Abstract: An acoustic resonator and a method of manufacturing the same are provided. The acoustic resonator includes a resonating part including a first electrode, a second electrode, and a piezoelectric layer; and a plurality of seed layers disposed on one side of the resonating part.

Abstract: An electronic component includes an electronic component main body including a body and an external electrode disposed on the body. The body includes a dielectric layer and an internal electrode. The electronic component further includes a coating portion including a coating layer, disposed on an external surface of the electronic component main body, and a plurality of projections disposed on the coating layer.

Abstract: A coil component includes a body having a bottom surface and a top surface opposing each other in one direction, and a plurality of walls each connecting the bottom surface to the top surface of the body; recesses respectively formed in both front and rear surfaces of the body opposing each other among the plurality of walls of the body and extending up to the bottom surface of the body; a coil portion buried in the body and including first and second lead-out portions exposed to internal walls and lower ledge surfaces of the recesses; first and second external electrodes respectively including connection portions disposed in the recesses and extended portions disposed on the bottom surface of the body, and connected to the coil portion; a shielding layer including a cap portion disposed on the top surface of the body and side wall portions respectively disposed on the plurality of walls of the body; and an insulating layer disposed between the body and the shielding layer and extending onto lower ledge surfa

Abstract: An electronic component includes an electronic component main body including a body and an external electrode disposed on the body. The body includes a dielectric layer and an internal electrode. The electronic component further includes a coating portion including a coating layer, disposed on an external surface of the electronic component main body, and a plurality of projections disposed on the coating layer.

Abstract: A capacitor component includes: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween; first and second external electrodes including first and second connection portions, and first and second band portions extending onto portions of a surface from the first and second connection portions, respectively; first and second plating layers disposed on the first and second band portions, respectively; humidity resistant layers disposed between the first and second external electrodes, disposed on the first and second external electrodes, and having openings respectively exposing portions of the first and second band portions. The first and second plating layers are disposed in the openings of the humidity resistant layers, respectively, and are in contact with the first and second band portions, respectively.

Abstract: A capacitor component includes a humidity resistant layer formed on a portion of the external surface of a body on which an external electrode is not formed, and further includes a humidity resistant layer disposed inside the external electrode, to improve humidity resistance reliability. The capacitor component includes an opening portion formed by removing a portion of the humidity resistant layer disposed inside the external electrode to improve electrical connection.

Abstract: An acoustic resonator includes a substrate having via holes provided therein and having a membrane structure formed on a first surface of the substrate, and a cap accommodating the membrane structure and bonded to the substrate. The cap includes a support block in contact with the membrane structure.

Abstract: The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides of the bonding portion.

Abstract: A capacitor component includes a dielectric including a first main surface and a second main surface facing each other, and at least one end surface that connects the first main surface and the second main surface, the dielectric being vertically disposed by positioning the at least one end surface on a lower surface of the capacitor component, and a first electrode and a second electrode that are disposed on the first main surface and the second main surface of the dielectric, respectively, wherein a size of each of the first electrode and the second electrode is greater than a size of the dielectric.

Abstract: An acoustic wave device includes an acoustic wave generator formed on one surface of a substrate; a support member formed on the one surface of the substrate spaced apart from the acoustic wave generator; a protective member coupled to the support member and disposed to be spaced apart from the acoustic wave generator; and a sealing part encapsulating the protective member and the support member, wherein the sealing part includes one, or a plurality of, first hermetic layer(s) and one, or a plurality of, second hermetic layer(s), and the first hermetic layer(s) and the second hermetic layer(s) are alternately stacked.

Abstract: An electronic component includes: a body having electrical insulating properties; an external electrode disposed on an external surface of the body; and a reinforcing layer disposed on a surface of the body and including a metal oxide layer and a graphene oxide layer.

Abstract: An aerogel capacitor includes: a substrate including a capacitor structure including an aerogel, a dielectric layer and a conductive layer, and a support surrounding the capacitor structure; and an electrode unit including a first electrode and a second electrode provided on the substrate. The first electrode is connected to the aerogel and the second electrode is connected to the conductive layer.

Abstract: An acoustic resonator and a method of manufacturing the same are provided. The acoustic resonator includes a resonating part including a first electrode, a second electrode, and a piezoelectric layer; and a plurality of seed layers disposed on one side of the resonating part.

Abstract: A capacitor component includes: a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween; first and second external electrodes including first and second connection portions, and first and second band portions extending onto portions of a surface from the first and second connection portions, respectively; first and second plating layers disposed on the first and second band portions, respectively; humidity resistant layers disposed between the first and second external electrodes, disposed on the first and second external electrodes, and having openings respectively exposing portions of the first and second band portions. The first and second plating layers are disposed in the openings of the humidity resistant layers, respectively, and are in contact with the first and second band portions, respectively.

Abstract: An acoustic resonator and a method of manufacturing the same are provided. The acoustic resonator includes a resonating part including a first electrode, a second electrode, and a piezoelectric layer; and a plurality of seed layers disposed on one side of the resonating part.

Abstract: A coil component includes a body having a bottom surface and a top surface opposing each other in one direction, and a plurality of walls each connecting the bottom surface to the top surface of the body; recesses respectively formed in both front and rear surfaces of the body opposing each other among the plurality of walls of the body and extending up to the bottom surface of the body; a coil portion buried in the body and including first and second lead-out portions exposed to internal walls and lower ledge surfaces of the recesses; first and second external electrodes respectively including connection portions disposed in the recesses and extended portions disposed on the bottom surface of the body, and connected to the coil portion; a shielding layer including a cap portion disposed on the top surface of the body and side wall portions respectively disposed on the plurality of walls of the body; and an insulating layer disposed between the body and the shielding layer and extending onto lower ledge surfa

Abstract: A capacitor component includes a humidity resistant layer formed on a portion of the external surface of a body on which an external electrode is not formed, and further includes a humidity resistant layer disposed inside the external electrode, to improve humidity resistance reliability. The capacitor component includes an opening portion formed by removing a portion of the humidity resistant layer disposed inside the external electrode to improve electrical connection.

Abstract: A capacitor component includes a dielectric including a first main surface and a second main surface facing each other, and at least one end surface that connects the first main surface and the second main surface, the dielectric being vertically disposed by positioning the at least one end surface on a lower surface of the capacitor component, and a first electrode and a second electrode that are disposed on the first main surface and the second main surface of the dielectric, respectively, wherein a size of each of the first electrode and the second electrode is greater than a size of the dielectric.

Abstract: An aerogel capacitor includes: a substrate including a capacitor structure including an aerogel, a dielectric layer and a conductive layer, and a support surrounding the capacitor structure; and an electrode unit including a first electrode and a second electrode provided on the substrate. The first electrode is connected to the aerogel and the second electrode is connected to the conductive layer.

Abstract: An acoustic wave filter device includes a base having an acoustic wave filter part and a bonding part disposed thereon, the bonding part surrounding the acoustic wave filter part, and a cap having a bonding counterpart disposed thereon, the bonding counterpart being bonded to the bonding part of the base, and the bonding part includes a first bonding layer including gold, and the bonding counterpart includes a second bonding layer bonded to the first bonding layer and including tin.