Patents by Inventor Jeong-Beom Park

Jeong-Beom Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive material for electric connection, display device using the adhesive material and method of fabricating the display device
    Patent number: 9085717
    Abstract: The present invention provides an adhesive layer for an electrical connection. The adhesive layer includes a base resin; an ionic optical-curing agent; an optical curing accelerant; and a conductive particle having a size of several to several tens nanometers, wherein the adhesive layer is cured by a UV light, and the UV light is diffused by the optical curing accelerant.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: July 21, 2015
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Yeo-O Youn, Dong-Sik Park, Jeong-Beom Park, Hye-Sun Song, A-Ram Sohn
  • Composition of organic insulating layer and thin film transistor substrate and display device using the same
    Patent number: 8748894
    Abstract: Discussed is a composition of an organic insulating layer comprising a photosensitizer, a binder, an additive and a solvent, wherein the photosensitizer includes a photoacid generator (PAG), and a thin film transistor substrate and display device using the same, wherein the composition of the present invention enables to realize a simplified process by omitting an additional entire-surface exposing process for a color change, and a baking process after an exposing process; and to minimize a problem of color-coordinates shift by realizing a good light transmittance.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: June 10, 2014
    Assignee: LG Display Co., Ltd.
    Inventors: Ju Hyuk Kim, Jin Wuk Kim, Joon Ki Kim, Na Young Song, Jae Chul Hwang, Song A Kim, Min Ho Jang, Jeong Beom Park
  • ADHESIVE MATERIAL FOR ELECTRIC CONNECTION, DISPLAY DEVICE USING THE ADHESIVE MATERIAL AND METHOD OF FABRICATING THE DISPLAY DEVICE
    Publication number: 20140153208
    Abstract: The present invention provides an adhesive layer for an electrical connection. The adhesive layer includes a base resin; an ionic optical-curing agent; an optical curing accelerant; and a conductive particle having a size of several to several tens nanometers, wherein the adhesive layer is cured by a UV light, and the UV light is diffused by the optical curing accelerant.
    Type: Application
    Filed: November 27, 2013
    Publication date: June 5, 2014
    Applicant: LG DISPLAY CO., LTD.
    Inventors: Yeo-O YOUN, Dong-Sik PARK, Jeong-Beom PARK, Hye-Sun SONG, A-Ram SOHN
  • CONNECTING STRUCTURE AND ADHESION METHOD OF PCB USING ANISOTROPIC CONDUCTIVE FILM, AND METHOD FOR EVALUATING CONNECTING CONDITION USING THE SAME
    Publication number: 20110290538
    Abstract: A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 ?m due to dents formed by heat-compression.
    Type: Application
    Filed: June 2, 2011
    Publication date: December 1, 2011
    Applicant: LG INNOTEK CO. LTD.
    Inventors: Chul-Jong HAN, Yoon-Jae CHUNG, Jong-Yoon JANG, Jeong-Beom PARK, Yong-Seok HAN, Sung-Uk CHOI, Il-Rae CHO, Hyuk-Soo MOON, Kyung-Joon LEE
  • Method of adhering a pair of members
    Patent number: 7993417
    Abstract: A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 ?m due to dents formed by heat-compression.
    Type: Grant
    Filed: January 22, 2007
    Date of Patent: August 9, 2011
    Assignee: LS Cable Ltd.
    Inventors: Chul-Jong Han, Yoon-Jae Chung, Jong-Yoon Jang, Jeong-Beom Park, Yong-Seok Han, Sung-Uk Choi, Il-Rae Cho, Hyuk-Soo Moon, Kyung-Joon Lee
  • Connecting Structure and Adhesion Method of Pcb Using Anisotropic Conductive Film, and Method for Evaluating Connecting Condition Using the Same
    Publication number: 20090000807
    Abstract: A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 ?m due to dents formed by heat-compression.
    Type: Application
    Filed: January 22, 2007
    Publication date: January 1, 2009
    Inventors: Chul-Jong Han, Yoon-Jae Chung, Jong-Yoon Jang, Jeong-Beom Park, Yong-Seok Han, Sung-Uk Choi, Il-Rae Cho, Hyuk-Soo Moon, Kyung-Joon Lee