Abstract: An insert module for a test handler includes an insert body and a support frame. The insert body has a receiving space for receiving a semiconductor device. The semiconductor device having connection pads protruding externally from a surface of the semiconductor device. The support frame is formed in an inner side portion of the insert body defining the receiving space to provide a seating surface for contacting and supporting the semiconductor device. The support frame includes a fixing frame and a guide pattern. The fixing frame is inserted into and fixed with the insert body and defines an opening that exposes the semiconductor device. The guide pattern extends from the fixing frame to the inside of the opening to contact the semiconductor device and guide the connection pads.