Abstract: A substrate processing apparatus includes a main load unit, a buffer load unit, and a transfer unit. Containers each accommodating substrates are placed on the main load unit and the buffer load unit. The buffer load unit is disposed above the main load unit and movable into and outward from a process module. Therefore, more containers can be placed in the substrate processing apparatus without increasing the footprint of the substrate processing apparatus, and thus it is possible to reduce equipment idle time during which standby substrates wait before being processed, thereby improving productivity.

Abstract: A supply system for supplying a functional water to a process unit which treats a substrate using the functional water is provided. In the system, the functional water generated in the functional water generator is supplied to a distributor through a functional water supply pipe. Thereafter, the functional water is supplied to the process unit while the process unit performs a process, and the functional water is returned to the functional water generator through a functional water returning pipe while the process unit does not perform a process. A buffer tank is installed in the functional water supply pipe and the concentration of the functional water is measured in a circulation line connected with the buffer tank. When the measured concentration of the functional water goes out of a set concentration range, the functional water is returned to the functional water generator through functional water returning pipe.

Abstract: Provided are an ozonated water mixture supply apparatus and method, and a substrate treating facility that receives an ozonated water mixture from the apparatus to treat a substrate. The ozonated water mixture supply apparatus includes a mixing line and distribution lines. The mixing line respectively receives a treating liquid and an ozonated water from a treating liquid supply line and an ozonated water supply line and mixes the treating liquid and the ozonated water to generate the ozonated water mixture satisfying a previously set concentration. Each of the distribution lines distributes the ozonated water mixture generated from the mixing line into a process unit. The mixing line includes a mixing valve and a static mixer. Therefore, the ozonated water mixture having the previously set concentration is generated and supplied using an in-line mixing method without requiring a mixing vessel such as a mixing tank.

Abstract: The present invention is directed to a spin chuck for use in a process, such as a cleaning process and an etching process, performed while rotating a substrate. The spin chuck includes a spin head on which a substrate is placed, a driving part configured to rotate the spin head, and a fix bracket installed on the spin head and having a contact surface that is in contact with a flat surface of a flat zone of the substrate at a position corresponding to the flat zone to prevent a vortex caused by the flat zone. Since the fix bracket has the same shape as the flat zone of the substrate, an air current unbalance resulting from the flat zone is suppressed to uniformly inject etchants to a rear surface of the substrate.

Abstract: Provided is a spin head for supporting a substrate. The spin head includes a rotatable body, and chuck pins protruding upward from the body and configured to support an edge of a substrate placed at the body when the body is rotated. Each of the chuck pins includes a vertical rod vertically disposed at the body, and a support rod extending from a side of the vertical rod and configured to make contact with the edge of the substrate placed at the body when the body is rotated. When the substrate is rotated, the vertical rod is spaced apart from the edge of the substrate. The contact portion includes a streamlined side surface. The support rod includes a contact portion. The contact portion tapers toward the end of the support rod when viewed from the top of the support rod.

Abstract: The present invention is directed to a method and an apparatus for cleaning and drying wafers. The apparatus includes an injection unit having first and second injection ports configured for injecting different fluids and arranged in a moving direction of the rose or on a line adjacent to the moving direction. The injection unit migrates straightly from the center of a wafer to the edge thereof, and the first and second injection ports are linearly arranged on a moving line of the nozzle.

Abstract: The present is directed to an apparatus for etching the top edge and bottom of a wafer. The apparatus includes a substrate support part for supporting a wafer and a movable protect part for preventing fluid for an etch from flowing into a non-etch portion of the wafer. The top edge and bottom of the wafer is etched by a wet etch, and a boundary of the non-etch portion and the edge of the wafer is etched by a dry etch.

Abstract: A spin etcher with a thickness measuring system includes a rotatable spin head, etchant supply means, and etchant supply controller. A substrate is mounted upon the spin head. The etchant supply means is disposed over the substrate, and sprays an etchant onto the substrate. The etchant supply controller controls the etchant supply. The spin etcher further includes a main controller for transferring an etchant supply stop signal to the thickness measuring system and the etchant supply controller. The thickness measuring system allows a light to impinge on a surface of the substrate, and analyzes an interference signal of the light reflected from the substrate to measure a thickness of a thin film. The main controller compares a result measured by the thickness measuring system with a reference value, and transfers the etchant supply stop signal to the etchant supply controller before the measured result reaches the reference value.

Abstract: A supply system for supplying a functional water to a process unit which treats a substrate using the functional water is provided. In the system, the functional water generated in the functional water generator is supplied to a distributor through a functional water supply pipe. Thereafter, the functional water is supplied to the process unit while the process unit performs a process, and the functional water is returned to the functional water generator through a functional water returning pipe while the process unit does not perform a process. A buffer tank is installed in the functional water supply pipe and the concentration of the functional water is measured in a circulation line connected with the buffer tank. When the measured concentration of the functional water goes out of a set concentration range, the functional water is returned to the functional water generator through functional water returning pipe.

Abstract: The present invention is directed to a method and an apparatus for cleaning and drying wafers. The apparatus includes an injection unit having first and second injection ports configured for injecting different fluids and arranged in a moving direction of the rose or on a line adjacent to the moving direction. The injection unit migrates straightly from the center of a wafer to the edge thereof, and the first and second injection ports are linearly arranged on a moving line of the nozzle.

Abstract: The present is directed to an apparatus for etching the top edge and bottom of a wafer. The apparatus includes a substrate support part for supporting a wafer and a movable protect part for preventing fluid for an etch from flowing into a non-etch portion of the wafer. The top edge and bottom of the wafer is etched by a wet etch, and a boundary of the non-etch portion and the edge of the wafer is etched by a dry etch.

Abstract: The present invention is directed to a chemical supply apparatus including a first tank in which at least two chemicals supplied from each supply bath are mixed, circulating means for circulating the chemicals in the first tank to uniformly mix the chemicals therein, a second tank for storing the mixed solution provided from the first tank, a distributor for distributing the mixed solution to supply the mixed solution to each processing unit, and a heating unit mounted upon a supply line for supplying the mixed solution to the distributor to heat up the mixed solution.

Abstract: A method for drying a semiconductor substrate includes the steps of clearing the substrate by supplying a liquid into a processing bath of a chamber, injecting first dry gases onto a surface of the supplied liquid, draining the liquid from the processing bath so that the substrate is slowly exposed to the surface of the liquid, and injecting a second dry gas into the chamber and forcibly exhausting gas in the chamber.

Abstract: An apparatus for drying a semiconductor substrate includes a chamber having a processing bath and a cover, a liquid flow system for supplying a liquid flow into the processing bath so as to clean the substrate and for draining a liquid from the processing bath, a gas distributor for spraying a gas for drying the substrate, and decompression means for exhausting air in the chamber.

Abstract: A spin etcher with a thickness measuring system includes a rotatable spin head, etchant supply means, and etchant supply controller. A substrate is mounted upon the spin head. The etchant supply means is disposed over the substrate, and sprays an etchant onto the substrate. The etchant supply controller controls the etchant supply. The spin etcher further includes a main controller for transferring an etchant supply stop signal to the thickness measuring system and the etchant supply controller. The thickness measuring system allows a light to impinge on a surface of the substrate, and analyzes an interference signal of the light reflected from the substrate to measure a thickness of a thin film. The main controller compares a result measured by the thickness measuring system with a reference value, and transfers the etchant supply stop signal to the etchant supply controller before the measured result reaches the reference value.

Abstract: The present invention is directed to a chemical supply apparatus including a first tank in which at least two chemicals supplied from each supply bath are mixed, circulating means for circulating the chemicals in the first tank to uniformly mix the chemicals therein, a second tank for storing the mixed solution provided from the first tank, a distributor for distributing the mixed solution to supply the mixed solution to each processing unit, and a heating unit mounted upon a supply line for supplying the mixed solution to the distributor to heat up the mixed solution.

Abstract: A method for drying a semiconductor substrate includes the steps of clearing the substrate by supplying a liquid into a processing bath of a chamber, injecting first dry gases onto a surface of the supplied liquid, draining the liquid from the processing bath so that the substrate is slowly exposed to the surface of the liquid, and injecting a second dry gas into the chamber and forcibly exhausting gas in the chamber.

Abstract: An apparatus for drying a semiconductor substrate includes a chamber having a processing bath and a cover, a liquid flow system for supplying a liquid flow into the processing bath so as to clean the substrate and for draining a liquid from the processing bath, a gas distributor for spraying a gas for drying the substrate, and decompression means for exhausting air in the chamber.

Abstract: Disclosed is an accumulator for a rotary compressor, the accumulator being formed with a lengthy L-tube, thus improving the efficiency of the compressor. The present invention includes a lengthy refrigerant transferring part formed around the outer circumference of the compressor to separate gaseous refrigerant from liquid refrigerant in the accumulator, and to send only the gaseous refrigerant into the cylinder; and a pipe fixing strip to fix the refrigerant transferring part to the compressor to prevent the movement of the refrigerant transferring part otherwise caused by the vibration and noise, thus improving the EER and the cooling capability of the compressor.