Patents by Inventor Jeong In CHO

Jeong In CHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12006429
    Abstract: The present invention provides a thermoplastic resin composition which includes: a first copolymer including a core including a conjugated diene-based polymer and a shell including an aromatic vinyl-based monomer unit and a vinyl cyan-based monomer unit; and a second copolymer including an aromatic vinyl-based monomer unit and a vinyl cyan-based monomer unit, wherein the first copolymer has a degree of grafting of 32 to 50%, the second copolymer has a weight-average molecular weight of 85,000 to 115,000 g/mol, and the thermoplastic resin composition includes the first copolymer at 30 wt % or less and an oligomer residue at 1.1 wt % or less. Specifically, the thermoplastic resin composition can shorten an injection molding time.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: June 11, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Seo Hwa Kim, Byoung Il Kang, Eun Jung Choi, Taek Jun Jung, Jeong In Cho, Dong Kun Shin
  • Publication number: 20210238407
    Abstract: The present invention provides a thermoplastic resin composition which includes: a first copolymer including a core including a conjugated diene-based polymer and a shell including an aromatic vinyl-based monomer unit and a vinyl cyan-based monomer unit; and a second copolymer including an aromatic vinyl-based monomer unit and a vinyl cyan-based monomer unit, wherein the first copolymer has a degree of grafting of 32 to 50%, the second copolymer has a weight-average molecular weight of 85,000 to 115,000 g/mol, and the thermoplastic resin composition includes the first copolymer at 30 wt % or less and an oligomer residue at 1.1 wt % or less. Specifically, the thermoplastic resin composition can shorten an injection molding time.
    Type: Application
    Filed: September 11, 2019
    Publication date: August 5, 2021
    Inventors: Seo Hwa KIM, Byoung Il KANG, Eun Jung CHOI, Taek Jun JUNG, Jeong In CHO, Dong Kun SHIN