Patents by Inventor Jeong lk Lee

Jeong lk Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240285557
    Abstract: The present invention relates to a therapeutic agent of a lipase inhibitor for a wide spectrum of RNA viral infections in humans and animals. More specifically, the lipase inhibitor can be used as a therapeutic agent for influenza A virus infection, bovine coronavirus infection, porcine epidemic diarrhea coronavirus infection, bovine rotavirus infection, porcine reproductive and respiratory syndrome virus infection, and sapoviral infection and furthermore, can be utilized as a therapeutic agent for various RNA viral infections in humans and animals, such as infections with SARS COV-1, MERS-COV, Zika virus, dengue fever virus, and hepatitis A and C viruses.
    Type: Application
    Filed: June 24, 2022
    Publication date: August 29, 2024
    Inventors: Kyoung Oh CHO, Tae ll JEON, Sun Woo LEE, Yeong Bin BAEK, Hyung Jun Kwon, Hueng Sik CHOI, Sang lk PARK, Muhammad SHARIF, Jeong Ah LIM
  • Patent number: 9806262
    Abstract: Provided is a method of manufacturing an organic light emitting device, the method including forming a lower electrode on a lower substrate, forming an organic layer on the lower electrode, forming a light extraction layer including an adhesion layer and nanoparticles on an upper substrate, forming an upper electrode on the light extraction layer, and coupling the lower substrate to the upper substrate so that the upper electrode contacts the organic layer. The forming of the light extraction layer includes providing an adhesive between a first sacrificial substrate and the upper substrate, curing the adhesive to form the adhesion layer to form the adhesion layer, and removing the first sacrificial substrate to expose the adhesion layer. The first sacrificial substrate and the upper substrate are coupled to each other by the adhesion layer.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: October 31, 2017
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Byoung-Hwa Kwon, Jeong lk Lee, Hyunkoo Lee, Jong Tae Lim, Byoung Gon Yu, Jonghee Lee, Doo-Hee Cho, Hyunsu Cho