Patents by Inventor Jeong-Woon KOO

Jeong-Woon KOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Input module wiring structure of electronic device
    Patent number: 10664023
    Abstract: An electronic device includes a bracket having a through hole, a first circuit board and a second circuit board which are disposed below the bracket. The second circuit board is electrically connected with the first circuit board, and a first module and a second module are disposed above the bracket. The first module and the second module are electrically connected with the first circuit board via a wiring structure passing through the through hole.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: May 26, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae Sik Kim, Myung Jae Jo, Hye Won Kang, Ja Myeong Koo, Mu Jin Kim, Jeong Woon Koo, Dae Heon Kwon, Sei Neu Park, Won Hyun Park, Jae Young Yun
  • INPUT MODULE WIRING STRUCTURE OF ELECTRONIC DEVICE
    Publication number: 20180017999
    Abstract: An electronic device includes a bracket having a through hole, a first circuit board and a second circuit board which are disposed below the bracket. The second circuit board is electrically connected with the first circuit board, and a first module and a second module are disposed above the bracket. The first module and the second module are electrically connected with the first circuit board via a wiring structure passing through the through hole.
    Type: Application
    Filed: July 14, 2017
    Publication date: January 18, 2018
    Inventors: Tae Sik KIM, Myung Jae JO, Hye Won KANG, Ja Myeong KOO, Mu Jin KIM, Jeong Woon KOO, Dae Heon KWON, Sei Neu PARK, Won Hyun PARK, Jae Young YUN
  • Injection molded case having antenna pattern and manufacturing method thereof
    Patent number: 9199397
    Abstract: An injection-molded case and a manufacturing method thereof having antenna patterns are formed in the injection-molded case by only one insert injection molding process, without a second insert injection molding process as required in the conventional manufacture. The injection-molded case preferably includes: one or more antenna patterns fabricated by a press process; and an injection-molded case part having the antenna patterns provided therewithin, which is fabricated by fixing the antenna patterns on an injection mold and carrying out only one insert injection molding process.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: December 1, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hae-Won Ahn, Jae-Ho Oh, Jeong-Woon Koo
  • INJECTION MOLDED CASE HAVING ANTENNA PATTERN AND MANUFACTURING METHOD THEREOF
    Publication number: 20120056798
    Abstract: An injection-molded case and a manufacturing method thereof having antenna patterns are formed in the injection-molded case by only one insert injection molding process, without a second insert injection molding process as required in the conventional manufacture. The injection-molded case preferably includes: one or more antenna patterns fabricated by a press process; and an injection-molded case part having the antenna patterns provided therewithin, which is fabricated by fixing the antenna patterns on an injection mold and carrying out only one insert injection molding process.
    Type: Application
    Filed: July 15, 2011
    Publication date: March 8, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hae-Won AHN, Jae-Ho OH, Jeong-Woon KOO