Patents by Inventor Jeong Yoon

Jeong Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5741511
    Abstract: The present invention is to provide a method and a transdermal drug delivery device for treating erectile dysfunction which comprises a patch containing pharmaceutically active ingredient and being directly apply to the male glans penis and its support and the rings for constricting the base part of the penis to aid the erection. The patch according to the present invention may be divided into two types, i.e. a cylinder type patch and a multi-reservoir type patch. The transdermal drug delivery patch device of the present invention is painless and safely to use and may be effectively produced and maintained erection of the penis without the adverse side effects and with a high degree of patient acceptability in the case of male impotence.
    Type: Grant
    Filed: April 10, 1996
    Date of Patent: April 21, 1998
    Assignee: Sam Yang Co., Ltd.
    Inventors: Hun Han Lee, Joong Woong Cho, Choul Young Kim, Chaul Min Pai, Jin Deog Song, Chul Min Park, Hye Jeong Yoon, Yoon Yeo, Jae Seung Paick
  • Patent number: 5297827
    Abstract: This invention relates to a device for coupling lengths of metal pipe, too hard or to thin for cutting a screw, by inserting a screwed socket in one end of the pipe to be joined with another, expanding that part of the pipe, and joining it airtight with another coupling.A metal pipe coupling of the present invention has a screw section and a tightening section, and is shaped so as to be suitable to the way of coupling metal pipes by insertion of one end of a metal pipe in the coupling, expanding the fastening section of the metal pipe so that the joining of the outside circumference of the pipe and the inside circumference of the coupling should be airtight, and thereafter by joining with another joining material.
    Type: Grant
    Filed: January 22, 1993
    Date of Patent: March 29, 1994
    Inventor: Jeong-Yoon Choi