Abstract: A wafer edge exposure apparatus is provided with an optical section for radiating exposure light onto the edge of a semiconductor wafer. The optical section is provided with a focus sensor for sensing a distance from the lower end of the optical section to the edge of the semiconductor wafer. There is provided a position control mechanism for moving the optical section vertically on the basis of a value detected by the focus sensor such that the distance matches a focal distance of the optical section.

Abstract: A water edge exposure apparatus is provided with an optical section for radiating exposure light onto the edge of a semiconductor wafer. The optical section is provided with a focus sensor for sensing a distance from the lower end of the optical section to the edge of the semiconductor wafer. There is provided a position control mechanism for moving the optical section vertically on the basis of a value detected by the focus sensor such that the distance matches a focal distance of the optical section.

Abstract: The invention relates to a wafer for use as a substrate for a semiconductor device, the wafer comprising a round zone formed along a circumference thereof; a flat zone wherein the circumference thereof is partially cut in a straight line; and a laser marking region functioning as a wafer bar-code which is formed in an upper portion of the round zone opposite to and apart from the flat zone. The wafer bar-code has holes having about 2 .mu.m depth and is formed by a soft marking process. A good fine pattern can be formed on the wafer with a follow-on patterning process by substantially cleaning photoresist materials remaining in holes of the laser marking region. Further, the occurrence of G-defects can be reduced, such defects being caused by photoresist particles remaining on the surface of the wafer.

Abstract: A reticle for fabricating a semiconductor device, wherein alignment-marks useful to examine a pattern mistake are formed upon a scribe line, the alignment-marks having pairs of adjoining primary and secondary measurement patterns. Each primary measurement pattern includes a rectangular pattern provided on a rectangular plate, and a rod-shaped pattern separately formed along the sides of the rectangular pattern. Each secondary measure pattern is fitted into the rectangular pattern of the respective primary measure pattern in case that the secondary measure pattern is overlapped with the primary measure pattern, to thereby permit the examination of position of the secondary measurement pattern relative to the primary measurement pattern.