Abstract: An apparatus for manufacturing a display device, includes: a stage; a temperature controlling portion on the stage, and to receive a member seated on the temperature controlling portion; and a jig portion facing the temperature controlling portion, the jig portion to move linearly, and to receive an adhesive member. The jig portion includes: a first support plate; a second support plate facing the first support plate; and a pressurization plate on the first support plate and the second support plate, the pressurization plate to receive the adhesive member thereon. An end of the pressurization plate is spaced further from the member than an end of the first support plate and an end of the second support plate when the member is seated on the temperature controlling portion.

Abstract: An apparatus for manufacturing a display device, includes: a stage; a temperature controlling portion on the stage, and to receive a member seated on the temperature controlling portion; and a jig portion facing the temperature controlling portion, the jig portion to move linearly, and to receive an adhesive member. The jig portion includes: a first support plate; a second support plate facing the first support plate; and a pressurization plate on the first support plate and the second support plate, the pressurization plate to receive the adhesive member thereon. An end of the pressurization plate is spaced further from the member than an end of the first support plate and an end of the second support plate when the member is seated on the temperature controlling portion.

Abstract: A display device includes a display module including a pad region, a base layer in which a first open region corresponding to the pad region is defined, a pixel on the base layer, and a signal line which is on the base layer, electrically connected to the pixel and includes a pad portion corresponding to the first open region, a flexible circuit board electrically connected to the display module, at the pad region of the display module, a window facing the display module, an upper layer between the window and the display module, and a resin structure which bonds the flexible circuit board to the display module, at the pad region.

Abstract: Provided is a display apparatus. The display apparatus includes a flexible circuit board including flexible pads, a main circuit board including main pads, and a display panel including a plurality of pixels connected to the flexible circuit board and configured to receive a signal from the driving chip. In each of the flexible pads and the main pads, a portion of the pads is gradually tilted from pads disposed at a center to pads disposed at an outer side among the pads, and a tilted angle of a main pad disposed at the outermost side of the main circuit board is greater than that of a flexible pad disposed at the outermost side of the flexible circuit board.

Abstract: An apparatus for manufacturing a display device, includes: a stage; a temperature controlling portion on the stage, and to receive a member seated on the temperature controlling portion; and a jig portion facing the temperature controlling portion, the jig portion to move linearly, and to receive an adhesive member. The jig portion includes: a first support plate; a second support plate facing the first support plate; and a pressurization plate on the first support plate and the second support plate, the pressurization plate to receive the adhesive member thereon. An end of the pressurization plate is spaced further from the member than an end of the first support plate and an end of the second support plate when the member is seated on the temperature controlling portion.

Abstract: Provided is a display apparatus. The display apparatus includes a flexible circuit board including flexible pads, a main circuit board including main pads, and a display panel including a plurality of pixels connected to the flexible circuit board and configured to receive a signal from the driving chip. In each of the flexible pads and the main pads, a portion of the pads is gradually tilted from pads disposed at a center to pads disposed at an outer side among the pads, and a tilted angle of a main pad disposed at the outermost side of the main circuit board is greater than that of a flexible pad disposed at the outermost side of the flexible circuit board.

Abstract: A film cutting device includes a stage which supports a circuit film, a cutter disposed on the stage to cut the circuit film, a vibration horn connected to the cutter, where the vibration horn vibrates the cutter in a first direction based on an ultrasonic wave, and a cooler which cools the cutter.