Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

Abstract: A film peeling apparatus includes a peeling pin that push-lifts a first end portion of a cut portion of a film toward a second end portion of the cut portion, a peeling roller that push-lifts the second end portion of the cut portion toward the first end portion of the cut portion by closely contacting the second end portion of the cut portion and rotating, and an absorbing unit that absorbs and removes the cut portion of the film push-lifted by the peeling pin and peeling roller.

Abstract: A film peeling apparatus includes a peeling pin that push-lifts a first end portion of a cut portion of a film toward a second end portion of the cut portion, a peeling roller that push-lifts the second end portion of the cut portion toward the first end portion of the cut portion by closely contacting the second end portion of the cut portion and rotating, and an absorbing unit that absorbs and removes the cut portion of the film push-lifted by the peeling pin and peeling roller.

Abstract: A film peeling apparatus for detaching a region of a film unit on a substrate and including: a tape supply unit configured to supply an adhesive tape onto the film unit; a plurality of pins arranged above the adhesive tape, vertically descendible toward the adhesive tape to attach a portion of the film unit to an adhesive surface of the adhesive tape, and sequentially vertically liftable after the portion of the film unit is attached to the adhesive surface of the adhesive tape; and a tape recovery unit configured to recover the adhesive tape having the portion of the film attached thereto, and apply a tension force to the adhesive tape after the portion of the film unit is adhered to the adhesive tape.