Patents by Inventor Jeong-su Kim

Jeong-su Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10513433
    Abstract: The present disclosure discloses the laminated ceramic chimp component including an element part having a ceramic main body and an internal electrode placed in the ceramic main body; an external electrode part having a first external electrode and a second external electrode, the first and second external electrodes being provided with side electrodes covering both side surfaces of the ceramic main body, respectively, upper electrodes covering portions of both sides of an upper surface of the ceramic main body, respectively, and lower electrodes covering portions of both sides of a lower surface of the ceramic main body, respectively; and a nano thin film layer formed of electric insulation material and applied to a region including the upper electrodes, the method for manufacturing the same and the atomic layer deposition apparatus for the same.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: December 24, 2019
    Assignees: HONGIK UNIVERSITY INDUSTRY-ACADEMIC CORPORATION FOUNDATION, MAX TECH CO., LTD.
    Inventors: Jin Ha Hwang, Dae Bum Park, Yong Jo Choo, Hyun Suk Kim, Da Hee Park, Myeong Hee Ko, Kyoung Woo Kwon, Hee Su Hwang, Jeong Wan Choi
  • Patent number: 10506911
    Abstract: Disclosed herein is a dishwasher including a spray unit fixed to one sidewall of a wash tub and a reflecting plate assembly to reflect wash water sprayed from the spray unit onto dishes and to linearly reciprocate in a spray direction of the wash water sprayed from the spray unit. The dishwasher further includes a drive unit to drive the reflecting plate assembly, and a cam unit to transmit driving force of the drive unit to the reflecting plate assembly. The drive unit includes a motor to generate rotational force, and a belt forming a closed loop and caused to make cyclic movement by the motor. The cam unit is engaged with the belt to transmit power of the belt to the reflecting plate assembly. The cam is alternately engaged with first and second portions of the belt to cause the reflecting plate assembly to reciprocate.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: December 17, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chan Young Park, Chang Wook Lee, Seung Gee Hong, Young Su Ser, Soo Hyung Yoo, Kwan Woo Hong, Yong Soo Kyong, Jea Won Lee, Dae Uk Kang, Jeong Hoon Kang, Sung Jin Kim
  • Patent number: 10504825
    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion having a stopper layer; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is connected to the stopper layer; first metal bumps disposed on the connection pads; second metal bumps disposed on an uppermost wiring layer of the wiring layers; an encapsulant covering at least portions of each of the frame, the semiconductor chip, and the first and second metal bumps and filling at least portions of the recess portion; and a connection member disposed on the frame and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads and the uppermost wiring layer through the first and second metal bumps.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: December 10, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeong Il Lee, Jeong Ho Lee, Jin Su Kim, Bong Ju Cho
  • Publication number: 20190367731
    Abstract: A heat-resistant composition including: a binder resin including at least two of a silicone-modified polyester resin, a siloxane compound, or a silanol compound; a pigment including at least two of iron cobalt chromite black spinel (ICCB), copper chromite black spinel (CCB), iron chromite manganese (ICM), or carbon black; and a catalyst.
    Type: Application
    Filed: May 29, 2019
    Publication date: December 5, 2019
    Inventors: Jin Nyoung HEO, Hyuck KANG, Dae Hwan KIM, Jeong Su OH, Jong Kap JO, Yu Sik JEON, Jae Seung JEON
  • Patent number: 10491019
    Abstract: A battery management system (BMS) may include a battery, a relay configured to electrically connect and disconnect the battery for supplying a voltage (an electric power) to an electric load to and from the electric load, the electric load configured to receive the voltage (the electric power) from the battery, to compare the received voltage (the electric power) with a reference value and to output a wakeup signal according to the compared result, when the relay is electrically connected, and a controller configured to wake up by the wakeup signal, to monitor a state of the battery and to control a state of the relay. It is possible to prevent overdischarge and overcharge of the battery by monitoring the battery through the electric load in a state in which a vehicle is turned off and switching the BSM to a wakeup state only if necessary.
    Type: Grant
    Filed: December 13, 2016
    Date of Patent: November 26, 2019
    Assignee: Hyundai Motor Company
    Inventors: Hyo Sik Moon, Jun Ho Bang, Woo Sung Kim, Kyung In Min, Jae Hoon Choi, Jin Wook Kim, Dong II Kim, Ji Won Nam, Yong Hwan Choi, Yoon Jun Lee, Jeong Hun Seo, Hui Tae Yang, Jun Seok Choi, Yu Seok Kim, Jung Je Woo, Byung Su Kim, Yong Jae Kim, Kyung Ho Kim, Suk Hyung Kim, Hae Kyu Lim
  • Patent number: 10482151
    Abstract: An electronic device and method are disclosed. The method is operable on the electronic device to parse attribute information of an electronic document displayed on a display unit of the electronic device, and when a component of the electronic document is activated, detect a format of the activated component based on the parsed attribute information, and when the detected format indicates visual media, output an alternative notification comprising at least one a notification in a different format than the detected format.
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: November 19, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-Jae Kim, Myung-Su Kang, Jeong-Yong Kim, Jung-Won Kim, Sang-Bae Shin
  • Patent number: 10479822
    Abstract: The present invention relates to a fusion protein in which transferrin is peptide-bonded to a terminal of a granulocyte-colony stimulating factor (G-CSF) protein or a G-CSF mutant protein in which the 116th threonine is substituted with cysteine in the amino acid sequence of the G-CSF. Specifically, the granulocyte-colony stimulating factor (G-CSF) mutant protein of the present invention or the transferrin fusion protein thereof displays a significantly increased specific activity and blood stability, compared with the conventional human G-CSF, and has a higher purification efficiency than the conventional PEGylated G-CSF characterized by the extended half-life, so that it can be advantageously used for preventing or treating ischemic diseases or neutropenia.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: November 19, 2019
    Assignee: SUPEX BNP CO., LTD.
    Inventors: Jeong-Hyeok Yoon, Byung-Ha Chang, Bong-Seok Jin, Ji Young Bae, Soon Nam Kim, Kyeong Su Park, Yeong kyu Park, Hanjo Kim, Youngju Seo, Wooseong Jeong, KyungTae Kang
  • Publication number: 20190348727
    Abstract: Disclosed is a battery module, which includes: at least one battery cell having electrode leads protruding at first and second opposite sides thereof; and at least one cell case each covering the first and second sides and an upper side of a corresponding one of the at least one battery cell and each including a pair of bus bars each having one end connected to a corresponding one of the electrode leads and another end exposed at an upper side of the cell case.
    Type: Application
    Filed: April 3, 2018
    Publication date: November 14, 2019
    Applicant: LG Chem, Ltd.
    Inventors: Ji-Su Yoon, Dal-Mo Kang, Su-Chang Kim, Jeong-O Mun, Jae-Uk Ryu, Ho-June Chi
  • Patent number: 10475748
    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion having a stopper layer; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is connected to the stopper layer; a first encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; an electronic component disposed on the other surface of the frame opposing one surface of the frame in which the semiconductor chip is disposed; a second encapsulant covering at least portions of the electronic component; and a connection member disposed on the frame and an active surface of the semiconductor chip and including a redistribution layer, wherein the connection pads and the electronic component are electrically connected to each other through the wiring layers and the redistribution layer.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: November 12, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeong Ho Lee, Myung Sam Kang, Young Gwan Ko, Shang Hoon Seo, Jin Su Kim
  • Patent number: 10462596
    Abstract: An audio apparatus and a method of processing an audio signal of the audio apparatus are provided. The method includes: receiving a main audio and an interactive audio; panning the interactive audio by using position information of a user, sound source position information of the interactive audio, and speaker position information; rendering the panned interactive audio according to a space characteristic of the main audio; and mixing and outputting the rendered interactive audio and the main audio to provide the user with a more lively interactive audio.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: October 29, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-bae Chon, Sun-min Kim, Jae-ha Park, Hyun-min Kim, Jeong-su Kim
  • Patent number: 10457790
    Abstract: A method of manufacturing a polishing pad includes producing an urethane prepolymer having a viscosity of 20,000 cps (at 25° C.) to 40,000 cps (at 25° C.) by mixing a plurality of polymers, mixing the urethane prepolymer with an inert gas and a low-boiling blowing agent having a boiling point of 60° C. to 150° C., and manufacturing a polishing layer including porous pores by causing a mixture produced at the mixing to be subjected to gelation and curing in a predetermined cast.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: October 29, 2019
    Assignee: KPX CHEMICAL CO., LTD.
    Inventors: Seung-Geun Kim, Hak-Su Kang, Jeong-Seon Choo, Dae-Han Jung, Gi-Young Park
  • Publication number: 20190323973
    Abstract: An inspection apparatus for a semiconductor process and a semiconductor process device, the inspection apparatus including a transferer configured to transfer a process object between a plurality of chambers; at least one line camera installed above the transferer, the at least one line camera being configured to generate an original image by capturing an image of the process object transferred by the transferer; and a controller configured to receive the original image and to perform an inspection of the process object by correcting distortion of the original image due to a change in transfer speed of the transferer.
    Type: Application
    Filed: January 8, 2019
    Publication date: October 24, 2019
    Inventors: Myung Ho JUNG, Young Su RYU, Sung Chai KIM, Jong Su KIM, Won Guk SEO, Chang Hoon CHOI, Jeong Su HA
  • Patent number: 10453788
    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers disposed on the insulating layers, and connection via layers penetrating through the insulating layers and electrically connecting the wiring layers to each other, and having a recess portion; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is connected to the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; and a connection member disposed on the frame and an active surface of the semiconductor chip and including one or more redistribution layers electrically connecting the wiring layers and the connection pads to each other, in which the recess portion includes walls having different inclined angles.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: October 22, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeong II Lee, Jeong Ho Lee, Jin Su Kim, Bong Ju Cho
  • Patent number: 10421845
    Abstract: A method of manufacturing a polishing pad includes producing an urethane prepolymer having a viscosity of 20,000 cps (at 25° C.) to 40,000 cps (at 25° C.) by mixing a plurality of polymers, mixing the urethane prepolymer with an inert gas and a low-boiling blowing agent having a boiling point of 60° C. to 150° C., and manufacturing a polishing layer including porous pores by causing a mixture produced at the mixing to be subjected to gelation and curing in a predetermined cast.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: September 24, 2019
    Assignee: KPX CHEMICAL CO., LTD.
    Inventors: Seung-Geun Kim, Hak-Su Kang, Jeong-Seon Choo, Dae-Han Jung, Gi-Young Park
  • Publication number: 20190284054
    Abstract: The present disclosure provides a polyimide film prepared from a precursor composition containing a polyamic acid and an organic solvent and having a value of (first FWHM?second FWHM)/(first FWHM+second FWHM) which is less than 0.4, a graphite sheet prepared from the polyimide film, and a method for preparing a graphite sheet.
    Type: Application
    Filed: May 31, 2019
    Publication date: September 19, 2019
    Inventors: Dong Young WON, Kyung Su KIM, Sung Il CHO, Jeong Yeul CHOI
  • Publication number: 20190288229
    Abstract: An electroluminescent device, a method of manufacturing the same, and a display device including the same. The electroluminescent device includes a first electrode and a second electrode facing each other; an emission layer disposed between the first electrode and the second electrode, the emission layer including light emitting particles; an electron transport layer disposed between the first electrode and the emission layer; and a hole transport layer disposed between the second electrode and the emission layer, wherein the electron transport layer includes inorganic oxide particles and a metal-organic compound, the metal-organic compound or a thermal decomposition product of the metal-organic compound being soluble a non-polar solvent.
    Type: Application
    Filed: March 13, 2019
    Publication date: September 19, 2019
    Inventors: Sung Woo KIM, Chan Su KIM, Tae Ho KIM, Kun Su PARK, Eun Joo JANG, Jin A KIM, Tae Hyung KIM, Jeong Hee LEE
  • Patent number: 10416193
    Abstract: An apparatus and method of removing common mode noise in the case of measuring a biosignal using a capacitive coupling active electrode (CCE) is provided. A frequency band of a common mode signal may interact with a shield voltage and thus, a frequency band of a biosignal may be compensated for.
    Type: Grant
    Filed: August 7, 2014
    Date of Patent: September 17, 2019
    Assignees: Samsung Electronics Co., Ltd., SNU R&DB Foundation
    Inventors: Youn Ho Kim, Jae Min Kang, Kun Soo Shin, Kwang Suk Park, Jeong Su Lee, Yong Gyu Lim
  • Patent number: 10410961
    Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion and a stopper layer disposed on a bottom surface of the recess portion; a semiconductor chip disposed in the recess portion, and having connection pads, an active surface on which the connection pads are disposed, and an inactive surface opposing the active surface and disposed on the stopper layer; an encapsulant covering at least portions of the semiconductor chip and filling at least portions of the recess portion; and a connection member disposed on the frame and the active surface of the semiconductor chip and including a redistribution layer electrically connecting the plurality of wiring layers of the frame and the connection pads of the semiconductor chip to each other. The active surface of the semiconductor chip and an upper surface of the encapsulant have a step portion therebetween.
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: September 10, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeong Ho Lee, Myung Sam Kang, Young Gwan Ko, Jin Su Kim, Shang Hoon Seo, Jeong Il Lee
  • Patent number: 10405124
    Abstract: An audio apparatus and an audio providing method thereof are provided. The audio providing method includes receiving an audio signal including a plurality of channels, applying an audio signal having a channel, from among the plurality of channels, giving a sense of elevation to a filter to generate a plurality of virtual audio signals to be respectively output to a plurality of speakers, applying a combination gain value and a delay value to the plurality of virtual audio signals so that the plurality of virtual audio signals respectively output through the plurality of speakers form a sound field having a plane wave, and respectively outputting the plurality of virtual audio signals, to which the combination gain value and the delay value are applied, through the plurality of speakers. The filter processes the audio signal to have a sense of elevation.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: September 3, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-bae Chon, Sun-min Kim, Hyun Jo, Jeong-su Kim
  • Patent number: 10387981
    Abstract: Disclosed are a system and method for confidentially issuing and managing a delivery waybill that enables a customer to order and receive merchandise without inputting actual personal information of the customer every time in every online shopping mall providing merchandise that the customer wishes to purchase and that is capable of preventing the leakage of the personal information of the customer, which may occur in an online shopping mall, a merchandise supply company, etc., wherein virtual personal information, rather than the actual personal information of the customer, is used in the online shopping mall, and access account information, a customer order number, and order status information are confirmed in order to prevent illegal issuance of a delivery waybill, whereby the system for confidentially issuing and managing the delivery waybill can be operated in an independent and safe manner.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: August 20, 2019
    Assignee: K CLOUD CO., LTD.
    Inventors: Nam Seob Jo, Chan Heui Park, Han Joo Kim, Kwang Su Woo, Jeong Ho Ko