Abstract: Exemplary deposition methods may include delivering a boron-containing precursor and a nitrogen-containing precursor to a processing region of a semiconductor processing chamber. The methods may include providing a hydrogen-containing precursor with the boron-containing precursor and the nitrogen-containing precursor. A flow rate ratio of the hydrogen-containing precursor to either of the boron-containing precursor or the nitrogen-containing precursor may be greater than or about 2:1. The methods may include forming a plasma of all precursors within the processing region of the semiconductor processing chamber. The methods may include depositing a boron-and-nitrogen material on a substrate disposed within the processing region of the semiconductor processing chamber.

Abstract: The present invention relates to a superparticle atomizing device and, more specifically, to a superparticle atomizing device having an inner plate provided at the upper part of an ultrasonic vibrator inside a housing and having a circulation passage formed at the circumference of the inner plate of the inside of the housing by using the rapid flow rate of the air to be ventilated to the inside of the housing through a blower, and thus only liquid microparticles generated at the lower region of the inner plate by the ultrasonic vibrator are pulled up to the upper region thereof, thereby allowing the liquid microparticles to be atomized through an atomizing hole and allowing the liquid microparticles to be rapidly diffused into the air with rapid ventilation air.

Abstract: The present invention relates to a supraparticle atomizing device and, more specifically, to a supraparticle atomizing device having an inner plate provided at the upper part of an ultrasonic vibrator inside a housing and having a circulation passage formed at the circumference of the inner plate of the inside of the housing by using the rapid flow rate of the air to be ventilated to the inside of the housing through a blower, and thus only liquid microparticles generated at the lower region of the inner plate by the ultrasonic vibrator are pulled up to the upper region thereof, thereby allowing the liquid microparticles to be atomized through an atomizing hole and allowing the liquid microparticles to be rapidly diffused into the air with rapid ventilation air.

Abstract: The socket assembly includes a guide block, a guide part and a pressurizing plate. The guide block is in a terminal region of a test board, the guide block defining an area into which an integrated circuit can be inserted opposite terminals formed on the test board in the terminal region. The guide part is provided on an inner side wall of the guide block, to guide an insertion position of the integrated circuit so that respective leads of the integrated circuit are aligned with the corresponding terminals of the test board. The pressurizing plate is adapted to interface with the guide block, the pressurizing plate including a pressurizing protrusion on a surface thereof, such that when the pressurizing plate is applied to the guide block, the respective leads of the integrated circuit are urged to connect with the corresponding terminals of the test board.

Abstract: A socket assembly for an integrated circuit test, and its integrated circuit and tester, are provided to select a direct or indirect connection of an integrated circuit to a test board. This configuration provides increased efficiency, and reduced load capacity through direct connection so as to increase reliability of an electrical characteristic test. The socket assembly includes a guide block, a guide part and a pressurizing plate. The guide block is in a terminal region of a test board, the guide block defining an area into which an integrated circuit can be inserted opposite terminals formed on the test board in the terminal region. The guide part is provided on an inner side wall of the guide block, to guide an insertion position of the integrated circuit so that respective leads of the integrated circuit are aligned with the corresponding terminals of the test board.