Patents by Inventor Jeongil Jay KIM
Jeongil Jay KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240106124Abstract: An antenna system includes: a patch antenna element disposed at a first level of the antenna system; an energy coupler configured and coupled to the patch antenna element to transfer energy between the patch antenna element and a front-end circuit; a ground conductor disposed at a second level of the antenna system, the patch antenna element and the ground conductor being disposed a separation distance away from each other and bounding respective sides of a volume defined by a projection, normal to a surface of the patch antenna element, of the patch antenna element to the ground conductor; and a floating conductor that is displaced from the ground conductor and the patch antenna element, the floating conductor comprising a body extending over a portion of the separation distance outside of, and in close proximity to, the volume.Type: ApplicationFiled: September 23, 2022Publication date: March 28, 2024Inventors: Mahmoud NIROO JAZI, Mohammad Ali TASSOUDJI, Taesik YANG, Jeongil Jay KIM, Darryl Sheldon JESSIE, Kevin Hsi-Huai WANG, Jorge FABREGA SANCHEZ, Hong-Ming LEE
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Patent number: 11784418Abstract: An antenna system includes: a first antenna element configured to transduce between second wireless energy and second transmission-line-conducted energy, wherein the first and second wireless energy are of first and second polarizations of the first antenna element and in first and second directions that are different and define a first plane; and a second antenna element configured to transduce between third wireless energy and third transmission-line-conducted energy and between fourth wireless energy and fourth transmission-line-conducted energy, wherein the third and fourth wireless energy are of first and second polarizations of the second antenna element and in third and fourth directions that are different and define a second plane that is substantially orthogonal to the first plane.Type: GrantFiled: October 12, 2021Date of Patent: October 10, 2023Assignee: QUALCOMM IncorporatedInventors: Jorge Fabrega Sanchez, Mohammad Ali Tassoudji, Jeongil Jay Kim, Kevin Hsi-Huai Wang
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Patent number: 11756894Abstract: Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding. A RFIC package includes an IC die layer that includes a RFIC die(s) mounted on a substrate that includes substrate metallization layers, a substrate core, and substrate antenna layers. The RFIC package includes an EMI shield surrounding the IC die layer and extending down shared sidewalls of the IC die layer and the substrate. The EMI shield extends down the sidewalls of the IC die layer and substrate metallization layers of the substrate to at least the interface between the substrate metallization layers and the substrate core, and without extending adjacent to the sidewall of the substrate antenna layers. In this manner, antenna performance of the antenna module may not be degraded, because extending the EMI shield down sidewalls of the substrate antenna layers can create a resonance cavity in the substrate.Type: GrantFiled: May 20, 2020Date of Patent: September 12, 2023Assignee: QUALCOMM INCORPORATEDInventors: Jeahyeong Han, Rajneesh Kumar, Jeongil Jay Kim, Chin-Kwan Kim
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Patent number: 11735819Abstract: Various wireless device and antenna array configurations are provided. An example wireless device includes at least one radio frequency integrated circuit, at least one patch antenna element operably coupled to the at least one radio frequency integrated circuit, at least one dipole antenna comprising two dipole antenna elements disposed adjacent to the at least one patch antenna element and operably coupled to the at least one radio frequency integrated circuit, and at least one high impedance surface disposed below the at least one dipole antenna and adjacent to the at least one patch antenna element.Type: GrantFiled: October 20, 2020Date of Patent: August 22, 2023Assignee: QUALCOMM IncorporatedInventors: Jeongil Jay Kim, Sangkil Kim, Darryl Sheldon Jessie
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Patent number: 11735804Abstract: A multi-core broadband printed circuit board (PCB) antenna and methods for fabricating such an antenna are provided. One example antenna implemented with a multi-core PCB generally includes a first core structure, a second core structure disposed above the first core structure, and one or more metal layers disposed above the second core structure or below the first core structure. The first core structure includes a first core layer, a first metal layer disposed below the first core layer, and a second metal layer disposed above the first core layer. The second core structure includes a second core layer, a third metal layer disposed below the second core layer, and a fourth metal layer disposed above the second core layer. The first core layer and the second core layer may have different thicknesses.Type: GrantFiled: May 11, 2020Date of Patent: August 22, 2023Assignee: QUALCOMM INCORPORATEDInventors: Chaoqi Zhang, Suhyung Hwang, Jaehyun Yeon, Taesik Yang, Jeongil Jay Kim, Darryl Sheldon Jessie, Mohammad Ali Tassoudji
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Publication number: 20230261393Abstract: Methods, systems, and devices for wireless communication are described. According to one or more aspects, the described apparatus includes one or more stacks of patch radiators (such as patch antennas) comprising at least a first patch radiator and a second patch radiator. The first patch radiator is associated with a low-band frequency; the second patch radiator is associated with a high-band frequency. The first patch radiator and the second patch radiator may overlap a ground plane, which may be asymmetric. Some or all patch radiators in a stack may be rotated relative to the ground plane, such that some or all edge of a patch radiator may be nonparallel with one or more edges of the ground plane. Further, each patch radiator stack may include separate feeds for each of at least two frequencies and two polarizations, and thus at least four feeds (one for each frequency/polarization combination) in total.Type: ApplicationFiled: April 24, 2023Publication date: August 17, 2023Inventors: Taesik YANG, Jorge FABREGA SANCHEZ, Mohammad Ali TASSOUDJI, Kevin Hsi-Huai WANG, Jeongil Jay KIM
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Publication number: 20230187848Abstract: An antenna is described. The antenna includes a first plurality of first elements. Each of the first elements is dual polarized and configured to support a first set of bands and a second set of bands that is mutually exclusive from the first set of bands. The antenna also includes a second plurality of second elements. Each of the second elements is dual polarized and configured to support the second set of bands. The second plurality of second elements is interleaved with the first plurality of first elements.Type: ApplicationFiled: February 9, 2023Publication date: June 15, 2023Inventors: Jorge FABREGA SANCHEZ, Mohammad Ali TASSOUDJI, Assaf AVIV, Taesik YANG, Jeongil Jay KIM, Kevin Hsi-Huai WANG
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Patent number: 11652301Abstract: Methods, systems, and devices for wireless communication are described. According to one or more aspects, the described apparatus includes one or more stacks of patch radiators (such as patch antennas) comprising at least a first patch radiator and a second patch radiator. The first patch radiator is associated with a low-band frequency; the second patch radiator is associated with a high-band frequency. The first patch radiator and the second patch radiator may overlap a ground plane, which may be asymmetric. Some or all patch radiators in a stack may be rotated relative to the ground plane, such that some or all edge of a patch radiator may be nonparallel with one or more edges of the ground plane. Further, each patch radiator stack may include separate feeds for each of at least two frequencies and two polarizations, and thus at least four feeds (one for each frequency/polarization combination) in total.Type: GrantFiled: April 9, 2019Date of Patent: May 16, 2023Assignee: QUALCOMM IncorporatedInventors: Taesik Yang, Jorge Fabrega Sanchez, Mohammad Ali Tassoudji, Kevin Hsi Huai Wang, Jeongil Jay Kim
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Publication number: 20230114757Abstract: An antenna system includes: a first antenna element configured to transduce between second wireless energy and second transmission-line-conducted energy, wherein the first and second wireless energy are of first and second polarizations of the first antenna element and in first and second directions that are different and define a first plane; and a second antenna element configured to transduce between third wireless energy and third transmission-line-conducted energy and between fourth wireless energy and fourth transmission-line-conducted energy, wherein the third and fourth wireless energy are of first and second polarizations of the second antenna element and in third and fourth directions that are different and define a second plane that is substantially orthogonal to the first plane.Type: ApplicationFiled: October 12, 2021Publication date: April 13, 2023Inventors: Jorge FABREGA SANCHEZ, Mohammad Ali TASSOUDJI, Jeongil Jay KIM, Kevin Hsi-Huai WANG
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Patent number: 11594823Abstract: Techniques are provided for improving the performance of a multi-band antenna in a wireless device. An example wireless device includes at least one radio frequency integrated circuit, and at least one patch antenna operably coupled to the at least one radio frequency integrated circuit, including a first patch operably coupled to the at least one radio frequency integrated circuit, a ground plane disposed below the first patch, and a plurality of via wall structures disposed around the first patch, wherein each of the plurality of via wall structures is electrically coupled to the ground plane.Type: GrantFiled: December 11, 2020Date of Patent: February 28, 2023Assignee: QUALCOMM IncorporatedInventors: Taesik Yang, Mohammad Ali Tassoudji, Jeongil Jay Kim, Darryl Sheldon Jessie, Kevin Hsi-Huai Wang
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Patent number: 11581664Abstract: An antenna is described. The antenna includes a first plurality of first elements. Each of the first elements is dual polarized and configured to support a first set of bands and a second set of bands that is mutually exclusive from the first set of bands. The antenna also includes a second plurality of second elements. Each of the second elements is dual polarized and configured to support the second set of bands. The second plurality of second elements is interleaved with the first plurality of first elements.Type: GrantFiled: August 5, 2021Date of Patent: February 14, 2023Assignee: QUALCOMM IncorporatedInventors: Jorge Fabrega Sanchez, Mohammad Ali Tassoudji, Assaf Aviv, Taesik Yang, Jeongil Jay Kim, Kevin Hsi-Huai Wang
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Publication number: 20220278452Abstract: An electronic device includes a first antenna, a second antenna, and a device cover. The first antenna may be configured to transmit or receive signals at a first frequency, and the second antenna may be configured to transmit or receive signals at a second frequency. The device cover may be configured to enclose at least a portion of the device, and may have a first thickness in a first area and a second thickness in a second area. The first area may be substantially aligned with a boresight of the first antenna, and the second area may be substantially aligned with a boresight of the second antenna. The first thickness may be different than the second thickness.Type: ApplicationFiled: May 20, 2022Publication date: September 1, 2022Inventors: Jeongil Jay Kim, Alberto Cicalini, Mohammad Ali Tassoudji, Jorge Fabrega Sanchez, Taesik Yang, Kevin Hsi-Huai Wang
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Publication number: 20220190485Abstract: Techniques are provided for improving the performance of a multi-band antenna in a wireless device. An example wireless device includes at least one radio frequency integrated circuit, and at least one patch antenna operably coupled to the at least one radio frequency integrated circuit, including a first patch operably coupled to the at least one radio frequency integrated circuit, a ground plane disposed below the first patch, and a plurality of via wall structures disposed around the first patch, wherein each of the plurality of via wall structures is electrically coupled to the ground plane.Type: ApplicationFiled: December 11, 2020Publication date: June 16, 2022Inventors: Taesik YANG, Mohammad Ali TASSOUDJI, Jeongil Jay KIM, Darryl Sheldon JESSIE, Kevin Hsi-Huai WANG
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Patent number: 11362421Abstract: An electronic device includes a first antenna, a second antenna, and a device cover. The first antenna may be configured to transmit or receive signals at a first frequency, and the second antenna may be configured to transmit or receive signals at a second frequency. The device cover may be configured to enclose at least a portion of the device, the and may have a first thickness in a first area and a second thickness in a second area. The first area may be substantially aligned with a boresight of the first antenna, and the second area may be substantially aligned with a boresight of the second antenna. The first thickness may be different than the second thickness.Type: GrantFiled: December 26, 2019Date of Patent: June 14, 2022Assignee: QUALCOMM IncorporatedInventors: Jeongil Jay Kim, Alberto Cicalini, Mohammad Ali Tassoudji, Jorge Fabrega Sanchez, Taesik Yang, Kevin Hsi-Huai Wang
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Publication number: 20220123470Abstract: Various wireless device and antenna array configurations are provided. An example wireless device includes at least one radio frequency integrated circuit, at least one patch antenna element operably coupled to the at least one radio frequency integrated circuit, at least one dipole antenna comprising two dipole antenna elements disposed adjacent to the at least one patch antenna element and operably coupled to the at least one radio frequency integrated circuit, and at least one high impedance surface disposed below the at least one dipole antenna and adjacent to the at least one patch antenna element.Type: ApplicationFiled: October 20, 2020Publication date: April 21, 2022Inventors: Jeongil Jay KIM, Sangkil KIM, Darryl Sheldon JESSIE
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Publication number: 20220094075Abstract: Techniques are provided for improving the bandwidth of a dual-band antenna in a mobile device. An example wireless device includes at least one radio frequency integrated circuit, and at least one patch antenna array operably coupled to the least one radio frequency integrated circuit, comprising a first rectangular patch including a first side and a second side, wherein a length of the first side is greater than a length of the second side, and a second rectangular patch including a first side and a second side of the same dimensions as the respective first side and the second side of the first rectangular patch, wherein the first side of the second rectangular patch is disposed adjacent and parallel to the second side of the first rectangular patch.Type: ApplicationFiled: September 22, 2020Publication date: March 24, 2022Inventors: Jeongil Jay KIM, Li LIU, Kevin Hsi-Huai WANG
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Publication number: 20220045442Abstract: An antenna is described. The antenna includes a first plurality of first elements. Each of the first elements is dual polarized and configured to support a first set of bands and a second set of bands that is mutually exclusive from the first set of bands. The antenna also includes a second plurality of second elements. Each of the second elements is dual polarized and configured to support the second set of bands. The second plurality of second elements is interleaved with the first plurality of first elements.Type: ApplicationFiled: August 5, 2021Publication date: February 10, 2022Inventors: Jorge Fabrega Sanchez, Mohammad Ali Tassoudji, Assaf Aviv, Taesik Yang, Jeongil Jay Kim, Kevin Hsi-Huai Wang
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Publication number: 20210366838Abstract: Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding. A RFIC package includes an IC die layer that includes a RFIC die(s) mounted on a substrate that includes substrate metallization layers, a substrate core, and substrate antenna layers. The RFIC package includes an EMI shield surrounding the IC die layer and extending down shared sidewalls of the IC die layer and the substrate. The EMI shield extends down the sidewalls of the IC die layer and substrate metallization layers of the substrate to at least the interface between the substrate metallization layers and the substrate core, and without extending adjacent to the sidewall of the substrate antenna layers. In this manner, antenna performance of the antenna module may not be degraded, because extending the EMI shield down sidewalls of the substrate antenna layers can create a resonance cavity in the substrate.Type: ApplicationFiled: May 20, 2020Publication date: November 25, 2021Inventors: Jeahyeong Han, Rajneesh Kumar, Jeongil Jay Kim, Chin-Kwan Kim
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Publication number: 20210351488Abstract: A multi-core broadband printed circuit board (PCB) antenna and methods for fabricating such an antenna are provided. One example antenna implemented with a multi-core PCB generally includes a first core structure, a second core structure disposed above the first core structure, and one or more metal layers disposed above the second core structure or below the first core structure. The first core structure includes a first core layer, a first metal layer disposed below the first core layer, and a second metal layer disposed above the first core layer. The second core structure includes a second core layer, a third metal layer disposed below the second core layer, and a fourth metal layer disposed above the second core layer. The first core layer and the second core layer may have different thicknesses.Type: ApplicationFiled: May 11, 2020Publication date: November 11, 2021Inventors: Chaoqi ZHANG, Suhyung HWANG, Jaehyun YEON, Taesik YANG, Jeongil Jay KIM, Darryl Sheldon JESSIE, Mohammad Ali TASSOUDJI