Patents by Inventor Jeong Hyeon SIM

Jeong Hyeon SIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11637396
    Abstract: An electrical connector assembly has a moving plate for protecting a terminal, which may easily separate the moving plate from a male plate for a rework operation for realigning a terminal pin without damage and may decrease a force when a female connector is inserted into and fastened to the male connector to push the moving plate. This improves the quality by reducing the difficulty when the female connector is inserted into and fastened to the male connector and improves a locking projection structure of the female connector such that the moving plate may easily return to the original location at all times when the female connector is separated.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: April 25, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, YURA CO., LTD, YURA CORPORATION CO., LTD.
    Inventors: Sam Gyun Lee, Jeong Hyeon Sim, Young Ho Jo, Hae Sung Park
  • Publication number: 20220149558
    Abstract: An electrical connector assembly has a moving plate for protecting a terminal, which may easily separate the moving plate from a male plate for a rework operation for realigning a terminal pin without damage and may decrease a force when a female connector is inserted into and fastened to the male connector to push the moving plate. This improves the quality by reducing the difficulty when the female connector is inserted into and fastened to the male connector and improves a locking projection structure of the female connector such that the moving plate may easily return to the original location at all times when the female connector is separated.
    Type: Application
    Filed: July 15, 2021
    Publication date: May 12, 2022
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, YURA CO., LTD, YURA CORPORATION CO., LTD.
    Inventors: Sam Gyun Lee, Jeong Hyeon Sim, Young Ho Jo, Hae Sung Park
  • Patent number: 9570207
    Abstract: Disclosed are electrical contact materials and a method for preparing the same. The electrical contact material includes (i) one or more kinds of metals selected from the group consisting of silver (Ag), copper (Cu) and gold (Au), and an alloy of nickel (Ni); and (ii) carbon nano tubes (CNTs) coated with Ag nanoparticles, Ag plated CNTs, or Ag nanowires, or (i) one or more kinds of metals selected from the group consisting of Ag, Cu, Ni and Au; (ii) a metal oxide that is cadmium oxide, indium oxide, tin oxide, zinc oxide or mixture thereof; and (iii) CNTs coated with Ag nanoparticles, Ag plated CNTs, or Ag nanowires. Accordingly, it is possible to reduce the content of high-priced Ag and to obtain excellent electrical and mechanical properties.
    Type: Grant
    Filed: November 6, 2014
    Date of Patent: February 14, 2017
    Assignees: LSIS CO., LTD., Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
    Inventors: Ki Hun Park, In Chan Song, Seung Hyun Baik, Dong Mok Lee, Jeong Hyeon Sim
  • Publication number: 20150155066
    Abstract: Disclosed are electrical contact materials and a method for preparing the same. The electrical contact material includes (i) one or more kinds of metals selected from the group consisting of silver (Ag), copper (Cu) and gold (Au), and an alloy of nickel (Ni); and (ii) carbon nano tubes (CNTs) coated with Ag nanoparticles, Ag plated CNTs, or Ag nanowires, or (i) one or more kinds of metals selected from the group consisting of Ag, Cu, Ni and Au; (ii) a metal oxide that is cadmium oxide, indium oxide, tin oxide, zinc oxide or mixture thereof; and (iii) CNTs coated with Ag nanoparticles, Ag plated CNTs, or Ag nanowires. Accordingly, it is possible to reduce the content of high-priced Ag and to obtain excellent electrical and mechanical properties.
    Type: Application
    Filed: November 6, 2014
    Publication date: June 4, 2015
    Applicants: LSIS CO., LTD., Research & Business Foundation SUNGKYUNKWAN UNIVERSITY
    Inventors: Ki Hun PARK, In Chan SONG, Seung Hyun BAIK, Dong Mok LEE, Jeong Hyeon SIM