Abstract: There is provided a tantalum capacitor including: a tantalum capacitor body; a plurality of tantalum wires and an adhesive layer on a lower surface of the tantalum capacitor body; and a molding part enclosing the tantalum capacitor body, wherein the tantalum wire and the adhesive layer are connected to an anode lead frame and a cathode lead frame, respectively.

Abstract: A tantalum capacitor includes a capacitor body containing a tantalum powder and having a tantalum wire protruding to one side surface thereof, a molding part enclosing the tantalum wire and the capacitor body so as to allow an end portion of the tantalum wire to be exposed through one side surface thereof, a positive electrode terminal extended from one side surface of the molding part to a portion of a lower surface thereof and connected to the end portion of the tantalum wire, and a negative electrode terminal extended from the other side surface of the molding part to a portion of the lower surface thereof and connected to the other side surface of the capacitor body.

Abstract: The present invention relates to a solid electrolytic capacitor and a production method thereof. A solid electrolytic capacitor of the present invention includes: a capacitor element having an anode wire inserted in one side surface thereof; a cathode terminal disposed on one side under the capacitor element to be electrically connected to the capacitor element; an anode terminal disposed on the other side under the capacitor element and having a bending portion integrally formed to be inclined to the capacitor element for electrical connection with the anode wire; and a molding portion surrounding the outside of the capacitor element and formed to expose lower surfaces of the cathode terminal and the anode terminal.

Abstract: A tantalum capacitor may include: a capacitor body containing a tantalum powder and having a tantalum wire exposed to one end surface thereof; a positive electrode lead frame including a positive electrode terminal part, a vertical support part vertically extended from one leading edge of the positive electrode terminal part, and a positive electrode connection part extended from the vertical support part toward the positive electrode terminal part and connected to the tantalum wire; a negative electrode lead frame having the capacitor body mounted on an upper surface thereof; and a molding part formed to allow a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame to be exposed, while enclosing the capacitor body.

Abstract: A tantalum capacitor includes a capacitor body containing tantalum powder and having a tantalum wire extending downwardly; a molded part enclosing the capacitor body and exposing an end portion of the tantalum wire; a positive electrode lead frame disposed on a lower surface of the molded part and connected to the end portion of the tantalum wire; a negative electrode lead frame disposed on the lower surface of the molded part; and a conductive adhesive layer disposed between the capacitor body and the negative electrode lead frame.

Abstract: There is provided a tantalum capacitor including: a capacitor body containing tantalum powder and having a tantalum wire exposed to one end thereof; a positive electrode lead frame including a positive electrode terminal part and a positive electrode connection part formed by upwardly bending a portion of the positive electrode terminal part from the outside toward the inside and connected to the tantalum wire; a negative electrode lead frame having the capacitor body mounted thereon; and a molded part formed to enclose the capacitor body while exposing a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame.

Abstract: There is provided a tantalum capacitor including: a tantalum capacitor body; a plurality of tantalum wires and an adhesive layer on a lower surface of the tantalum capacitor body; and a molding part enclosing the tantalum capacitor body, wherein the tantalum wire and the adhesive layer are connected to an anode lead frame and a cathode lead frame, respectively.

Abstract: A tantalum capacitor includes a capacitor body containing a tantalum powder and having a tantalum wire protruding to one side surface thereof, a molding part enclosing the tantalum wire and the capacitor body so as to allow an end portion of the tantalum wire to be exposed through one side surface thereof, a positive electrode terminal extended from one side surface of the molding part to a portion of a lower surface thereof and connected to the end portion of the tantalum wire, and a negative electrode terminal extended from the other side surface of the molding part to a portion of the lower surface thereof and connected to the other side surface of the capacitor body.

Abstract: A tantalum capacitor may include: a capacitor body containing a tantalum powder and having a tantalum wire exposed to one end surface thereof; a positive electrode lead frame including a positive electrode terminal part, a vertical support part vertically extended from one leading edge of the positive electrode terminal part, and a positive electrode connection part extended from the vertical support part toward the positive electrode terminal part and connected to the tantalum wire; a negative electrode lead frame having the capacitor body mounted on an upper surface thereof; and a molding part formed to allow a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame to be exposed, while enclosing the capacitor body.

Abstract: A tantalum capacitor includes a capacitor body containing tantalum powder and having a tantalum wire extending downwardly; a molded part enclosing the capacitor body and exposing an end portion of the tantalum wire; a positive electrode lead frame disposed on a lower surface of the molded part and connected to the end portion of the tantalum wire; a negative electrode lead frame disposed on the lower surface of the molded part; and a conductive adhesive layer disposed between the capacitor body and the negative electrode lead frame.

Abstract: There is provided a tantalum capacitor including: a capacitor body containing tantalum powder and having a tantalum wire exposed to one end thereof; a positive electrode lead frame including a positive electrode terminal part and a positive electrode connection part formed by upwardly bending a portion of the positive electrode terminal part from the outside toward the inside and connected to the tantalum wire; a negative electrode lead frame having the capacitor body mounted thereon; and a molded part formed to enclose the capacitor body while exposing a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame.

Abstract: A solid electrolytic capacitor of the present invention includes: a capacitor element having an anode wire inserted in one side surface thereof; a cathode terminal disposed on one side under the capacitor element to be electrically connected to the capacitor element; an anode terminal disposed on the other side under the capacitor element and having a bending portion integrally formed to be inclined to the capacitor element for electrical connection with the anode wire; and a molding portion surrounding the outside of the capacitor element and formed to expose lower surfaces of the cathode terminal and the anode terminal.

Abstract: Disclosed herein is a tantalum capacitor capable of improving equivalent series resistance (ESR) characteristic by increasing the bond between a tantalum wire and a tantalum powder. The tantalum capacitor according to the present invention includes: a tantalum wire; a tantalum powder having embedded a front end of the tantalum wire and then being sintered; and a rough part formed on a surface of the tantalum wire so as to strengthen a bond between the tantalum wire and the tantalum powder.

Abstract: There are provided a method for manufacturing a barium titanate powder and a barium titanate powder manufactured by the same. The method for manufacturing the barium titanate powder according to an exemplary embodiment of the present invention includes: preparing a titanium dioxide (TiO2) powder having a specific surface area of 90 m2/g or more and a barium carbonate (BaCO3) powder having a specific surface area of 40 m2/g or more; mixing the titanium dioxide powder, the barium carbonate powder, and a dispersant so as to have a specific surface area of a mixed powder of 50 m2/g or more; performing a primary heat treatment of the mixed powder by decompressing the mixed powder at a temperature where a weight decreasing rate of the mixed powder is equal to or more than 90%; and performing a secondary heat treatment of the mixed powder at a temperature of 850° C. or less.

Abstract: There is provided a solid electrolytic capacitor, including: a condenser element including a positive electrode wire inserted and mounted to be biased from a center of a chip body; a positive electrode terminal including a pattern layer extendedly formed to the positive electrode wire to be bonded to the positive electrode wire; and a negative electrode terminal electrically connected to the condenser element.

Abstract: There is provided a method of manufacturing a solid electrolytic capacitor including: forming a conductive polymer layer on a surface of a metal pellet; and forming a dielectric layer between the metal pellet and the conductive polymer layer. Because the conductive polymer layer is directly formed on the surface of the metal pellet, the conductive polymer layer can be uniformly formed, and because there is no need to form an electrode on the surface of the dielectric layer, the process can be reduced. In addition, because the uniform polymer film is formed irrespective of the size of metal pores and the shape of the capacitor, a capacity of the capacitor can be maximized.

Abstract: Provided are a dielectric composition and a ceramic electronic component including the same. The dielectric composition includes (a) barium titanate having a specific surface area of 2.5 m2/g to 6.0 m2/g; (b) a mixture containing at least one or more materials selected from the group consisting of any one oxide of Mg, Ca, Sr, Ba and Zr, and any one carbonate thereof; (c) oxide containing at least one or more materials selected from the group consisting of Sc, Y, La, Ac, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; (d) oxide containing at least one or more material selected from the group consisting of Cr, Mn, Fe, Co, and Ni; (e) oxide containing at least one or more material selected from the group consisting of V, Nb, and Ta; and (f) oxide containing at least one or more material selected from the group consisting of Si and Al. The dielectric composition can satisfy X8R characteristic, can be sintered at a low temperature, and can obtain high reliability.

Abstract: Provided are a dielectric composition and a ceramic electronic component including the same. The dielectric composition includes (a) barium titanate having a specific surface area of 2.5 m2/g to 6.0 m2/g; (b) a mixture containing at least one or more materials selected from the group consisting of any one oxide of Mg, Ca, Sr, Ba and Zr, and any one carbide thereof; (c) oxide containing at least one or more materials selected from the group consisting of Sc, Y, La, Ac, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; (d) oxide containing at least one or more material selected from the group consisting of Cr, Mn, Fe, Co, and Ni; (e) oxide containing at least one or more material selected from the group consisting of V, Nb, and Ta; and (f) oxide containing at least one or more material selected from the group consisting of Si and Al. The dielectric composition can satisfy X8R characteristic, can be sintered at a low temperature, and can obtain high reliability.