Patents by Inventor Jeong Won Kang

Jeong Won Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240123133
    Abstract: The present invention relates to a device capable of wrapping the outer wall of a blood vessel, and a method for manufacturing the device. If the device for wrapping the outer wall of a blood vessel of the present invention is used, the outer wall of a blood vessel is wrapped, and, thereby, vortex generation can be significantly decreased by controlling abnormal expansion of the blood vessel which can occur due to the difference in the characteristics of blood vessels in a vein-artery graft model. The present invention saves a blood vessel from a low-oxygen state by promoting generation of new blood vessels on the outer wall of the blood vessel via a regenerative inflammatory response caused by the material of the device, and provides synergy effects such as prevention of vascular stenosis and reinforcement of an outer muscular layer by guiding venous muscular cells to the outside.
    Type: Application
    Filed: October 19, 2020
    Publication date: April 18, 2024
    Inventors: Mi-Lan KANG, Se Won YI, Jeong-Kee YOON, Dae-Hyun KIM
  • Publication number: 20240105314
    Abstract: A computing apparatus includes: at least one memory; and at least one processor, wherein the processor generates quantitative information regarding at least one cell included in a region of interest of a pathological slide image by analyzing the pathological slide image, generates qualitative information regarding at least one tissue included in the pathological slide image by analyzing the pathological slide image, and controls a display apparatus to output at least one of the quantitative information and the qualitative information on the pathological slide image according to a manipulation of a user.
    Type: Application
    Filed: December 7, 2023
    Publication date: March 28, 2024
    Applicant: LUNIT INC.
    Inventors: Jeong Seok KANG, Jae Hong AUM, Dong Geun YOO, Tai Won CHUNG
  • Patent number: 11923562
    Abstract: A battery module includes: a battery cell assembly having a plurality of battery cells; a top plate configured to cover an upper side of the battery cell assembly; a bottom plate configured to cover a lower side of the battery cell assembly; a sensing assembly disposed to cover a front side and a rear side of the battery cell assembly; a pair of side plates disposed at side surfaces, respectively, of the battery cell assembly; and a pair of compression pads disposed between the pair of side plates and the battery cell assembly, respectively.
    Type: Grant
    Filed: November 1, 2022
    Date of Patent: March 5, 2024
    Assignee: LG Energy Solution, Ltd.
    Inventors: Sung-Won Seo, Dong Yeon Kim, Ho-June Chi, Dal-Mo Kang, Jin-Hak Kong, Jeong-O Mun, Yoon-Koo Lee, Yong-Seok Choi, Alexander Eichhorn, Andreas Track
  • Patent number: 11923426
    Abstract: A semiconductor device capable of improving a device performance and a reliability is provided. The semiconductor device comprising a gate structure including a gate electrode on a substrate, a source/drain pattern on a side face of the gate electrode, on the substrate and, a source/drain contact connected to the source/drain pattern, on the source/drain pattern, a gate contact connected to the gate electrode, on the gate electrode, and a wiring structure connected to the source/drain contact and the gate contact, on the source/drain contact and the gate contact, wherein the wiring structure includes a first via plug, a second via plug, and a wiring line connected to the first via plug and the second via plug, the first via plug has a single conductive film structure, and the second via plug includes a lower via filling film, and an upper via filling film on the lower via filling film.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: March 5, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji Won Kang, Tae-Yeol Kim, Jeong Ik Kim, Rak Hwan Kim, Jun Ki Park, Chung Hwan Shin
  • Publication number: 20230023553
    Abstract: A method of combining compressed uplink signals according to one aspect of the present disclosure is a method of combining IQ data of uplink signals compressed without decompression by a block floating point compression method, a block scaling compression method, or a -law compression method.
    Type: Application
    Filed: April 24, 2022
    Publication date: January 26, 2023
    Applicant: SOLiD, Inc.
    Inventors: Ho Sik JANG, Hoo Pyo HONG, Woo Jae KIM, Dong Hee KWON, Jeong Won KANG
  • Publication number: 20230017897
    Abstract: A fronthaul multiplexer according to one aspect of the present invention combines uplink packets in a compressed state that is received from two or more radio units so that the uplink packets are accumulated and combined immediately when received or the uplink packets are recompressed using a compressing method with high compression efficiency when stored in a memory in order to reduce a use amount of memory.
    Type: Application
    Filed: April 24, 2022
    Publication date: January 19, 2023
    Applicant: SOLiD, Inc.
    Inventors: Ho Sik JANG, Hoo Pyo HONG, Woo Jae KIM, Dong Hee KWON, Jeong Won KANG
  • Patent number: 10089066
    Abstract: An electronic apparatus of an audio output system is provided. The electronic apparatus includes: a first communicator configured to transmit a first radio signal and receive a first response signal; a second communicator configured to transmit a second radio signal and receive a second response signal; and a processor configured to: determine a first distance between the first communicator and an audio output apparatus based on the first response signal, determine a second distance between the second communicator and the audio output apparatus based on the second response signal, determine a location of the audio output apparatus based on the first distance and the second distance; establish a communication connection with the audio output apparatus based on one from among the first response signal and the second response signal; and set a channel of the audio output apparatus based on the determined location of the audio output apparatus.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: October 2, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeong-won Kang, Chang-seog Ko
  • Publication number: 20180165054
    Abstract: An electronic apparatus of an audio output system is provided. The electronic apparatus includes: a first communicator configured to transmit a first radio signal and receive a first response signal; a second communicator configured to transmit a second radio signal and receive a second response signal; and a processor configured to: determine a first distance between the first communicator and an audio output apparatus based on the first response signal, determine a second distance between the second communicator and the audio output apparatus based on the second response signal, determine a location of the audio output apparatus based on the first distance and the second distance; establish a communication connection with the audio output apparatus based on one from among the first response signal and the second response signal; and set a channel of the audio output apparatus based on the determined location of the audio output apparatus.
    Type: Application
    Filed: June 29, 2017
    Publication date: June 14, 2018
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jeong-won KANG, Chang-seog KO
  • Publication number: 20110248378
    Abstract: A semiconductor device is disclosed. The semiconductor device includes a first line, a second line spaced apart from the first line, a contact formed over the first line and the second line, a fuse coupled to the contact, and a dummy pattern configured to couple the fuse to the contact.
    Type: Application
    Filed: December 17, 2010
    Publication date: October 13, 2011
    Applicant: Hynix Semiconductor Inc.
    Inventors: Hwa Chul LEE, Jeong Won Kang