Patents by Inventor Jeong Sik Seo
Jeong Sik Seo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8159400Abstract: There are provided a chip antenna and a mobile telecommunication terminal having the chip antenna. The chip antenna includes: a dielectric block having opposing top and bottom surfaces and a plurality of side surfaces connecting the top and bottom surfaces; a first conductive pattern formed on at least one of the surfaces of the dielectric block and connected to an external feeding part; a second conductive pattern formed on at least one of the surfaces of the dielectric block to connect to the first conductive pattern, and having one end connected to an external ground part; and a third conductive pattern formed on at least one of the surfaces of the dielectric block, and spaced apart from the first and second conductive patterns to be capacitively coupled to the first and second conductive patterns, respectively, the third conductive pattern having a lower end connected to the external ground part.Type: GrantFiled: July 10, 2008Date of Patent: April 17, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Chang Mok Han, Ki Won Chang, Duk Woo Lee, Dae Kyu Lee, Jeong Sik Seo, Hyun Do Park
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Patent number: 8111194Abstract: There is provided a mobile telecommunication terminal comprising: a chip antenna, and a printed circuit board having the chip antenna mounted on one surface thereof, the printed circuit board comprising a tuning ground pattern formed on a surface opposing the one surface of the printed circuit board to have one end connected to a ground part so as to be used for tuning frequency characteristics of the chip antenna.Type: GrantFiled: November 23, 2007Date of Patent: February 7, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ki Won Chang, Jeong Sik Seo, Hyun Do Park, Jae Suk Sung
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Patent number: 8054227Abstract: There is provided a chip antenna including: a dielectric block; a first conductive pattern formed on at least one surface of the dielectric block to connect to an external feeding part; a second conductive pattern spaced apart from the first conductive pattern at a certain distance so as to be capacitively coupled to the first conductive pattern to act as a radiator, the second conductive pattern having one end connected to an external ground part; and a third conductive pattern spaced apart from the first conductive pattern at a certain distance so as to be capacitively coupled to the first conductive pattern to enable impedance matching of the antenna, the third conductive pattern having one end connected to the external ground part.Type: GrantFiled: November 23, 2007Date of Patent: November 8, 2011Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ki Won Chang, Jeong Sik Seo, Hyun Do Park, Jae Suk Sung
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Patent number: 7791541Abstract: There is provided a printed circuit board comprising: a mounting area of a chip antenna provided on one surface thereof, and a tuning ground pattern formed on a surface opposing the one surface of the printed circuit board to have one end connected to a ground part so as to be used for tuning frequency characteristics of the chip antenna.Type: GrantFiled: November 23, 2007Date of Patent: September 7, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ki Won Chang, Jeong Sik Seo, Hyun Do Park, Jae Suk Sung
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Patent number: 7557760Abstract: An inverted-F antenna and a mobile communication terminal using the same. The antenna includes a flexible board and a radiation plate formed on the flexible board. The antenna further includes a signal line having a first end formed on the flexible board and connected to the radiation plate and a second end extending from the first end and provided as a connecting terminal for feeding and grounding. The mobile communication terminal includes an RF board, a ground plate formed on the RF board, a feed line formed on the RF board for supplying a signal, and the inverted-F antenna as described above.Type: GrantFiled: May 4, 2007Date of Patent: July 7, 2009Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ki Won Chang, Duk Woo Lee, Jeong Sik Seo
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Publication number: 20090015486Abstract: There are provided a chip antenna and a mobile telecommunication terminal having the chip antenna. The chip antenna includes: a dielectric block having opposing top and bottom surfaces and a plurality of side surfaces connecting the top and bottom surfaces; a first conductive pattern formed on at least one of the surfaces of the dielectric block and connected to an external feeding part; a second conductive pattern formed on at least one of the surfaces of the dielectric block to connect to the first conductive pattern, and having one end connected to an external ground part; and a third conductive pattern formed on at least one of the surfaces of the dielectric block, and spaced apart from the first and second conductive patterns to be capacitively coupled to the first and second conductive patterns, respectively, the third conductive pattern having a lower end connected to the external ground part.Type: ApplicationFiled: July 10, 2008Publication date: January 15, 2009Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Chang Mok Han, Ki Won Chang, Duk Woo Lee, Dae Kyu Lee, Jeong Sik Seo, Hyun Do Park
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Publication number: 20080129604Abstract: There is provided a mobile telecommunication terminal comprising: a chip antenna, and a printed circuit board having the chip antenna mounted on one surface thereof, the printed circuit board comprising a tuning ground pattern formed on a surface opposing the one surface of the printed circuit board to have one end connected to a ground part so as to be used for tuning frequency characteristics of the chip antenna.Type: ApplicationFiled: November 23, 2007Publication date: June 5, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ki Won CHANG, Jeong Sik Seo, Hyun Do Park, Jae Suk Sung
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Publication number: 20080122722Abstract: There is provided a chip antenna including: a dielectric block; a first conductive pattern formed on at least one surface of the dielectric block to connect to an external feeding part; a second conductive pattern spaced apart from the first conductive pattern at a certain distance so as to be capacitively coupled to the first conductive pattern to act as a radiator, the second conductive pattern having one end connected to an external ground part; and a third conductive pattern spaced apart from the first conductive pattern at a certain distance so as to be capacitively coupled to the first conductive pattern to enable impedance matching of the antenna, the third conductive pattern having one end connected to the external ground part.Type: ApplicationFiled: November 23, 2007Publication date: May 29, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ki Won CHANG, Jeong Sik Seo, Hyun Do Park, Jae Suk Sung
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Publication number: 20080122713Abstract: There is provided a printed circuit board comprising: a mounting area of a chip antenna provided on one surface thereof, and a tuning ground pattern formed on a surface opposing the one surface of the printed circuit board to have one end connected to a ground part so as to be used for tuning frequency characteristics of the chip antenna.Type: ApplicationFiled: November 23, 2007Publication date: May 29, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ki Won CHANG, Jeong Sik Seo, Hyun Do Park, Jae Suk Sung
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Patent number: 7339532Abstract: The present invention relates to an antenna module which can minimize the occupying space in an electronic device, enhancing degrees of freedom to increase efficiency in space utilization, thereby accommodating miniaturization and multi-functionality of the electronic device, and an electronic device having the same. The antenna module includes a flexible substrate, an antenna element having a feeder part, a first fixing part, and a radiation part. The antenna module further includes a feeder line connected to the feeder part having a feeder pad, a first fixing pad connected to the first fixing part, and a pad coupling element. In the invention, signals are processed via interaction between the resonance of the current running through the feeder line to the radiation part and the resonance of the current coming into the pad coupling element.Type: GrantFiled: December 20, 2005Date of Patent: March 4, 2008Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Il Hwan Park, Chul Ho Kim, Gi Tae Do, Duk Woo Lee, Jeong Sik Seo, Tae Sung Kim, Sae Won Oh, Hyun Hak Kim
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Patent number: 7126547Abstract: An antenna module, which minimizes a space, in an electronic apparatus set, occupied thereby without changing characteristics thereof, improves a degree of freedom of the installation structure thereof to increase the space utilization of the set, and achieves miniaturization and multi-functionality of electronic apparatuses, and an electronic apparatus having the antenna module.Type: GrantFiled: November 9, 2004Date of Patent: October 24, 2006Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hyun Hak Kim, Chul Ho Kim, Jeong Sik Seo, II Hwan Park
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Patent number: 7002522Abstract: Disclosed herein is a chip antenna for terrestrial DMB. The chip antenna comprises a dielectric block, a main antenna device formed with conductive patterns in the dielectric block such that a plurality of unit lamination structures of the conductive patterns having a meander line structure in the direction of the Z-axis in an XZ plane are arranged in the direction of the Y axis while adjacent unit lamination structures are connected to each other, forming a lamination structure having the meander line structure in the directions of the Y-axis, and the plurality of lamination structures are arranged in the direction of the X-axis and adjacent lamination structures are connected to each other in the direction of the X-axis to have the meander line structure, and a T-shaped assistant antenna device formed at an upper or lower dielectric layer in the main antenna device.Type: GrantFiled: July 20, 2004Date of Patent: February 21, 2006Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hyun Hak Kim, Chul Ho Kim, Gi Tae Do, Il Hwan Park, Jeong Sik Seo
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Patent number: 6992633Abstract: Disclosed herein is a multi-layered chip antenna using double coupling feeding.Type: GrantFiled: June 3, 2004Date of Patent: January 31, 2006Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hyun Hak Kim, Chul Ho Kim, Gi Tae Do, Jeong Sik Seo, Il Hwan Park