Patents by Inventor Jeong Woon Bae

Jeong Woon Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SENSOR MOUNTED WAFER
    Publication number: 20210375699
    Abstract: A sensor mounted wafer includes a lower case, a circuit board, a metal layer, an upper case and lower case. A mounting groove is formed on a surface of the lower case. An electronic component is mounted on the circuit board, and placed in the mounting groove. The upper case having an insertion groove on a surface of the upper case, wherein the electronic component is inserted into the insertion groove, and the upper case is bonded together to the lower case. The metal layer placed on at least one surface of the lower case and the upper case.
    Type: Application
    Filed: November 5, 2020
    Publication date: December 2, 2021
    Applicant: EQCELL CO., LTD.
    Inventors: Jeong Woon BAE, Ho Seung JEON, Jung Sub SONG
  • LED lighting module
    Patent number: 9502626
    Abstract: Disclosed is an LED lighting module (100) including a substrate (110), a (+) slug layer (121) and a (?) slug layer (123) formed on the substrate and spaced apart from each other at regular intervals, and at least one LED chip (130) formed on the (+) slug layer or the (?) slug layer to have p-type and n-type electrodes, in which the (+) slug layer and the (?) slug layer each include an electrode layer formed on the substrate and a reflection layer covering the electrode layer, and the LED chip is formed on the reflection layer.
    Type: Grant
    Filed: February 21, 2014
    Date of Patent: November 22, 2016
    Assignees: CLPHOTONICS CO., LTD.
    Inventors: Jeong Woon Bae, Jong Young Shim
  • Horizontal power LED device and method for manufacturing same
    Patent number: 9466760
    Abstract: A method of manufacturing a horizontal power LED device includes constructing a light-emitting structure on a substrate, etching the light-emitting structure, fabricating an electrode, forming an insulating film, forming a metal substrate, removing the substrate from the light-emitting structure, and forming an n-pad. A high-power and high-efficiency horizontal LED device is manufactured by the method of manufacturing the same.
    Type: Grant
    Filed: April 23, 2016
    Date of Patent: October 11, 2016
    Assignees: CLPHOTONICS CO., LTD.
    Inventors: Jeong Woon Bae, Seong Wook Ryu, Jong Young Shim
  • HORIZONTAL POWER LED DEVICE AND METHOD FOR MANUFACTURING SAME
    Publication number: 20160247963
    Abstract: A method of manufacturing a horizontal power LED device includes constructing a light-emitting structure on a substrate, etching the light-emitting structure, fabricating an electrode, forming an insulating film, forming a metal substrate, removing the substrate from the light-emitting structure, and forming an n-pad. A high-power and high-efficiency horizontal LED device is manufactured by the method of manufacturing the same.
    Type: Application
    Filed: April 23, 2016
    Publication date: August 25, 2016
    Inventors: Jeong Woon BAE, Seong Wook RYU, Jong Young SHIM
  • Horizontal power LED device and method for manufacturing same
    Patent number: 9343623
    Abstract: The present invention relates to a horizontal LED device and a method of manufacturing the same. More particularly, the present invention relates to a high-power and high-efficiency horizontal LED device manufactured using the advantages of conventional horizontal and vertical LEDs, and a method of manufacturing the same.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: May 17, 2016
    Assignees: CLPHOTONICS CO., LTD.
    Inventors: Jeong Woon Bae, Seong Wook Ryu, Jong Young Shim
  • LED LIGHTING MODULE
    Publication number: 20160005938
    Abstract: Disclosed is an LED lighting module (100) including a substrate (110), a (+) slug layer (121) and a (?) slug layer (123) formed on the substrate and spaced apart from each other at regular intervals, and at least one LED chip (130) formed on the (+) slug layer or the (?) slug layer to have p-type and n-type electrodes, in which the (+) slug layer and the (?) slug layer each include an electrode layer formed on the substrate and a reflection layer covering the electrode layer, and the LED chip is formed on the reflection layer.
    Type: Application
    Filed: February 21, 2014
    Publication date: January 7, 2016
    Applicant: Clphotonics Co., Ltd.
    Inventors: Jeong Woon BAE, Jong Young SHIM
  • HORIZONTAL POWER LED DEVICE AND METHOD FOR MANUFACTURING SAME
    Publication number: 20150053995
    Abstract: The present invention relates to a horizontal LED device and a method of manufacturing the same. More particularly, the present invention relates to a high-power and high-efficiency horizontal LED device manufactured using the advantages of conventional horizontal and vertical LEDs, and a method of manufacturing the same.
    Type: Application
    Filed: March 22, 2012
    Publication date: February 26, 2015
    Applicants: Clphotonics Co., Ltd.
    Inventors: Jeong Woon Bae, Seong Wook Ryu, Jong Young Shim