Patents by Inventor Jeong Wook

Jeong Wook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10923284
    Abstract: A capacitor component includes a body including dielectric layers and internal electrodes alternately arranged with the dielectric layers; and external electrodes including electrode layers disposed on the body and connected to the internal electrodes, first conductive resin layers disposed on the electrode layers, and second conductive resin layers disposed on the first conductive resin layers, wherein the first and second conductive resin layers include a metal powder and a base resin, the first conductive resin layers have a lower metal powder content than the second conductive resin layers, the metal powder includes one or more of flake-type powder particle and spherical-type powder particle, and a weight ratio of the flake-type powder particle in the metal powder contained in the first conductive resin layers is 60% or more, and a weight ratio of the spherical-type powder particle in the metal powder contained in the second conductive resin layers is 50% or more.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: February 16, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Geum Hee Yun, Hwa Young Lee, Kwan Yeol Paek, Jeong Wook Seo, Ha Yong Jung
  • Patent number: 10907229
    Abstract: A hot-work mold steel includes 0.37 to 0.46 wt % of carbon (C), 0.25 to 0.5 wt % of silicon (Si), 0.36 to 0.56 wt % of manganese (Mn), 2.0 to 5.0 wt % of chromium (Cr), 1.4 to 2.6 wt % of molybdenum (Mo), 0.4 to 0.8 wt % of vanadium (V), 0.0007 to 0.004 wt % of boron (B), 0.002 to 0.022 wt % of aluminum (Al), 0.001 to 0.09 wt % of titanium (Ti) and the remainder of iron (Fe) and inevitable impurities. The hot-work mold steel exhibits superior thermal conductivity, hardenability, durability, and nitriding characteristics, and increased resistance to heat check and melt-out. A die-casting mold made of the steel has improved thermal conductivity regardless of mold size and a prolonged life cycle and can improve the surface quality in manufactured parts.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: February 2, 2021
    Assignee: Doosan Heavy Industries Construction Co., Ltd
    Inventors: Kuk Cheol Kim, Byoung Koo Kim, Jeong Wook Kim, Jae Suk Jeong
  • Publication number: 20200395779
    Abstract: An apparatus and method for preventing overcharge of a secondary battery that prevents the overcharge of a Starting Lighting Ignition (SLI) battery, which can be applied to both a regulated system with a voltage regulator and an unregulated system without a voltage regulator, by regulating the voltage applied to the cell assembly.
    Type: Application
    Filed: September 27, 2019
    Publication date: December 17, 2020
    Applicant: LG CHEM, LTD.
    Inventors: Jung-Hyun NAM, Jeong-Wook KIM, Wong-Ki YOON, Suk-Hoon LEE
  • Publication number: 20200343759
    Abstract: The present invention relates to a voltage recognition system of a starting battery and a method of recognizing an off state of an external system using the same, and more particularly, to a driving system of a starting battery and a method of recognizing an off state of an external system using the same, which make it possible to start an engine next time by recognizing the off state of the external system in an overvoltage state according to whether there occurs a difference between values of voltages measured by two ADCs having different positions of ground GND without requiring a current sensor.
    Type: Application
    Filed: September 25, 2019
    Publication date: October 29, 2020
    Applicant: LG CHEM, LTD.
    Inventors: Sung Ju HONG, Jeong Wook KIM, Jung Hyun NAM
  • Patent number: 10804740
    Abstract: A wireless power receiver can include a magnetic substrate and a coil configured to wirelessly receive power. The coil can be formed as a conductive layer on the magnetic substrate. A connecting unit can be disposed in a receiving space of the magnetic substrate and can be connected to the coil unit.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: October 13, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jeong Wook An, Jung Oh Lee, Sung Hyun Leem, Yang Hyun Kim
  • Publication number: 20200244106
    Abstract: A wireless power reception device can include a first shielding member; a second shielding member; a short-range communication coil on the first shielding member; a wireless charging coil on the second shielding member; and a hole outside the wireless charging coil, in which the hole penetrates through the first shielding member.
    Type: Application
    Filed: April 10, 2020
    Publication date: July 30, 2020
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Jeong Wook AN, Hyoung Rae KIM, Dong Hyuk LEE
  • Publication number: 20200181724
    Abstract: A hot-work mold steel includes 0.37 to 0.46 wt % of carbon (C), 0.25 to 0.5 wt % of silicon (Si), 0.36 to 0.56 wt % of manganese (Mn), 2.0 to 5.0 wt % of chromium (Cr), 1.4 to 2.6 wt % of molybdenum (Mo), 0.4 to 0.8 wt % of vanadium (V), 0.0007 to 0.004 wt % of boron (B), 0.002 to 0.022 wt % of aluminum (Al), 0.001 to 0.09 wt % of titanium (Ti) and the remainder of iron (Fe) and inevitable impurities. The hot-work mold steel exhibits superior thermal conductivity, hardenability, durability, and nitriding characteristics, and increased resistance to heat check and melt-out. A die-casting mold made of the steel has improved thermal o conductivity regardless of mold size and a prolonged life cycle and can improve the surface quality in manufactured parts.
    Type: Application
    Filed: January 9, 2020
    Publication date: June 11, 2020
    Inventors: Kuk Cheol KIM, Byoung Koo KIM, Jeong Wook KIM, Jae Suk JEONG
  • Publication number: 20200185153
    Abstract: A capacitor component includes a body including dielectric layers and internal electrodes alternately arranged with the dielectric layers; and external electrodes including electrode layers disposed on the body and connected to the internal electrodes, first conductive resin layers disposed on the electrode layers, and second conductive resin layers disposed on the first conductive resin layers, wherein the first and second conductive resin layers include a metal powder and a base resin, the first conductive resin layers have a lower metal powder content than the second conductive resin layers, the metal powder includes one or more of flake-type powder particle and spherical-type powder particle, and a weight ratio of the flake-type powder particle in the metal powder contained in the first conductive resin layers is 60% or more, and a weight ratio of the spherical-type powder particle in the metal powder contained in the second conductive resin layers is 50% or more.
    Type: Application
    Filed: June 14, 2019
    Publication date: June 11, 2020
    Inventors: Geum Hee YUN, Hwa Young LEE, Kwan Yeol PAEK, Jeong Wook SEO, Ha Yong JUNG
  • Publication number: 20200176689
    Abstract: Provided is a compound of Chemical Formula 1 or 2: wherein: X1 to X3 are N or CH, with the proviso that at least one of X1 to X3 is N; Y is O or S; L1 and L2 are each independently a single bond or a substituted or unsubstituted C6-60 arylene; and Ar is a substituted or unsubstituted C1-60 alkyl, a substituted or unsubstituted C1-60 haloalkyl, a substituted or unsubstituted C3-60 cycloalkyl, a substituted or unsubstituted C6-60 aryl, or a substituted or unsubstituted C2-60 heteroaryl containing one to three heteroatoms selected from the group consisting of N, O, and S, and an organic light emitting device including the same.
    Type: Application
    Filed: August 31, 2018
    Publication date: June 4, 2020
    Inventors: Min Woo JUNG, Min Young KANG, Tae Yoon PARK, Seong Mi CHO, Jeong Wook MUN, Jung Ha LEE, Mi Young CHAE
  • Patent number: 10673141
    Abstract: Disclosed is an antenna assembly including a substrate, and a wireless charge antenna pattern on the substrate. The wireless charge antenna pattern has a sectional surface including a plurality of inner angles in which two inner angles are different from each other. The antenna assembly includes a wireless communication antenna pattern formed on the substrate and provided at an outside of the wireless charge antenna pattern. The wireless communication antenna pattern has a plurality of inner angles at a sectional surface thereof, and a plurality of angle values of the inner angles provided at the sectional surface of the wireless communication antenna pattern correspond to a plurality of angle values of the inner angles provided at the sectional surface of the wireless charge antenna pattern, respectively.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: June 2, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jeong Wook An, Jung Oh Lee, Yang Hyun Kim, Ki Min Lee, Hye Min Lee, Sung Hyun Leem, Ki Chul Chang
  • Patent number: 10651676
    Abstract: A wireless power reception device can include a first shielding member; a mounting member on the first shielding member; a short-range communication coil on the mounting member; a second shielding member inside the short-range communication coil; a wireless charging coil inside the short-range communication coil; and an alignment hole outside the wireless charging coil, in which the alignment hole penetrates through the first shielding member and the mounting member.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: May 12, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jeong Wook An, Hyoung Rae Kim, Dong Hyuk Lee
  • Patent number: 10635245
    Abstract: An electronic device for processing touch input is disclosed. An electronic device may comprise a touchscreen and a processor configured to perform a first function based on a touch input made by an external object and received through the touchscreen, to determine whether the electronic device is grounded when a variation in a capacitance for the touch input increases to a preset first threshold or more, to adjust a first capacitance for the touch input where the capacitance variation occurs when the electronic device is determined to not be grounded, and to determine whether to perform a second function based on the touch input where the capacitance variation occurs based on the adjusted first capacitance.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: April 28, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Dae Lee, Doo-Yong Park, Jeong-Wook Seo, Young-Gyun Lee, Jae-Hak Lee, Eun-Yeung Lee
  • Patent number: 10564751
    Abstract: An electronic device according to various examples comprises: a touch screen display including a touch panel; a processor electrically connected to the display; and a memory electrically connected to the processor, wherein the memory can be set to store instructions that, when executed, enable the processor to: receive, from the touch panel, data related to contact or proximity of an external object to the touch screen display; determine an area detected by the touch panel through the contact or the proximity on the basis of at least a part of the data; determine at least a part of the area having a relatively stronger signal strength in the area; determine at least another part of the area having a relatively weaker signal strength in the area; and display an image or a change in an image on the display on the basis of positions and/or sizes of the determined areas.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: February 18, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Doo-Yong Park, Jeong-Wook Seo, Young-Gyun Lee, Young-Dae Lee, Jae-Hak Lee, Min-Ho Kim, Cheong-Jae Lee
  • Patent number: 10563277
    Abstract: A hot-work mold steel includes 0.37 to 0.46 wt % of carbon (C), 0.25 to 0.5 wt % of silicon (Si), 0.36 to 0.56 wt % of manganese (Mn), 2.0 to 5.0 wt % of chromium (Cr), 1.4 to 2.6 wt % of molybdenum (Mo), 0.4 to 0.8 wt % of vanadium (V), 0.0007 to 0.004 wt % of boron (B), 0.002 to 0.022 wt % of aluminum (Al), 0.001 to 0.09 wt % of titanium (Ti) and the remainder of iron (Fe) and inevitable impurities. The hot-work mold steel exhibits superior thermal conductivity, hardenability, durability, and nitriding characteristics, and increased resistance to heat check and melt-out. A die-casting mold made of the steel has improved thermal conductivity regardless of mold size and a prolonged life cycle and can improve the surface quality in manufactured parts.
    Type: Grant
    Filed: May 28, 2018
    Date of Patent: February 18, 2020
    Assignee: Doosan Heavy Industries Construction Co., Ltd
    Inventors: Kuk Cheol Kim, Byoung Koo Kim, Jeong Wook Kim, Jae Suk Jeong
  • Publication number: 20200039971
    Abstract: Provided is a heterocyclic compound Chemical Formula 1 or 2: and an organic light emitting device comprising the same.
    Type: Application
    Filed: July 19, 2017
    Publication date: February 6, 2020
    Inventors: Min Young KANG, Tae Yoon PARK, Seongmi CHO, Jeong Wook MUN, Min Woo JUNG, Jung Ha LEE
  • Patent number: 10477670
    Abstract: A flexible circuit board assembly for an LED lamp of the present disclosure comprises: a resin layer having a strip shape; a conductive signal line layer formed from a predetermined pattern provided on the upper part of the resin layer; and a radiation layer provided on the lower part of the resin layer, having a thickness relatively thicker than that of the conductive signal line layer, and radiating the heat generated from an LED mounted on the signal line layer, wherein the signal line layer and the radiation layer are made from one material from among copper, aluminum, copper alloy and an aluminum alloy.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: November 12, 2019
    Assignee: LEDLITEK CO., LTD
    Inventors: Jeong Wook Hur, Young Min Yoon, Hwang Ryong Kim
  • Patent number: 10453420
    Abstract: This disclosure relates to a base film, a laminated structure including the same, and a display device. More specifically, this disclosure relates to a base film that includes a polymer having a cyclic olefin-based repeat unit containing exo-isomers above a specific content and a copolymer including a styrene-based repeat unit and a maleimide-based repeat unit, exhibits a high glass transition temperature and thus has excellent heat resistance, and has high light transmittance, a laminated structure including the same, and a display device.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: October 22, 2019
    Assignee: LG Chem, Ltd.
    Inventors: Jeong Wook Mun, Jung Woo Kim, Sung-Ho Chun, Dai Seung Choi
  • Publication number: 20190300976
    Abstract: A hot-work mold steel includes 0.37 to 0.46 wt % of carbon (C), 0.25 to 0.5 wt % of silicon (Si), 0.36 to 0.56 wt % of manganese (Mn), 2.0 to 5.0 wt % of chromium (Cr), 1.4 to 2.6 wt % of molybdenum (Mo), 0.4 to 0.8 wt % of vanadium (V), 0.0007 to 0.004 wt % of boron (B), 0.002 to 0.022 wt % of aluminum (Al), 0.001 to 0.09 wt % of titanium (Ti) and the remainder of iron (Fe) and inevitable impurities. The hot-work mold steel exhibits superior thermal conductivity, hardenability, durability, and nitriding characteristics, and increased resistance to heat check and melt-out. A die-casting mold made of the steel has improved thermal conductivity regardless of mold size and a prolonged life cycle and can improve the surface quality in manufactured parts.
    Type: Application
    Filed: May 28, 2018
    Publication date: October 3, 2019
    Inventors: Kuk Cheol Kim, Byoung Koo Kim, Jeong Wook Kim, Jae Suk Jeong
  • Patent number: D863389
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: October 15, 2019
    Inventors: Seung Won Kwak, In Sik Oh, Jeong Wook Choi, Il Ho Kim, Mi Ri Kwak, Tae Ri Kang, Dan Bi Kim
  • Patent number: D869267
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: December 10, 2019
    Inventors: Jae Sung Ju, Bum Suk Ho, Seung Won Kwak, In Sik Oh, Jeong Wook Choi, Il Ho Kim, Mi Ri Kwak, Tae Ri Kang, Dan Bi Kim