Patents by Inventor Jeong Hyun KWON

Jeong Hyun KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulation structure for transparent flexible organic electronic device
    Patent number: 10529951
    Abstract: Provided is an encapsulation structure for a transparent flexible organic electronic device, the encapsulation structure including a flexible substrate, and at least one hybrid unit structure provided on at least one surface of the flexible substrate and including a zinc oxide thin film, an aluminum oxide thin film, and a magnesium oxide thin film stacked on one another.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: January 7, 2020
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Kyung Cheol Choi, Jeong Hyun Kwon
  • ENCAPSULATION STRUCTURE FOR TRANSPARENT FLEXIBLE ORGANIC ELECTRONIC DEVICE
    Publication number: 20190058157
    Abstract: Provided is an encapsulation structure for a transparent flexible organic electronic device, the encapsulation structure including a flexible substrate, and at least one hybrid unit structure provided on at least one surface of the flexible substrate and including a zinc oxide thin film, an aluminum oxide thin film, and a magnesium oxide thin film stacked on one another.
    Type: Application
    Filed: August 13, 2018
    Publication date: February 21, 2019
    Inventors: Kyung Cheol CHOI, Jeong Hyun KWON