Patents by Inventor Jeong Ki Ryoo
Jeong Ki Ryoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11881642Abstract: An antenna apparatus includes a dielectric layer; a patch antenna pattern disposed on an upper surface of the dielectric layer and including an upper surface having a polygonal shape, a plurality of feed vias respectively disposed to penetrate the dielectric layer by at least a portion of a thickness of the dielectric layer, respectively disposed to be biased toward a first side and a second side, different from each other, from a center of the polygonal shape of the patch antenna pattern, and respectively disposed to be spaced apart from the patch antenna pattern, and a plurality of feed patterns respectively electrically connected to an upper end of a corresponding feed via, among the plurality of feed vias, respectively disposed to be spaced apart from the patch antenna pattern, and configured to provide a feed path to the patch antenna pattern, wherein the polygonal shape of the patch antenna pattern has a structure in which the first side and a third side between the first and second sides form an obtuseType: GrantFiled: September 16, 2020Date of Patent: January 23, 2024Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Nam Ki Kim, Jeong Ki Ryoo, Won Cheol Lee, Jae Min Keum, Dong Ok Ko, Shin Haeng Heo
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Patent number: 11855355Abstract: An antenna apparatus includes a patch antenna pattern; a first feed via to feed power to the patch antenna pattern in a non-contact manner on a first side of the patch antenna pattern; and a plurality of feed patterns disposed on the first side of the patch antenna pattern on different levels and overlapping each other, and including at least one feed pattern that is electrically connected to the first feed via, and each having a width greater than a width of the first feed via and a cross-sectional area smaller than a cross-sectional area of the patch antenna pattern.Type: GrantFiled: December 29, 2021Date of Patent: December 26, 2023Assignees: Samsung Electro-Mechanics Co., Ltd., Seoul National University R&DB FoundationInventors: Ju Hyoung Park, Jung Woo Seo, Jung Suek Oh, Jeong Ki Ryoo, Kyu Bum Han
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Patent number: 11777219Abstract: An antenna apparatus includes a dielectric layer; a patch antenna pattern disposed on an upper surface of the dielectric layer and including an upper surface having a polygonal shape, a plurality of feed vias respectively disposed to penetrate the dielectric layer by at least a portion of a thickness of the dielectric layer, respectively disposed to be biased toward a first side and a second side, different from each other, from a center of the polygonal shape of the patch antenna pattern, and respectively disposed to be spaced apart from the patch antenna pattern, and a plurality of feed patterns respectively electrically connected to an upper end of a corresponding feed via, among the plurality of feed vias, respectively disposed to be spaced apart from the patch antenna pattern, and configured to provide a feed path to the patch antenna pattern, wherein the polygonal shape of the patch antenna pattern has a structure in which the first side and a third side between the first and second sides form an obtuseType: GrantFiled: April 22, 2020Date of Patent: October 3, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Nam Ki Kim, Jeong Ki Ryoo, Won Cheol Lee, Jae Min Keum, Dong Ok Ko, Shin Haeng Heo
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Patent number: 11764483Abstract: An antenna apparatus includes a ground plane, a patch antenna pattern disposed on an upper surface of the ground plane, a feed via penetrating the ground plane and spaced apart from the patch antenna pattern, and a coiled feed pattern electrically connected to an upper end of the feed via, spaced apart from the patch antenna pattern, and configured to provide a feed path to the patch antenna pattern, wherein at least a portion of the coiled feed pattern is coiled, wherein the patch antenna pattern includes an aperture portion corresponding to the coiled feed pattern.Type: GrantFiled: June 29, 2020Date of Patent: September 19, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Won Cheol Lee, Jeong Ki Ryoo, Nam Ki Kim, Jae Min Keum, Dong Ok Ko, Shin Haeng Heo
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Patent number: 11721913Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.Type: GrantFiled: August 11, 2021Date of Patent: August 8, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong Kim, Sung Nam Cho, Ju Hyoung Park, Jeong Ki Ryoo, Kyu Bum Han, Sung Yong An
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Patent number: 11699855Abstract: An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.Type: GrantFiled: February 19, 2021Date of Patent: July 11, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Kyung In Kang, Jeong Ki Ryoo, Kyu Bum Han
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Patent number: 11670857Abstract: An antenna apparatus includes a first patch antenna pattern comprising a through-hole, a second patch antenna pattern disposed above the first patch antenna pattern and spaced apart from the first patch antenna pattern, a first feed via electrically connected to the first patch antenna pattern, a second feed via penetrating through the through-hole of the first patch antenna pattern, and a feed pattern disposed between the first patch antenna pattern and the second patch antenna pattern, and having one end connected to the second feed via, and another end connected to the second patch antenna pattern at a point closer to an edge of the second patch antenna pattern than the second feed.Type: GrantFiled: September 13, 2021Date of Patent: June 6, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Won Cheol Lee, Nam Ki Kim, Jae Min Keum, Jeong Ki Ryoo
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Patent number: 11658425Abstract: An antenna apparatus includes a ground plane, a plurality of first patch antenna patterns arranged on a level higher than the ground plane and each configured to transmit and/or receive a first radio frequency signal of a first frequency, a plurality of second patch antenna patterns arranged on a level higher than the ground plane and each having a size smaller than a size of each of the first patch antenna patterns, wherein the plurality of second patch antenna patterns include at least one feed patch antenna pattern configured to transmit and/or receive a second radio frequency signal of a second frequency different from the first frequency, and at least one dummy patch antenna pattern which is not fed any of the first and second radio frequency signals.Type: GrantFiled: March 7, 2022Date of Patent: May 23, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Won Cheol Lee, Jeong Ki Ryoo, Nam Ki Kim, Myeong Woo Han, Sang Hyun Kim
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Patent number: 11658420Abstract: An antenna apparatus includes first dipole antenna patterns, feed lines, a first ground plane, and a first blocking pattern. The feed lines are connected to corresponding ones of the first dipole antenna patterns. The first ground plane is disposed on a side of the first dipole antenna patterns and spaced apart from each of the first dipole antenna patterns. The first blocking pattern, connected to and extending from the first ground plane, is disposed between adjacent ones of the first dipole antenna patterns.Type: GrantFiled: September 16, 2020Date of Patent: May 23, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Nam Ki Kim, Jeong Ki Ryoo, Kyu Bum Han, Young Kyoon Im
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Patent number: 11646496Abstract: An antenna apparatus includes a feed via, a patch antenna pattern which is electrically connected to a first end of the feed via, a plurality of first conductive array patterns, respectively disposed to be spaced apart from the patch antenna pattern and arranged to correspond to at least a portion of a side boundary of the patch antenna pattern, and a first conductive ring pattern spaced apart from the patch antenna pattern and the plurality of conductive array patterns and configured to surround the patch antenna pattern and the plurality of conductive array patterns.Type: GrantFiled: November 23, 2020Date of Patent: May 9, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Nam Ki Kim, Ju Hyoung Park, Jeong Ki Ryoo, Myeong Woo Han, Dae Ki Lim
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Patent number: 11646503Abstract: An antenna apparatus may include: first patch antenna patterns arrayed in an N×1 structure, the first patch antenna patterns each having a polygonal shape having an oblique side with respect to an array direction of the N×1 structure; feed vias electrically connected to the first patch antenna patterns; and guide vias arrayed along the oblique side, wherein N is a natural number greater than or equal to 2.Type: GrantFiled: October 23, 2019Date of Patent: May 9, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Dae Ki Lim, Nam Ki Kim, Myeong Woo Han, Jeong Ki Ryoo, Ju Hyoung Park, Won Cheol Lee
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Patent number: 11616287Abstract: An antenna apparatus includes a ground pattern having a through-hole; an antenna pattern disposed above the ground pattern and configured to either one or both of transmit and receive a radio-frequency (RF) signal; a feed via penetrating through the through-hole and having one end electrically connected to the antenna pattern; and a meta member comprising a plurality of cells repeatedly arranged and spaced apart from each other, each of the plurality of cells comprising a plurality of conductive patterns, and at least one conductive via electrically connecting the plurality of conductive patterns to each other, wherein the meta member is disposed along at least portions of side boundaries of the antenna pattern above the ground pattern, and extends above the antenna pattern.Type: GrantFiled: March 10, 2021Date of Patent: March 28, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jeong Ki Ryoo, Hong In Kim, Nam Ki Kim
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Patent number: 11594814Abstract: An antenna apparatus includes: a feed line; a first ground layer including surface disposed above or below the feed line and spaced apart from the feed line; and an antenna pattern electrically connected to an end of the feed line and configured to transmit and/or receive a radio frequency (RF) signal, wherein the first ground layer includes a first protruding region protruding in a first longitudinal direction of the surface toward the antenna pattern and at least partially overlapping the feed line above or below the feed line, and second and third protruding regions protruding in the first longitudinal direction from positions spaced apart from the first protruding region in opposite lateral directions of the surface.Type: GrantFiled: March 5, 2021Date of Patent: February 28, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Nam Ki Kim, Jeong Ki Ryoo
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Patent number: 11588222Abstract: A chip antenna module array includes a connection member and chip antenna modules mounted on the connection member. Each chip antenna module includes: a first patch antenna dielectric layer; a feed via extending through the first patch antenna dielectric layer; and a patch antenna pattern disposed on an upper surface of the first patch antenna dielectric layer and configured to be fed from the feed via. At least one chip antenna module includes: a ground pattern disposed on a lower surface of the first patch antenna dielectric layer; a chip-antenna feed line including a second part disposed on a lower surface of the ground pattern, and electrically connecting a connection member feed line to the feed via; a first feed line dielectric layer disposed on a lower surface of the second part; and a solder layer disposed on a lower surface of the first feed line dielectric layer.Type: GrantFiled: August 17, 2021Date of Patent: February 21, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jeong Ki Ryoo, Ju Hyoung Park, Nam Ki Kim, Dae Ki Lim, Won Cheol Lee, Hong In Kim
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Patent number: 11509039Abstract: An antenna module includes a connection member, an integrated circuit (IC) on a first surface thereof, and an antenna package on a second surface thereof. The connection member includes a wiring layer and an insulating layer. The IC is electrically connected to the wiring layer. The antenna package includes first antenna members and feed vias each electrically connected to a corresponding one of the first antenna members and a corresponding wire of the wiring layer. A feed line is electrically connected to a wire of the wiring layer and extends in a side direction of the second surface, a second antenna member is electrically connected to the feed line and is configured to transmit and/or receive an RF signal in the side direction, and a director member is spaced apart from the second antenna member in the side direction and has an inside boundary oblique to the second antenna member.Type: GrantFiled: August 24, 2020Date of Patent: November 22, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Nam Ki Kim, Jeong Ki Ryoo, Seung Goo Jang, Sang Hyun Kim
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Publication number: 20220224018Abstract: An antenna module includes: an IC package including an IC; first and second antenna portions including respective patch antenna patterns, respective feed vias connected to the respective patch antenna patterns, and respective dielectric layers surrounding the respective feed vias; and a connection member having an upper surface on which the first and second antenna portions are disposed and a lower surface on which the IC package is disposed, the connection member forming an electrical connection path between the IC and the feed via of the first antenna portion and an electrical connection path of the second antenna portion. The connection member includes a first region disposed between the IC package and the first antenna portion, a second region on which the second antenna portion is disposed, and a third region electrically connecting the first and second regions and being more flexible than the dielectric layer of the first antenna portion.Type: ApplicationFiled: April 1, 2022Publication date: July 14, 2022Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Myeong Woo HAN, Ju Hyoung PARK, Dae Ki LIM, Jeong Ki RYOO, Won Cheol LEE, Nam Ki KIM
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Publication number: 20220190484Abstract: An antenna apparatus includes a ground plane, a plurality of first patch antenna patterns arranged on a level higher than the ground plane and each configured to transmit and/or receive a first radio frequency signal of a first frequency, a plurality of second patch antenna patterns arranged on a level higher than the ground plane and each having a size smaller than a size of each of the first patch antenna patterns, wherein the plurality of second patch antenna patterns include at least one feed patch antenna pattern configured to transmit and/or receive a second radio frequency signal of a second frequency different from the first frequency, and at least one dummy patch antenna pattern which is not fed any of the first and second radio frequency signals.Type: ApplicationFiled: March 7, 2022Publication date: June 16, 2022Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Won Cheol LEE, Jeong Ki RYOO, Nam Ki KIM, Myeong Woo HAN, Sang Hyun KIM
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Patent number: 11349215Abstract: An antenna apparatus includes: a feed via; a patch antenna pattern electrically connected to one end of the feed via; a ground layer disposed in a position vertically lower than a position of the patch antenna pattern, and having a through-hole through which the feed via passes; a first conductive ring pattern laterally spaced apart from the patch antenna pattern, and having a first through region laterally surrounding the patch antenna pattern; and a second conductive ring pattern disposed in a position vertically higher than a position of the first conductive ring pattern, and having a second through region laterally surrounding the patch antenna pattern, wherein an area of the second through region is greater than an area of the first through region.Type: GrantFiled: October 1, 2020Date of Patent: May 31, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Nam Ki Kim, Ju Hyoung Park, Jeong Ki Ryoo, Dae Ki Lim, Myeong Woo Han
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Patent number: 11342663Abstract: An antenna apparatus includes: a first dipole antenna pattern; a feed line electrically connected to the first dipole antenna pattern; and a first ground plane disposed rearward of the first dipole antenna pattern and spaced apart from the first dipole antenna pattern; wherein the first ground plane forms a step-type cavity, and width of a rear portion of the step-type cavity is different from a width of a front portion of the step-type cavity.Type: GrantFiled: June 11, 2019Date of Patent: May 24, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Nam Ki Kim, Jeong Ki Ryoo, Kyu Bum Han, Young Kyoon Im, Won Cheol Lee
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Patent number: 11336022Abstract: An antenna apparatus includes a ground layer, patch antenna patterns, feed vias, ring-type meta patterns, and coupling-type meta patterns. The ground layer has one or more through-holes. Patch antenna patterns are each disposed above the ground layer. Feed vias are disposed to penetrate through the one or more through-holes, and electrically connect to the patch antenna patterns, respectively. Ring-type meta patterns are arranged between the patch antenna patterns. Coupling-type meta patterns are alternately arranged between the patch antenna patterns in fewer numbers than the ring-type meta patterns in positions more distant from the patch antenna patterns than positions in which the ring-type meta patterns are arranged.Type: GrantFiled: October 28, 2020Date of Patent: May 17, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Nam Ki Kim, Dae Ki Lim, Jeong Ki Ryoo, Ju Hyoung Park, Jae Min Keum, Myeong Woo Han