Patents by Inventor Jeong Ryeol Kim
Jeong Ryeol Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11574774Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connected to the first surface and the second surface and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, a plurality of internal electrodes disposed inside of the body, exposed to the first surface and the second surface, and having one ends exposed to the third or fourth surfaces, side margin portions disposed on the first surface and the second surface, and external electrodes disposed on the third surface and the fourth surface. The side margin portions and the plurality of dielectric layers include a metal, and a total amount of the metal included in the side margin portions is greater than that of the plurality of dielectric layers.Type: GrantFiled: April 2, 2021Date of Patent: February 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jun Tae Han, Sun Ho Yoon, Jeong Ryeol Kim, Myung Hwa You, Young Joon Oh, Seul A Park
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Publication number: 20230016258Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. A region, containing nickel (Ni) and carbon (C), is present between the internal electrode layer and the dielectric layer.Type: ApplicationFiled: October 20, 2021Publication date: January 19, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Joon OH, Jeong Ryeol KIM
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Patent number: 11551874Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by applying a paste for an internal electrode including a conductive powder to the ceramic green sheet, forming a ceramic laminate structure by layering the ceramic green sheet on which the internal electrode pattern is formed, forming a body including a dielectric layer and an internal electrode by sintering the ceramic laminate structure, and forming an external electrode by forming an electrode layer on the body, and forming a conductive resin layer on the electrode layer, and the conductive powder includes a conductive metal and tin (Sn), and a content of tin (Sn) is 1.5 wt % or higher, based on a weight of the conductive metal.Type: GrantFiled: December 3, 2020Date of Patent: January 10, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seok Kyoon Woo, Kyoung Jin Cha, Jeong Ryeol Kim, Ji Hong Jo
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Patent number: 11469051Abstract: A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 ?m or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.Type: GrantFiled: April 16, 2021Date of Patent: October 11, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Hye Han, Jung Min Kim, Jae Seok Yi, Hye Jin Park, Byung Woo Kang, Jeong Ryeol Kim, Bon Seok Koo, Il Ro Lee
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Publication number: 20220223343Abstract: A multilayer ceramic capacitor includes a ceramic body including first and second surfaces opposing each other, and third and fourth surfaces connecting the first and second surfaces, a plurality of internal electrodes disposed inside the ceramic body, exposed from the first and second surfaces, and having an end exposed from the third surface or the fourth surface, and a first side margin and a second side margin respectively disposed on the first and second surfaces, from which end portions of the plurality of internal electrodes are exposed. The first and second side margins include a base material powder of a barium titanate-based base powder and a subcomponent. The subcomponent includes terbium (Tb) as a first subcomponent including a lanthanide rare earth element, and a content ratio of the terbium (Tb) to a content of the first subcomponent (RE) excluding the terbium (Tb) satisfies 0.110?Tb/RE?2.333.Type: ApplicationFiled: March 31, 2022Publication date: July 14, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Sung PARK, Jeong Ryeol KIM, In Tae SEO, Jong Han KIM, Hyung Soon KWON, Hee Sun CHUN
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Publication number: 20220208457Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer, an average thickness of the protective layer is 70 nm or more and/or less than 400 nm, and a ratio of an average thickness of the coating layer to the average thickness of the protective layer is 0.25 or more and/or 0.75 or less.Type: ApplicationFiled: August 26, 2021Publication date: June 30, 2022Inventors: Kyo Yeol Lee, Seung Hun Han, Sang Wook Lee, Jung Min Kim, Jeong Ryeol Kim
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Publication number: 20220208456Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first internal electrodes and second internal electrodes disposed to face each other and alternately stacked with the respective dielectric layers interposed therebetween; a first external electrode connected to the first internal electrodes; a second external electrode connected to the second internal electrodes; and a protective layer disposed on the ceramic body, the first external electrode, and the second external electrode, wherein the protective layer includes an adhesion assisting layer and a coating layer.Type: ApplicationFiled: June 3, 2021Publication date: June 30, 2022Inventors: Kyo Yeol LEE, Seung Hun HAN, Sang Wook LEE, Jung Min KIM, Jeong Ryeol KIM
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Publication number: 20220208464Abstract: A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer; a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer; and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer. The first conductive layer and the second conductive layer are sintered electrodes including a conductive metal and glass, and the first coating layer includes a plurality of openings disposed on the first electrode layer and the second electrode layer.Type: ApplicationFiled: September 3, 2021Publication date: June 30, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyo Yeol LEE, Seung Hun HAN, In Young KANG, Jung Min KIM, Jeong Ryeol KIM
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Publication number: 20220208465Abstract: A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween, a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer, a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer, and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer, wherein the first coating layer may include an alkyl(meth)acrylate-based polymer.Type: ApplicationFiled: September 7, 2021Publication date: June 30, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyo Yeol LEE, Seung Hun HAN, In Young KANG, Jung Min KIM, Jeong Ryeol KIM
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Publication number: 20220172896Abstract: A dielectric composition includes one of BaTiO3, (Ba,Ca)(Ti,Ca)O3, (Ba,Ca)(Ti,Zr)O3, Ba(Ti,Zr)O3 and (Ba,Ca)(Ti,Sn)O3, as a main component, a first subcomponent including a rare earth element, and a second subcomponent including at least one of a variable valence acceptor element and a fixed valence acceptor element. When a sum of contents of the rare earth element is defined as DT and a sum of contents of the variable valence acceptor element and the fixed valence acceptor element is defined as AT, (DT/AT)/(Ba+Ca) satisfies more than 0.5 and less than 6.0. In addition, a multilayer electronic component including the dielectric composition is provided.Type: ApplicationFiled: February 18, 2022Publication date: June 2, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Sung PARK, Hyoung Uk KIM, Hyung Soon KWON, Jong Han KIM, Jeong Ryeol KIM
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Patent number: 11348729Abstract: A dielectric composition includes one of BaTiO3, (Ba,Ca) (Ti,Ca)O3, (Ba,Ca) (Ti,Zr)O3, Ba(Ti,Zr)O3 and (Ba,Ca) (Ti,Sn)O3, as a main component, a first subcomponent including a rare earth element, and a second subcomponent including at least one of a variable valence acceptor element and a fixed valence acceptor element. When a sum of contents of the rare earth element is defined as DT and a sum of contents of the variable valence acceptor element and the fixed valence acceptor element is defined as AT, (DT/AT)/(Ba+Ca) satisfies more than 0.5 and less than 6.0. In addition, a multilayer electronic component including the dielectric composition is provided.Type: GrantFiled: April 7, 2020Date of Patent: May 31, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Sung Park, Hyoung Uk Kim, Hyung Soon Kwon, Jong Han Kim, Jeong Ryeol Kim
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Publication number: 20220165500Abstract: A multilayer electronic component includes: a body including dielectric layers and internal electrodes disposed alternately with the dielectric layers; and external electrodes disposed on the body, wherein each of the external electrodes includes: an electrode layer connected to the internal electrodes; a first intermetallic compound layer disposed on the electrode layer and including Cu3Sn; a second intermetallic compound layer disposed on the first intermetallic compound layer and including Cu6Sn5; and a conductive resin layer disposed on the second intermetallic compound layer and including a conductive connection portion including a low melting point metal, a plurality of metal particles, and a base resin, and an average thickness of the first intermetallic compound layer is 0.5 to 2.5 ?m.Type: ApplicationFiled: August 31, 2021Publication date: May 26, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Il Ro Lee, Jung Min Kim, Hong Je Choi, Sang Wook Lee, Seon Ho Park, Jeong Ryeol Kim, Bon Seok Koo
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Publication number: 20220148809Abstract: A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with respective dielectric layers interposed therebetween; and a first external electrode connected to the first internal electrodes and a second external electrode connected to the second internal electrodes, wherein the dielectric layer includes silicon (Si), each of the first and second internal electrodes includes Si and a conductive metal, and a ratio (B/A) of an average content (B) (wt %) of Si included in each of the first and second internal electrodes to an average content (A) (wt %) of Si included in the dielectric layer is 0.99 or more and 1.41 or less.Type: ApplicationFiled: August 16, 2021Publication date: May 12, 2022Inventors: Young Joon Oh, Yun Jeong Cha, Hyo Min Kang, Jun Oh Kim, Ji Eun Oh, Jeong Ryeol Kim
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Publication number: 20220139618Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction and including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in the first direction, and external electrodes disposed on the third and fourth surfaces, wherein the external electrodes include an electrode layer disposed on the body and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a conductive metal, an epoxy resin, and an acrylic resin.Type: ApplicationFiled: May 5, 2021Publication date: May 5, 2022Inventors: Byung Woo Kang, Bon Seok Koo, Jeong Ryeol Kim, Jung Min Kim, Jae Seok Yi, Ji Hye Han, Hye Jin Park
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Patent number: 11315729Abstract: A multilayer ceramic capacitor includes a ceramic body including first and second surfaces opposing each other, and third and fourth surfaces connecting the first and second surfaces, a plurality of internal electrodes disposed inside the ceramic body, exposed from the first and second surfaces, and having an end exposed from the third surface or the fourth surface, and a first side margin and a second side margin respectively disposed on the first and second surfaces, from which end portions of the plurality of internal electrodes are exposed. The first and second side margins include a base material powder of a barium titanate-based base powder and a subcomponent. The subcomponent includes terbium (Tb) as a first subcomponent including a lanthanide rare earth element, and a content ratio of the terbium (Tb) to a content of the first subcomponent (RE) excluding the terbium (Tb) satisfies 0.110?Tb/RE?2.333.Type: GrantFiled: May 29, 2020Date of Patent: April 26, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Sung Park, Jeong Ryeol Kim, In Tae Seo, Jong Han Kim, Hyung Soon Kwon, Hee Sun Chun
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Publication number: 20220093337Abstract: A multilayer capacitor includes a capacitor body including first to six surfaces, and including a dielectric layer, first and second internal electrodes, and first and second external electrodes. The first and second external electrodes include first and second sintered layers, and first and second plating layers, respectively. An insulating layer is disposed on the capacitor body, to cover an end portion of a first band portion of the first sintered layer and an end portion of a second band portion of the second sintered layer, and has a maximum thickness of 10 ?m or more. A portion of the first band portion of the first sintered layer is exposed from the insulating layer. A portion of the second band portion of the second sintered layer is exposed from the insulating layer.Type: ApplicationFiled: April 16, 2021Publication date: March 24, 2022Inventors: Ji Hye HAN, Jung Min KIM, Jae Seok YI, Hye Jin PARK, Byung Woo KANG, Jeong Ryeol KIM, Bon Seok KOO, Il Ro LEE
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Publication number: 20220076891Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connected to the first surface and the second surface and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other, a plurality of internal electrodes disposed inside of the body, exposed to the first surface and the second surface, and having one ends exposed to the third or fourth surfaces, side margin portions disposed on the first surface and the second surface, and external electrodes disposed on the third surface and the fourth surface. The side margin portions and the plurality of dielectric layers include a metal, and a total amount of the metal included in the side margin portions is greater than that of the plurality of dielectric layers.Type: ApplicationFiled: April 2, 2021Publication date: March 10, 2022Inventors: Jun Tae Han, Sun Ho Yoon, Jeong Ryeol Kim, Myung Hwa You, Young Joon Oh, Seul A Park
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Patent number: 11211202Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by applying a paste for an internal electrode including a conductive powder to the ceramic green sheet, forming a ceramic laminate structure by layering the ceramic green sheet on which the internal electrode pattern is formed, forming a body including a dielectric layer and an internal electrode by sintering the ceramic laminate structure, and forming an external electrode by forming an electrode layer on the body, and forming a conductive resin layer on the electrode layer, and the conductive powder includes a conductive metal and tin (Sn), and a content of tin (Sn) is 1.5 wt % or higher, based on a weight of the conductive metal.Type: GrantFiled: November 30, 2018Date of Patent: December 28, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seok Kyoon Woo, Kyoung Jin Cha, Jeong Ryeol Kim, Ji Hong Jo
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Patent number: 11152153Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by coating a paste for an internal electrode including nickel (Ni) powder including a coating layer having a surface including copper (Cu) on the ceramic green sheet, forming a ceramic multilayer structure by stacking the ceramic green sheet with the internal electrode pattern formed thereon, and forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure. The content of Cu is equal to or greater than 0.2 wt %, based on a total weight of the Ni powder.Type: GrantFiled: October 10, 2018Date of Patent: October 19, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyoung Jin Cha, Jeong Ryeol Kim, Kyung Ryul Lee, Young Joon Oh, Hyo Min Kang, Jun Oh Kim
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Patent number: 11031185Abstract: An electronic component includes external electrodes formed on an external surface of a body to be electrically connected to internal electrodes, and containing metal particles and glass, wherein the metal particles include particles having a polyhedral shape.Type: GrantFiled: May 9, 2018Date of Patent: June 8, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong Ryeol Kim, Bum Suk Kang, Hyo Min Kang, Hang Kyu Cho, Chang Hoon Kim