driver and allows a video to be displayed on a monitor (not shown) in response to an output signal from the CCD sensor, are stacked and connected with each other by inter-pad wire bonding into one IC package to be one chip, by an SIP (system In Package) method.
    Type: Application
    Filed: April 21, 2012
    Publication date: February 13, 2014
    Applicant: SEMISOLUTION CO., LTD.
    Inventors: Jung Won Lee, Seok Yong Hong, Jeong Ho Lim