Abstract: A substrate polishing apparatus includes a support part on which at least one substrate is disposed, a plurality of first moving parts disposed at both opposite sides of the support part in a second direction crossing a first direction, and configured to upwardly extend and reciprocate in the first direction, a second moving part disposed between the plurality of first moving parts in the second direction and connected to an upper side of the first moving parts, a plurality of polishing units disposed at a lower portion of the second moving part and configured to contact an upper surface of the substrate, and a plurality of nozzles disposed at the lower portion of the second moving part and configured to spray slurry to the substrate where the polishing units rotate and revolve along a predetermined trajectory.

Abstract: A display panel includes a display panel having a curved shape and a printed circuit hoard (PCB). At least one carrier connects the display panel and the PCB. At least one driving integrated circuit (driving IC) is disposed on each carrier. Each carrier includes a body and at least one connector extending from the body. Each connector is spaced apart from each other connector.

Abstract: A method of manufacturing a substrate includes: irradiating, along a first path, a laser beam emitted from a source onto a substrate, wherein the substrate includes a target layer of the laser beam, and wherein the substrate is disposed on a stage; and irradiating, along a second path, a portion the laser beam, which was emitted from the source and reached the target layer, by reflecting the laser beam back onto the target layer using a reflection mirror. An area of a second region of the target layer is greater than an area of a first region of the target layer, wherein the laser beam is irradiated along the second path in the second region, and the laser beam is irradiated along the first path in the first region.

Abstract: A method of manufacturing a substrate includes: irradiating, along a first path, a laser beam emitted from a source onto a substrate, wherein the substrate includes a target layer of the laser beam, and wherein the substrate is disposed on a stage; and irradiating, along a second path, a portion the laser beam, which was emitted from the source and reached the target layer, by reflecting the laser beam back onto the target layer using a reflection mirror. An area of a second region of the target layer is greater than an area of a first region of the target layer, wherein the laser beam is irradiated along the second path in the second region, and the laser beam is irradiated along the first path in the first region.

Abstract: A method of manufacturing a substrate includes: irradiating, along a first path, a laser beam emitted from a source onto a substrate, wherein the substrate includes a target layer of the laser beam, and wherein the substrate is disposed on a stage; and irradiating, along a second path, a portion the laser beam, which was emitted from the source and reached the target layer, by reflecting the laser beam back onto the target layer using a reflection mirror. An area of a second region of the target layer is greater than an area of a first region of the target layer, wherein the laser beam is irradiated along the second path in the second region, and the laser beam is irradiated along the first path in the first region.

Abstract: A substrate polishing apparatus includes a support part on which at least one substrate is disposed, a plurality of first moving parts disposed at both opposite sides of the support part in a second direction crossing a first direction, and configured to upwardly extend and reciprocate in the first direction, a second moving part disposed between the plurality of first moving parts in the second direction and connected to an upper side of the first moving parts, a plurality of polishing units disposed at a lower portion of the second moving part and configured to contact an upper surface of the substrate, and a plurality of nozzles disposed at the lower portion of the second moving part and configured to spray slurry to the substrate where the polishing units rotate and revolve along a predetermined trajectory.

Abstract: A method of manufacturing a display apparatus includes forming an amorphous silicon layer on a substrate, splitting a first laser beam emitted from a first laser source into a first master beam in a first polarization state and a second master beam in a second polarization state, changing the first polarization state of the first master beam to the second polarization state to output a third master beam having the second polarization state and corresponding to the first master beam having the second polarization state, combining the second master beam with the third master beam to output a merged laser beam, and irradiating the amorphous silicon layer with the merged laser beam to form a polysilicon layer.

Abstract: A method of manufacturing a substrate includes: irradiating, along a first path, a laser beam emitted from a source onto a substrate, wherein the substrate includes a target layer of the laser beam, and wherein the substrate is disposed on a stage; and irradiating, along a second path, a portion the laser beam, which was emitted from the source and reached the target layer, by reflecting the laser beam back onto the target layer using a reflection mirror. An area of a second region of the target layer is greater than an area of a first region of the target layer, wherein the laser beam is irradiated along the second path in the second region, and the laser beam is irradiated along the first path in the first region.

Abstract: A display panel includes a display panel having a curved shape and a printed circuit hoard (PCB). At least one carrier connects the display panel and the PCB. At least one driving integrated circuit (driving IC) is disposed on each carrier. Each carrier includes a body and at least one connector extending from the body. Each connector is spaced apart from each other connector.