Patents by Inventor Jeong-Hoon Seol

Jeong-Hoon Seol has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrode Manufacturing Device
    Publication number: 20240170636
    Abstract: An electrode manufacturing device that applies pressure to an electrode containing a coating part and a non-coating part is provided. The electrode manufacturing device includes: a first pressure roll that applies pressure to the non-coating part; a second pressure roll that applies pressure to the coating part; and a connection part that penetrates through the center of the first pressure roll and the center of the second pressure roll, respectively, wherein a difference between a radius of the first pressure roll and a radius of the second pressure roll is equal to or smaller than a step difference between the coating part and the non-coating part.
    Type: Application
    Filed: October 6, 2022
    Publication date: May 23, 2024
    Applicant: LG Energy Solution, Ltd.
    Inventors: Won Seob Song, Hwan Han Kim, Sang Hoon Choy, Jeong Soo Seol, Bumhyuk Lee
  • Method of manufacturing printed circuit board
    Patent number: 9173300
    Abstract: A method of manufacturing a printed circuit board (PCB) and the PCB are provided. The method includes: filling a resin in a via-hole formed at a substrate from one surface side of the substrate; emitting light for a predetermined period of time to the resin filled in the via-hole from the other surface side of the substrate; and applying another resin on the other surface of the substrate.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: October 27, 2015
    Assignee: HAESUNG DS CO., LTD
    Inventors: Jeong-Hoon Seol, Youn-Kwon Jung, Sang-Kun Kim
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20130313009
    Abstract: A method of manufacturing a printed circuit board (PCB) and the PCB are provided. The method includes: filling a resin in a via-hole formed at a substrate from one surface side of the substrate; emitting light for a predetermined period of time to the resin filled in the via-hole from the other surface side of the substrate; and applying another resin on the other surface of the substrate.
    Type: Application
    Filed: September 5, 2012
    Publication date: November 28, 2013
    Applicant: SAMSUNG TECHWIN CO., LTD.
    Inventors: Jeong-Hoon Seol, Youn-Kwon Jung, Sang-Kun Kim