Abstract: Disclosed in the present document is an apparatus for aligning a semiconductor chip for packaging according to an embodiment, the apparatus may include a radiation source configured to irradiate a plurality of semiconductor chips with radiation; the plurality of semiconductor chips vertically disposed with respect to the ground; a radiation sensor configured to detect the radiation that has penetrated the plurality of semiconductor chips; and an alignment unit configured to align and bond the plurality of semiconductor chips based on detection information acquired by the radiation sensor.

Abstract: A haptic driving apparatus provides a user with electrovibration of certain strength regardless of a variance of a surrounding environment, and an electronic device has a haptic function. The haptic driving apparatus comprises a haptic electrode driver generating a haptic driving signal to supply the generated haptic driving signal to a haptic electrode through a current monitor and varying the haptic driving signal in accordance with voltages at both ends of the current monitor.

Abstract: A haptic driving apparatus that may provide a user with electrovibration of certain strength regardless of a variance of a surrounding environment and an electronic device having a haptic function are disclosed. The haptic driving apparatus comprises a haptic electrode driver generating a haptic driving signal to supply the generated haptic driving signal to a haptic electrode through a current monitor and varying the haptic driving signal in accordance with the current supplied to the haptic electrode.