Abstract: A polishing pad conditioning apparatus according to an example embodiment of the present inventive concept includes an apparatus body, a pivot arm provided on the apparatus body and including a housing having an internal space and provided at a distal end portion of the pivot arm and a head unit disposed at the distal end portion of the pivot arm. The head unit includes: a rotary motor provided in the internal space of the housing, the rotary motor including a rotary shaft; a foreign material blocking member connected to the rotary shaft; a disk holder connected to the rotary shaft; and a conditioning disk coupled to the disk holder. The foreign material blocking member includes a fluid flow groove configured to guide a movement of fluid for preventing foreign objects from entering the housing on an outer surface of the foreign material blocking member.

Abstract: A semiconductor device including: a substrate; a via which penetrates the substrate; a via insulating film formed along an inner wall of the via; and a core plug which fills the via, wherein a residual stress of the via insulating film is 60 MPa to ?100 MPa.

Abstract: A semiconductor device including: a substrate; a via which penetrates the substrate; a via insulating film formed along an inner wall of the via; and a core plug which fills the via, wherein a residual stress of the via insulating film is 60 MPa to ?100 MPa.

Abstract: A polishing pad conditioning apparatus according to an example embodiment of the present inventive concept includes an apparatus body, a pivot arm provided on the apparatus body and including a housing having an internal space and provided at a distal end portion of the pivot arm and a head unit disposed at the distal end portion of the pivot arm. The head unit includes: a rotary motor provided in the internal space of the housing, the rotary motor including a rotary shaft; a foreign material blocking member connected to the rotary shaft; a disk holder connected to the rotary shaft; and a conditioning disk coupled to the disk holder. The foreign material blocking member includes a fluid flow groove configured to guide a movement of fluid for preventing foreign objects from entering the housing on an outer surface of the foreign material blocking member.

Abstract: A semiconductor device including: a substrate; a via which penetrates the substrate; a via insulating film formed along an inner wall of the via; and a core plug which fills the via, wherein a residual stress of the via insulating film is 60 MPa to ?100 MPa.

Abstract: A cooling system of a computed tomography (CT) system provides for a more efficient operation than known heretofore. The cooling system of the CT system includes a gantry and a table that moves an object into a bore of the gantry. The gantry includes part boxes mounted therein, and blade elements are formed in regions of the part boxes. The cooling system of the CT system includes a cooling method that includes a multiple cooling method including a stand-by mode and an operating mode.

Abstract: An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased.

Abstract: Cooling systems of a CT system and methods of cooling the CT system are disclosed. The CT system includes a gantry and a table that moves an object into a bore of the gantry, wherein the gantry includes a cover having a front surface in which at least an inlet slot is formed and a rear surface in which exhaust holes are formed along with exhaust fans in the rear surface of the cover of the gantry. Fans for the in-take and exhaustion of air are not required to be formed on the front surface of the cover of the gantry. A hole through which external air is taken in through the inlet slot is moved in a rotor of the gantry.

Abstract: An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased.

Abstract: A cooling system of a computed tomography (CT) system provides for a more efficient operation than known heretofore. The cooling system of the CT system includes a gantry and a table that moves an object into a bore of the gantry. The gantry includes part boxes mounted therein, and blade elements are formed in regions of the part boxes. The cooling system of the CT system includes a cooling method that includes a multiple cooling method including a stand-by mode and an operating mode.

Abstract: Cooling systems of a CT system and methods of cooling the CT system are disclosed. The CT system includes a gantry and a table that moves an object into a bore of the gantry, wherein the gantry includes a cover having a front surface in which at least an inlet slot is formed and a rear surface in which exhaust holes are formed along with exhaust fans in the rear surface of the cover of the gantry. Fans for the in-take and exhaustion of air are not required to be formed on the front surface of the cover of the gantry. A hole through which external air is taken in through the inlet slot is moved in a rotor of the gantry.