Patents by Inventor JeongHo Yang

JeongHo Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods
    Patent number: 11935864
    Abstract: A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: March 19, 2024
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Hui Xu, JeongHo Yang, Wei Qin, Ziauddin Ahmad
  • METHODS OF IMPROVING WIRE BONDING OPERATIONS
    Publication number: 20230352443
    Abstract: A method of determining a new search height for a wire bonding process is provided. The method includes the steps of: providing a search height; performing a plurality of wire bonding operations using the search height; monitoring wire bonding evaluation criteria during each of the plurality of wire bonding operations; and determining a new search height using the monitored wire bonding evaluation criteria.
    Type: Application
    Filed: April 25, 2023
    Publication date: November 2, 2023
    Inventors: Hui Xu, Wei Qin, JeongHo Yang
  • METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A SUPPORT STRUCTURE ON A WIRE BONDING MACHINE, AND RELATED METHODS
    Publication number: 20230039460
    Abstract: A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).
    Type: Application
    Filed: October 24, 2022
    Publication date: February 9, 2023
    Inventors: Hui Xu, JeongHo Yang, Wei Qin, Ziauddin Ahmad
  • Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods
    Patent number: 11515285
    Abstract: A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: November 29, 2022
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Hui Xu, JeongHo Yang, Wei Qin, Ziauddin Ahmad
  • METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A SUPPORT STRUCTURE ON A WIRE BONDING MACHINE, AND RELATED METHODS
    Publication number: 20210305199
    Abstract: A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).
    Type: Application
    Filed: March 25, 2021
    Publication date: September 30, 2021
    Inventors: Hui Xu, JeongHo Yang, Wei Qin, Ziauddin Ahmad