Patents by Inventor Jeongkwan JUNG

Jeongkwan JUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230230864
    Abstract: A semiconductor fabrication facility including raceways on a ceiling of a structural construction and extending in one direction, a vehicle rail assembly coupled to the raceways, outer jig rails on outer sidewalls of the raceways and adjacent to the vehicle rail assembly, and an outer jig on the outer jig rails and configured to allow the vehicle rail assembly to move along the outer jig rails may be provided.
    Type: Application
    Filed: August 24, 2022
    Publication date: July 20, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Youngon OH, Youngcheol JANG, Jihun KIM, Sanghyuk PARK, Sangho YOON, SeungYeob LEE, Chul Min LEE, Hochan LEE, Jaegyun JEON, Jeongkwan JUNG, Hyeong Seok CHOO, Dongyeol HAN