Abstract: Disclosed are a composition for coating a photoresist pattern and a method for forming a fine pattern using the same. The composition for coating a photoresist pattern includes a polymer compound containing a hydroxyl group and an ammonium base, and a solvent. The method for forming a fine pattern includes coating the composition on a previously formed photoresist pattern to thereby effectively reduce the size of a photoresist contact hole or space, and can be used in all semiconductor processes in which a fine pattern is required to be formed.

Abstract: A semiconductor integrated circuit device and a method of manufacturing the same are disclosed. A semiconductor wafer having a surface step is prepared. A first material layer is formed on an upper surface of the semiconductor wafer so that a protrusion is formed in a portion thereof corresponding to an edge region of the semiconductor wafer. A second material layer is formed on the first material layer.

Abstract: A semiconductor integrated circuit device and a method of manufacturing the same are disclosed. A semiconductor wafer having a surface step is prepared. A first material layer is formed on an upper surface of the semiconductor wafer so that a protrusion is formed in a portion thereof corresponding to an edge region of the semiconductor wafer. A second material layer is formed on the first material layer.

Abstract: Disclosed are a composition for coating a photoresist pattern and a method for forming a fine pattern using the same. The composition for coating a photoresist pattern includes a polymer compound containing a hydroxyl group and an ammonium base, and a solvent The method for forming a fine pattern includes coating the composition on a previously formed photoresist pattern to thereby effectively reduce the size of a photoresist contact hole or space, and can be used in all semiconductor processes in which a fine pattern is required to be formed.

Abstract: Disclosed are a composition for coating a photoresist pattern and a method for forming a fine pattern using the same. The composition for coating a photoresist pattern includes an ammonium base-containing polymer compound and a solvent. The method for forming a fine pattern includes coating the composition on a previously formed photoresist pattern to thereby effectively reduce the size of a photoresist contact hole or space, and can be used in all semiconductor processes in which a fine pattern is required to be formed.

Abstract: Disclosed is method and apparatus for supplying fuel of LPG car having LPI system. More particularly, the present invention generates a gas fuel injection signal based on a gasoline fuel injection signal and directly injects LPG fuel within a fuel tank to a combustion chamber using the generated gas fuel injection signal to drive an engine. Therefore, an engine can be easily changed, the manufacturing cost of a duel car of LPG and gasoline can be reduced, and the manufacturing process thereof can be simplified.

Abstract: A wafer processing method for improving gettering capabilities of wafers made therefrom is presented. The method includes the steps of preparing, annealing and ion-implanting. The preparing step involves preparing the wafer from a silicon ingot. The annealing step involves forming first gettering sites in both sides of the wafer by annealing the wafer. The ion-implanting step involves forming second gettering sites in a back side of the wafer in which the first gettering sites are already formed.

Abstract: A wafer processing method for improving gettering capabilities of wafers made therefrom is presented. The method includes the steps of preparing, annealing and ion-implanting. The preparing step involves preparing the wafer from a silicon ingot. The annealing step involves forming first gettering sites in both sides of the wafer by annealing the wafer. The ion-implanting step involves forming second gettering sites in a back side of the wafer in which the first gettering sites are already formed.

Abstract: Disclosed is method and apparatus for supplying fuel of LPG car having LPI system. More particularly, the present invention generates a gas fuel injection signal based on a gasoline fuel injection signal and directly injects LPG fuel within a fuel tank to a combustion chamber using the generated gas fuel injection signal to drive an engine. Therefore, an engine can be easily changed, the manufacturing cost of a duel car of LPG and gasoline can be reduced, and the manufacturing process thereof can be simplified.

Abstract: Embodiments of the present invention provide methods for measuring a wafer surface. A portion of the wafer surface is measured using a particle counter to provide first measurements corresponding to a plurality of points on the wafer surface. A selected area of the wafer surface including one of the plurality of points is measured using an atomic force microscope (AFM) to provide a microroughness measurement of the selected area. The selected area is a localized area of the portion of the wafer surface measured using the particle counter. The first measurements and the microroughness measurement are provided as a measurement of the wafer surface. The portion measured using a particle counter may, for example, be substantially the entire wafer surface.

Abstract: Semiconductor wafers are packed by providing a carrying device that holds one or more semiconductor wafers. The carrying device is inserted into a packing bag and the packing bag is molded using at least a portion of the external form of the carrying device as a guide such that a portion of the packing bag substantially conforms to the portion of the external form of the carrying device. Thus, wafers may be packaged without using a vacuum while still inhibiting contamination from particles and the formation of haze on the surface of the wafers.