Patents by Inventor Jeong Ho Yoon
Jeong Ho Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20060213603Abstract: The present invention relates to a multi-layer ceramic electronic component and production method thereof. According to the present invention, a method for manufacturing a multi-layer ceramic electronic component comprises forming a dielectric film; and forming a dielectric sheet simultaneously printed with an internal electrode and a dielectric between electrodes formed on the same plate with the internal electrode by spraying ink for the electrode and ink for the dielectric employing a plurality of inkjet print heads on the dielectric film. Thus, the multi-layer ceramic capacitor of the present invention resolves height difference by printing simultaneously a dielectric and an internal electrode.Type: ApplicationFiled: January 12, 2006Publication date: September 28, 2006Inventors: Kwi-Jong Lee, Jeong-Ho Yoon, Jae-Woo Joung
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Patent number: 6919748Abstract: An dielectric laminated filter improves a skirt characteristic to shift am attenuation pole to a transmitting frequency band while maintaining the same band width of the transmitting frequency band and includes a dielectric block laminated with a plurality of dielectric sheets, ground electrodes formed on front and rear sides of the dielectric block, input and output electrodes formed on both sides of the dielectric body to be separated from the ground electrodes, an inductor pattern having two portions disposed parallel to the resonator patterns coupled to the input and output electrodes and a connecting portion coupling the two portions to induce an inductance coupling with the resonator patterns coupled to the input and output electrodes to improve a filter response characteristic by adjusting the inductance coupling.Type: GrantFiled: March 4, 2003Date of Patent: July 19, 2005Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Byoung Hwa Lee, Nam Chul Kim, Jeong Ho Yoon, Sang Soo Park
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Patent number: 6914512Abstract: A 3-line balun transformer includes an unbalanced port for an unbalanced signal, first and second balanced ports for balanced signals, the balanced signals being the same in level and 180 degrees out of phase with each other, a first line having its first end connected to the unbalanced port and its second end connected to ground, a second line arranged in parallel with the first line while being spaced apart from the first line, the second line having its first end and its second end connected to the first balanced port, and a third line arranged in parallel with the second line while being spaced apart from the second, the third line having its first end connected to the first end of the second line and its second end connected to the second balanced port.Type: GrantFiled: June 16, 2003Date of Patent: July 5, 2005Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Dong Seok Park, Nam Chul Kim, Jeong Ho Yoon, Byoung Hwa Lee, Sang Soo Park
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Patent number: 6903643Abstract: A balun transformer includes a structure with three .lambda./4 strip lines for converting an unbalanced signal in an unbalanced transmission line into a balanced signal in a balanced transmission line. The balun transformer includes a first dielectric sheet on which a first strip line provided, a second dielectric sheet placed under the first dielectric sheet and on which a second strip line electro-magnetically coupled to the first strip line is provided, a third dielectric sheet placed under the second dielectric sheet and on which a ground pattern is provided, and a fourth dielectric sheet placed under the third dielectric sheet and on which a third strip line is provided. The balun transformer includes the reduced number of strip lines in comparison with the conventional laminated balun transformer, so that the production cost is reduced.Type: GrantFiled: June 17, 2003Date of Patent: June 7, 2005Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Byoung Hwa Lee, Nam Chul Kim, Jeong Ho Yoon, Sang Soo Park, Dong Seok Park
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Patent number: 6885259Abstract: Disclosed is a matching circuit of a laminated duplexer connected to an antenna terminal while being connected between transmitting and receiving filters to match the transmitting and receiving filters with the antenna terminal, the matching circuit being configured to reduce the physical length of each conductor pattern thereof, thereby being capable of achieving an improved miniaturization thereof. The matching circuit includes a transmitting matching unit constituted by a conductor pattern electrically connected to an antenna electrode connected to the antenna terminal while being electrically connected to the transmitting filter, a first ground electrode vertically spaced apart from the conductor pattern, a receiving matching unit constituted by a conductor pattern electrically connected to the antenna electrode and the receiving filter, and a second ground electrode vertically spaced apart from the conductor pattern of the receiving matching unit.Type: GrantFiled: July 22, 2003Date of Patent: April 26, 2005Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Byoung Hwa Lee, Nam Chul Kim, James Mike Peters, Myung Pyo Jun, Jeong Ho Yoon, Ian Lee, Dong Seok Park, Sang Soo Park
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Publication number: 20040227584Abstract: Disclosed is a matching circuit of a laminated duplexer connected to an antenna terminal while being connected between transmitting and receiving filters to match the transmitting and receiving filters with the antenna terminal, the matching circuit being configured to reduce the physical length of each conductor pattern thereof, thereby being capable of achieving an improved miniaturization thereof. The matching circuit includes a transmitting matching unit constituted by a conductor pattern electrically connected to an antenna electrode connected to the antenna terminal while being electrically connected to the transmitting filter, a first ground electrode vertically spaced apart from the conductor pattern, a receiving matching unit constituted by a conductor pattern electrically connected to the antenna electrode and the receiving filter, and a second ground electrode vertically spaced apart from the conductor pattern of the receiving matching unit.Type: ApplicationFiled: July 22, 2003Publication date: November 18, 2004Inventors: Byoung Hwa Lee, Nam Chul Kim, James Mike Peters, Myung Pyo Jun, Jeong Ho Yoon, Ian Lee, Dong Seok Park, Sang Soo Park
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Publication number: 20040119573Abstract: This invention discloses a laminated balun transformer realized by a structure with three &lgr;/4 strip lines for converting an unbalanced signal in an unbalanced transmission line into a balanced signal in a balanced transmission line. Disclosed is a laminated balun transformer comprising a first dielectric sheet on which a first strip line is provided, a second dielectric sheet placed under the first dielectric sheet and on which a second strip line electro-magnetically coupled to the first strip line is provided, a third dielectric sheet placed under the second dielectric sheet and on which a ground pattern is provided, and a fourth dielectric sheet placed under the third dielectric sheet and on which a third strip line is provided. The laminated balun transformer in accordance with the present invention includes the reduced number of strip lines in comparison with the convention laminated balun transformer, so that the production cost thereof is reduced.Type: ApplicationFiled: June 17, 2003Publication date: June 24, 2004Inventors: Byoung Hwa Lee, Nam Chul Kim, Jeong Ho Yoon, Sang Soo Park, Dong Seok Park
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Publication number: 20040061581Abstract: A 3-line balun transformer which has a simple structure and is easy to design and manufacture. The balun transformer comprises an unbalanced port for inputting or outputting an unbalanced signal, first and second balanced ports for outputting or inputting balanced signals, respectively, the balanced signals being the same in level and 180 degrees out of phase with each other, a first line having its first end connected to the unbalanced port and its second end connected to ground, a second line arranged in parallel with the first line while being spaced apart from the first line by a predetermined distance, the second line having its first end and its second end connected to the first balanced port, and a third line arranged in parallel with the second line while being spaced apart from the second line by a predetermined distance, the third line having its first end connected to the first end of the second line and its second end connected to the second balanced port.Type: ApplicationFiled: June 16, 2003Publication date: April 1, 2004Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Dong Seok Park, Nam Chul Kim, Jeong Ho Yoon, Byoung Hwa Lee, Sang Soo Park
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Patent number: 6714101Abstract: Disclosed herein is an array type noise reduction filter. The array type noise reduction filter has a plurality of noise reduction filters horizontally arranged within a single chip. A plurality of noise reduction filters each have an inductance portion, a ground portion, and a capacitance portion. The inductance portion is comprised of first and second coils approximately vertically connected in the chip. The ground portion is arranged over or under the inductance portion. The capacitance portion is arranged over or under the ground portion. A second coil of any inductance portion is constructed to be wound in a direction opposite to a second coil of another adjacent inductance portion.Type: GrantFiled: January 25, 2002Date of Patent: March 30, 2004Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Byung Taek Kim, Jeong Ho Yoon, Byeung Gyu Chang, Dae Hyeong Lee, Min Cheol Park, Moon Soo Park
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Patent number: 6703677Abstract: Disclosed is a submount integrated photodiode package with an improved metal layer configuration and laser diode package using the same. In particular, a unitary laser diode of the invention provides a light receiving area overlying a semiconductor substrate to correspond to a radiation area of light emitted from a laser diode so as to reduce chip size in respect to a conventional one while maintaining a monitoring current identical to the conventional one as well as improve heat-radiating features. The invention provides a unitary laser diode package which comprises a light receiving area overlying a semiconductor substrate and having the same configuration as a radiation area of emission light from the laser diode and a metal layer adjacent to the light receiving area.Type: GrantFiled: August 30, 2002Date of Patent: March 9, 2004Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Kyung Ho Lee, Jeong Ho Yoon, Bang Won Oh, Si Young Yang, Jong Hwa Lee
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Publication number: 20030232485Abstract: Disclosed is a submount integrated photodiode package with an improved metal layer configuration and laser diode package using the same. In particular, a unitary laser diode of the invention provides a light receiving area overlying a semiconductor substrate to correspond to a radiation area of light emitted from a laser diode so as to reduce chip size in respect to a conventional one while maintaining a monitoring current identical to the conventional one as well as improve heat-radiating features. The invention provides a unitary laser diode package which comprises a light receiving area overlying a semiconductor substrate and having the same configuration as a radiation area of emission light from the laser diode and a metal layer adjacent to the light receiving area.Type: ApplicationFiled: August 30, 2002Publication date: December 18, 2003Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Kyung Ho Lee, Jeong Ho Yoon, Bang Won Oh, Si Young Yang, Jong Hwa Lee
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Publication number: 20030201847Abstract: An dielectric laminated filter improves a skirt characteristic to shift am attenuation pole to a transmitting frequency band while maintaining the same band width of the transmitting frequency band and includes a dielectric block laminated with a plurality of dielectric sheets, ground electrodes formed on front and rear sides of the dielectric block, input and output electrodes formed on both sides of the dielectric body to be separated from the ground electrodes, an inductor pattern having two portions disposed parallel to the resonator patterns coupled to the input and output electrodes and a connecting portion coupling the two portions to induce an inductance coupling with the resonator patterns coupled to the input and output electrodes to improve a filter response characteristic by adjusting the inductance coupling.Type: ApplicationFiled: March 4, 2003Publication date: October 30, 2003Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Byoung Hwa Lee, Nam Chul Kim, Jeong Ho Yoon, Sang Soo Park
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Publication number: 20030085777Abstract: Disclosed herein is an array type noise reduction filter. The array type noise reduction filter has a plurality of noise reduction filters horizontally arranged within a single chip. A plurality of noise reduction filters each have an inductance portion, a ground portion, and a capacitance portion. The inductance portion is comprised of first and second coils approximately vertically connected in the chip. The ground portion is arranged over or under the inductance portion. The capacitance portion is arranged over or under the ground portion. A second coil of any inductance portion is constructed to be wound in a direction opposite to a second coil of another adjacent inductance portion.Type: ApplicationFiled: January 25, 2002Publication date: May 8, 2003Applicant: Samsung Electro-Mechanics Co. Ltd.Inventors: Byung Taek Kim, Jeong Ho Yoon, Byeung Gyu Chang, Dae Hyeong Lee, Min Cheol Park, Moon Soo Park
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Publication number: 20030085776Abstract: Disclosed herein is an array type noise reduction filter. The array type noise reduction filter has a plurality of noise reduction filters horizontally arranged within a single chip. A plurality of noise reduction filters each have a conductor layer and an inductance portion. The conductor layer is comprised of a ground portion arranged at approximately the center portion within the chip, and at least one capacitance portion arranged at at least one position over or under the ground portion. The inductance portion is arranged over or under the conductor layer. An inductance portion of another noise reduction filter adjacent to a noise reduction filter having an inductance portion arranged over the conductor layer is arranged under the conductor layer.Type: ApplicationFiled: January 25, 2002Publication date: May 8, 2003Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Byung Taek Kim, Jeong Ho Yoon, Sung Yeol Park, Min Kyu Park, Min Cheol Park