Patents by Inventor Jeong Wung Jeong

Jeong Wung Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having overlapped via apertures
    Patent number: 9837331
    Abstract: Disclosed is a semiconductor device having overlapped via apertures formed in an encapsulant to outwardly expose solder balls. When different types of semiconductor devices are electrically connected to the solder balls through the overlapped via apertures, flux or solder paste is unlikely to contact sidewall portions of the overlapped via apertures. Therefore, different types of semiconductor devices can be mounted with improved efficiency.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: December 5, 2017
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Jin Seong Kim, Dong Joo Park, Kwang Ho Kim, Hee Yeoul Yoo, Jeong Wung Jeong
  • Semiconductor device having overlapped via apertures
    Patent number: 9177932
    Abstract: Disclosed is a semiconductor device having overlapped via apertures formed in an encapsulant to outwardly expose solder balls. When different types of semiconductor devices are electrically connected to the solder balls through the overlapped via apertures, flux or solder paste is unlikely to contact sidewall portions of the overlapped via apertures. Therefore, different types of semiconductor devices can be mounted with improved efficiency.
    Type: Grant
    Filed: September 16, 2013
    Date of Patent: November 3, 2015
    Inventors: Jin Seong Kim, Dong Joo Park, Kwang Ho Kim, Hee Yeoul Yoo, Jeong Wung Jeong
  • Semiconductor device having overlapped via apertures
    Patent number: 8557629
    Abstract: Disclosed is a semiconductor device having overlapped via apertures formed in an encapsulant to outwardly expose solder balls. When different types of semiconductor devices are electrically connected to the solder balls through the overlapped via apertures, flux or solder paste is unlikely to contact sidewall portions of the overlapped via apertures. Therefore, different types of semiconductor devices can be mounted with improved efficiency.
    Type: Grant
    Filed: December 3, 2010
    Date of Patent: October 15, 2013
    Assignee: Amkor Technology, Inc.
    Inventors: Jin Seong Kim, Dong Joo Park, Kwang Ho Kim, Hee Yeoul Yoo, Jeong Wung Jeong