Patents by Inventor Jeong Sik Lee

Jeong Sik Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080109939
    Abstract: Disclosed is a cap combined with assistant tapes. The cap combined with assistant tapes is allowed to enhance quality and yield of the cap by controlling flexibility of the cap properly so that a size of the cap is spontaneously adjusted according to a size of user's head without separate size-adjusting device. The cap includes a crown part which is composed of one or more panels; a visor part which is attached to a front lower portion of the crown part; and a headband part which is attached to an inner lower peripheral portion of the crown part, one elastic tape of the assistant tapes is connected between the crown part and the headband part to be attached to a lower peripheral portion and a rear portion of the crown part, another elastic tape of the assistant tapes is connected between the crown part and the visor part to be attached to a front portion of the crown part, at least one sewing line is formed on the headband part with being sewed in a chain-like stitch using two flexible yarns.
    Type: Application
    Filed: November 13, 2006
    Publication date: May 15, 2008
    Inventor: Jeong Sik Lee
  • Publication number: 20070226875
    Abstract: Disclosed is a headwear capable of maintaining a shape of a crown and more particularly to an improved headwear capable of maintaining a shape of a crown continuously even after removing the headwear.
    Type: Application
    Filed: November 13, 2006
    Publication date: October 4, 2007
    Inventor: Jeong Sik Lee
  • Patent number: 7213270
    Abstract: Headband for headwear having a crown portion, the headband being attached to and extending around the lower inside edge of the crown portion. The headband is made of fabric or knitted textile as a covering portion with a mesh lining tape inserted on the inside thereof. The covering portion and liner are sewn together, preferably with stretch yarn, in a chain-like pattern to provide excellent expandability without the need for a separate size controller. The mesh lining tape improves the ventilation provided through the headband, while also serving to retain the overall uniform shape of the crown portion of the cap when the cap is removed.
    Type: Grant
    Filed: September 25, 2003
    Date of Patent: May 8, 2007
    Assignee: DADA Corp.
    Inventor: Jeong Sik Lee
  • Publication number: 20060068601
    Abstract: A wafer for fabrication of nitride semiconductor devices such as LEDs, HEMTs and FETs. The matrices of desired semiconductor devices are grown on a silicon substrate via a buffer region designed to keep the wafer from warping. The buffer region is in the form of alternations of multi-sublayered first buffer layers and non-sublayered, open-worked second buffer layers.
    Type: Application
    Filed: September 23, 2005
    Publication date: March 30, 2006
    Inventors: Jeong-Sik Lee, Tomoya Sugahara
  • Patent number: 6928659
    Abstract: A sweatband used for headwear that is woven of 100% polyester wrap-way and weft-way, made to single or two-ply without any polyurethane or additional stitched portion. The resulting sweatband, which preferably has a width between 25-70 mm and provides excellent sweat absorbing capability, exhibits good elasticity through the structure of the textile without imposing undue pressure on the wearer, with the result that the sweatband may be worn comfortably for long periods of time. The yarn used to produce the sweatband is processed by high temperature and piece dyeing methods and has twist per each certain length.
    Type: Grant
    Filed: August 6, 2003
    Date of Patent: August 16, 2005
    Assignee: DADA Corp.
    Inventor: Jeong Sik Lee