Patents by Inventor Jeong Hwan IM

Jeong Hwan IM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240382844
    Abstract: The present invention relates to a game server resource management system, a method, and a recording medium storing programs that execute the method, and the method includes providing a client program to a connected client terminal; and providing player information to generate a virtual game environment and execute game play through a player by the client terminal, wherein the client program may include a matching table between a real environment to which a game service user belongs and the generated game environment, and when the user runs the game, the client terminal may generate a virtual game environment based on the matching table. According to the present invention, unnecessary server usage costs and communication costs due to server calls can be reduced, and resource management for the server can be performed efficiently.
    Type: Application
    Filed: May 15, 2024
    Publication date: November 21, 2024
    Applicant: FUNNY STORM
    Inventors: Chunggil YU, Jeong-Hwan IM
  • Publication number: 20240382830
    Abstract: Disclosed are a system and a method of space movement in a game, and a recording medium storing a program executing the method, and the method includes: providing an accessed client terminal with a client program for executing a game; and when receiving a portal designation request for a target place in an activity area of a game space during game execution from the client terminal, storing information including a location value for the target place determined from a GPS value of the client terminal as portal information, and when a user selects a specific portal for movement during game execution, causing a game space to be moved to a target place by using the portal information and providing a game environment configuration linked to real-world environmental information of the real world corresponding to the location value of the target place.
    Type: Application
    Filed: May 15, 2024
    Publication date: November 21, 2024
    Applicant: FUNNY STORM
    Inventors: Chunggil YU, Jeong-Hwan IM
  • Publication number: 20240382831
    Abstract: Disclosed are a system and a method of providing a game by utilizing real-world environmental information, and a recording medium storing a program executing the method, which provide an accessed client terminal with a client program and cause an interaction available game environment configuration linked to current real-world environmental information to be executed through the client program. According to the present disclosure, various real-world environment elements obtained through GPS information, environment-related APIs, and the like may be applied to the game environment configuration to enable a user to play a game while interacting with the game environment configuration, thereby improving connection with the real-world environment, and providing users with various game experiences according to changes in the real-world environment.
    Type: Application
    Filed: May 15, 2024
    Publication date: November 21, 2024
    Applicant: FUNNY STORM
    Inventors: Chunggil YU, Jeong-Hwan IM
  • Patent number: 10593465
    Abstract: A multilayer chip bead includes: a body including a coil portion and cover layers disposed on upper and lower surfaces of the coil portion; first and second external electrodes disposed on external surfaces of the body; and a coil disposed in the coil portion, including coil patterns having a spiral shape and lead patterns, and having both end portions connected to the first and second external electrodes, respectively, through the lead patterns. A width of the lead pattern is smaller than that of the coil pattern.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: March 17, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Jin Ha, Hyun Ju Jung, Jeong Hwan Im, So Young Jun, Sung Jin Park
  • Publication number: 20190013121
    Abstract: A multilayer bead includes a body in which a plurality of ceramic layers are stacked; a plurality of internal electrode patterns formed on the plurality of ceramic layers; and first and second external electrodes formed on both end surfaces of the body and electrically connected to both ends of an internal coil formed by a combination of the plurality of internal electrode patterns, respectively. A stacking direction of the plurality of ceramic layers is parallel to both end surfaces of the body on which the first and second external electrodes are formed, and a coil axis of the internal coil is parallel to a mounting surface of the body. A board having the multilayer bead may be provided.
    Type: Application
    Filed: November 28, 2017
    Publication date: January 10, 2019
    Inventors: Young Jin HA, Jeong Hwan IM, So Young JUN, Sung Jin PARK
  • Publication number: 20180308617
    Abstract: A multilayer chip bead includes: a body including a coil portion and cover layers disposed on upper and lower surfaces of the coil portion; first and second external electrodes disposed on external surfaces of the body; and a coil disposed in the coil portion, including coil patterns having a spiral shape and lead patterns, and having both end portions connected to the first and second external electrodes, respectively, through the lead patterns. A width of the lead pattern is smaller than that of the coil pattern.
    Type: Application
    Filed: September 19, 2017
    Publication date: October 25, 2018
    Inventors: Young Jin HA, Hyun Ju JUNG, Jeong Hwan IM, So Young JUN, Sung Jin PARK
  • Patent number: 9412509
    Abstract: A multilayer electronic component may include: a multilayer body including a plurality of insulating layers; an internal coil part provided by electrically connecting respective conductive patterns disposed on the plurality of insulating layers to each other; and first and second external electrodes disposed on both end surfaces of the multilayer body, respectively. A perimeter of at least one conductive pattern disposed in peripheral regions of the multilayer body may be smaller than a perimeter of a conductive pattern disposed in a central region of the multilayer body.
    Type: Grant
    Filed: October 1, 2014
    Date of Patent: August 9, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Hwan Im, So Young Jun, Hyun Ju Jung, Sung Jin Park, Young Jin Ha
  • Publication number: 20160005526
    Abstract: A multilayer inductor may include a multilayer body in which a plurality of insulating layers are stacked and of which a thickness is greater than a width; and an internal coil part formed by electrically connecting a plurality of internal coil patterns disposed on the plurality of insulating layers to each other. Side surfaces of the multilayer body opposing each other in a width direction are concave.
    Type: Application
    Filed: October 3, 2014
    Publication date: January 7, 2016
    Inventors: Jeong Hwan IM, Young Jin HA
  • Publication number: 20150371755
    Abstract: A multilayer electronic component may include: a multilayer body including a plurality of insulating layers; an internal coil part provided by electrically connecting respective conductive patterns disposed on the plurality of insulating layers to each other; and first and second external electrodes disposed on both end surfaces of the multilayer body, respectively. A perimeter of at least one conductive pattern disposed in peripheral regions of the multilayer body may be smaller than a perimeter of a conductive pattern disposed in a central region of the multilayer body.
    Type: Application
    Filed: October 1, 2014
    Publication date: December 24, 2015
    Inventors: Jeong Hwan IM, So Young JUN, Hyun Ju JUNG, Sung Jin PARK, Young Jin HA
  • Publication number: 20150371754
    Abstract: A multilayer inductor may include: a multilayer body including a plurality of insulation layers stacked therein and having a thickness greater than a width thereof; and an internal coil part formed in the multilayer body by electrically connecting a plurality of internal coil patterns disposed on the plurality of insulation layers. The internal coil part may be disposed to be biased toward one portion of the multilayer body from a central portion of the multilayer body in a thickness direction.
    Type: Application
    Filed: October 1, 2014
    Publication date: December 24, 2015
    Inventors: Jeong Hwan IM, Young Jin Ha