Patents by Inventor Jeong-Wook Ko

Jeong-Wook Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Image sensor and method of manufacturing the same
    Patent number: 8334554
    Abstract: An image sensor includes a first region of a substrate having photoelectric conversion elements formed therein, and includes a second region of the substrate outside of the first region. The image sensor includes a plurality of lenses, a plurality of embossing structures, and a protective layer. The lenses are formed over the first region. The embossing structures are formed over the second region, and the embossing structures are separated from each-other. The protective layer is formed over the lenses and the embossing structures that prevent crack propagation.
    Type: Grant
    Filed: March 4, 2009
    Date of Patent: December 18, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Kwan Kim, June-Taeg Lee, Jeong-Wook Ko, Jung-Saeng Kim
  • Methods of manufacturing an image sensor
    Patent number: 8119437
    Abstract: The method of manufacturing an image sensor includes providing a semiconductor substrate including a first pixel region, first forming a first pattern on the first pixel region, first performing a reflow of the first pattern to form a sub-micro lens on the first pixel region, second forming a second pattern on the sub-micro lens, and second performing a reflow of the second pattern to form a first micro lens covering the sub-micro lens.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: February 21, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung-Saeng Kim, June-Taeg Lee, Sung-Kwan Kim, Jeong-Wook Ko
  • Methods of manufacturing an image sensor
    Publication number: 20100009493
    Abstract: The method of manufacturing an image sensor includes providing a semiconductor substrate including a first pixel region, first forming a first pattern on the first pixel region, first performing a reflow of the first pattern to form a sub-micro lens on the first pixel region, second forming a second pattern on the sub-micro lens, and second performing a reflow of the second pattern to form a first micro lens covering the sub-micro lens.
    Type: Application
    Filed: June 30, 2009
    Publication date: January 14, 2010
    Inventors: Jung-Saeng Kim, June-Taeg Lee, Sung-Kwan Kim, Jeong-Wook Ko
  • Image sensor and method of manufacturing the same
    Publication number: 20090224347
    Abstract: An image sensor includes a first region of a substrate having photoelectric conversion elements formed therein, and includes a second region of the substrate outside of the first region. The image sensor includes a plurality of lenses, a plurality of embossing structures, and a protective layer. The lenses are formed over the first region. The embossing structures are formed over the second region, and the embossing structures are separated from each-other. The protective layer is formed over the lenses and the embossing structures that prevent crack propagation.
    Type: Application
    Filed: March 4, 2009
    Publication date: September 10, 2009
    Inventors: Sung-Kwan Kim, June-Taeg Lee, Jeong-Wook Ko, Jung-Saeng Kim