Patents by Inventor Jeong Il Kim
Jeong Il Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11976975Abstract: Provided is an optical system which may acquire a hyperspectral image by acquiring a spectral image of an object to be measured, which includes, to collect spectral data and train the neural network, an image forming part forming an image from an object to be measured and transmitting collimated light, a slit moving to scan the incident image and passing and outputting a part of the formed image, and a first optical part obtaining spectral data by splitting light of the image received through the slit by wavelength. Also, the system includes, to decompose overlapped spectral data and to infer hyperspectral image data through the trained neural network, an image forming part forming an image from an object to be measured and transmitting collimated light, and a first optical part obtaining spectral data by splitting light of the received image by wavelength.Type: GrantFiled: January 7, 2022Date of Patent: May 7, 2024Assignee: Electronics and Telecommunications Research InstituteInventors: Keo Sik Kim, Kye Eun Kim, Jeong Eun Kim, Hyun Seo Kang, Hyun Jin Kim, Gi Hyeon Min, Si Woong Park, Hyoung Jun Park, Chan Il Yeo, Young Soon Heo
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Publication number: 20240147744Abstract: A display panel may include a light emitting element including a light emitting layer and a sensor including a photosensitive layer on a substrate. The light emitting element and the sensor each may include respective portions of first and second common auxiliary layers, which may be continuous under and over the light emitting layer and the photosensitive layer. The first and second common auxiliary layers respectively may include a hole transport material and an electron transport material. The photosensitive layer may include first and second semiconductor layers close to the first and second common auxiliary layers, respectively. The first and second semiconductor layers respectively may include a p-type semiconductor and an n-type semiconductor. The second semiconductor layer may have an uneven surface facing the second common auxiliary layer and may have an average roughness (Rq) of greater than or equal to about 5 nm.Type: ApplicationFiled: September 22, 2023Publication date: May 2, 2024Applicant: Samsung Electronics Co., Ltd.Inventors: Sungyoung YUN, Hyeong-Ju KIM, Kyung Bae PARK, Jungyun WON, Bongsu KIM, Seongyong PARK, Jeong Il PARK
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Publication number: 20240137568Abstract: Disclosed is a method and apparatus for encoding/decoding a video. According to an embodiment, provided is a method of setting a level for each of one or more regions, including decoding a definition syntax element related to level definition and a designation syntax element related to target designation from a bitstream; defining one or more levels based on the definition syntax element; and setting a target level designated by the designation syntax element among the defined levels for a target region designated by the designation syntax element.Type: ApplicationFiled: January 2, 2024Publication date: April 25, 2024Inventors: Jeong-yeon LIM, Jae Seob SHIN, Sun Young LEE, Se Hoon SON, Tae Young NA, Jae Il KIM
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Publication number: 20240135595Abstract: The present invention relates to a method and apparatus for encoding a displacement video using image tiling. A method for encoding multi-dimensional data according to an embodiment of the present disclosure may comprise: converting the multi-dimensional data into one or more frames with two-dimensional characteristics; generating one or more frame groups by grouping the one or more frames with pre-configured number units; reconstructing frames belonging to each frame group into a tiled frame; and generating a bitstream by encoding the tiled frame. Here, the tiled frame may be constructed with one or more blocks, and each block may be constructed by rearranging pixels existing at the same location in the frames.Type: ApplicationFiled: October 17, 2023Publication date: April 25, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Da Yun NAM, Hyun Cheol KIM, Jeong Il SEO, Seong Yong LIM, Chae Eun RHEE, Gwang Cheol RYU, Yong Wook SEO, Hyun Min JUNG
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Publication number: 20240128603Abstract: The present invention relates to an electrode tab welding apparatus for welding electrode tabs of a pouch-shaped battery to each other in a state of gathering the electrode tabs using tab guides in a preliminary welding step of welding the electrode tabs to each other before welding the electrode tabs and an electrode lead of the pouch-shaped battery to each other and an electrode tab welding method using the same.Type: ApplicationFiled: October 25, 2021Publication date: April 18, 2024Applicant: LG Energy Solution, Ltd.Inventors: Sang Hun Kim, Sung Hun Oh, Jeong Jin Ban, Tae Jong Kim, Sun Il Lee
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Publication number: 20240119949Abstract: An encoding/decoding apparatus and method for controlling a channel signal is disclosed, wherein the encoding apparatus may include an encoder to encode an object signal, a channel signal, and rendering information for the channel signal, and a bit stream generator to generate, as a bit stream, the encoded object signal, the encoded channel signal, and the encoded rendering information for the channel signal.Type: ApplicationFiled: November 30, 2023Publication date: April 11, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Jeong Il SEO, Seung Kwon BEACK, Dae Young JANG, Kyeong Ok KANG, Tae Jin PARK, Yong Ju LEE, Keun Woo CHOI, Jin Woong KIM
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Patent number: 11951204Abstract: The present disclosure relates to a novel cell-penetrating multifunctional peptide, a composition including the same.Type: GrantFiled: September 27, 2022Date of Patent: April 9, 2024Assignee: S-SKIN. CO., LTD.Inventors: Byung-Il Kim, Jeong Hee Im, Jeong Gun Lee
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Publication number: 20240098437Abstract: Disclosed is an apparatus and method for processing a multichannel audio signal. A multichannel audio signal processing method may include: generating an N-channel audio signal of N channels by down-mixing an M-channel audio signal of M channels; and generating a stereo audio signal by performing binaural rendering of the N-channel audio signal.Type: ApplicationFiled: December 1, 2023Publication date: March 21, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Yong Ju LEE, Jeong Il SEO, Seung Kwon BEACK, Kyeong Ok KANG, Jin Woong KIM, Jae Hyoun YOO
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Publication number: 20240075920Abstract: A method for controlling driving of a hybrid electric vehicle includes collecting driving data while the hybrid electric vehicle is driven, determining whether the hybrid electric vehicle enters a first mode corresponding to emergency driving of the hybrid electric vehicle or a second mode corresponding to control in preparation for the emergency driving, and controlling the hybrid electric vehicle in accordance with a mode that the hybrid electric vehicle enters among the first mode and the second mode.Type: ApplicationFiled: January 31, 2023Publication date: March 7, 2024Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Sung Bae Jeon, Seong Wook Moon, Do Hwa Kim, Gyu Ri Lee, Sung Il Jung, Jae Young Park, Jeong Eun Kim, Hui Un Son
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Patent number: 11804447Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: GrantFiled: January 22, 2021Date of Patent: October 31, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jun Ho Jeon, Kyeong Sool Seong, Seok Ho Na, Jeong Il Kim, Young Kyu Kim, Sung Ho Jeon, Deok In Lim, Sung Moo Hong, Sung Jung Kim, Sung Han Ryu, Kyung Nam Kang, Seong Hak Yoo
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Publication number: 20220166127Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.Type: ApplicationFiled: February 7, 2022Publication date: May 26, 2022Inventors: Seong Heon JEONG, Rajneesh KUMAR, Mohammad Ali TASSOUDJI, Darryl JESSIE, Gurkanwal SAHOTA, Kevin Hsi Huai WANG, Jeong IL KIM, Taesik YANG, Thomas MYERS, Neil BURNS, Julio ZEGARRA, Clinton James WILBER, Jordan SZABO
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Patent number: 11245175Abstract: An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.Type: GrantFiled: September 27, 2018Date of Patent: February 8, 2022Assignee: QUALCOMM IncorporatedInventors: Seong Heon Jeong, Rajneesh Kumar, Mohammad Ali Tassoudji, Darryl Jessie, Gurkanwal Sahota, Kevin Hsi Huai Wang, Jeong Il Kim, Taesik Yang, Thomas Myers, Neil Burns, Julio Zegarra, Clinton James Wilber, Jordan Szabo
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Publication number: 20210143105Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: ApplicationFiled: January 22, 2021Publication date: May 13, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jun Ho JEON, Kyeong Sool SEONG, Seok Ho NA, Jeong Il KIM, Young Kyu KIM, Sung Ho JEON, Deok In LIM, Sung Moo HONG, Sung Jung KIM, Sung Han RYU, Kyung Nam KANG, Seong Hak YOO
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Patent number: 10943871Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: GrantFiled: October 18, 2018Date of Patent: March 9, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jun Ho Jeon, Kyeong Sool Seong, Seok Ho Na, Jeong Il Kim, Young Kyu Kim, Sung Ho Jeon, Deok In Lim, Sung Moo Hong, Sung Jung Kim, Sung Han Ryu, Kyung Nam Kang, Seong Hak Yoo
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Patent number: 10931925Abstract: The present invention relates to a monitoring camera having an autofocusing function based on a composite filtering robust against a change in visibility status and a video monitoring system employing the same. The present invention comprises: a hardware filter for blocking one of a visible light band and an infrared light band and allowing the other thereof to pass therethrough; and a software filter for filtering a color image or a black-and-white image generated by an image signal processor (ISP) by removing, from the color image or the black-and-white image, a factor reducing a visibility distance at the front side of a lens part, wherein the filtering band of the hardware filter and whether to perform filtering by the software filter are controlled according to a filtering level corresponding to a current visibility status at the front side of the lens part among a plurality of filtering levels.Type: GrantFiled: May 8, 2017Date of Patent: February 23, 2021Assignee: ESCA(ELECTRONIC SECURITY OF THE CREATIVE ASSOCIATION) CO., LTD.Inventors: Tae-woong Jeong, Jeong-il Kim
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Patent number: 10819941Abstract: The present invention relates to a monitoring camera using a composite filtering method robust against a change in visibility status and a video monitoring system employing the same. The present invention comprises: a hardware filter for blocking one of a visible light band and an infrared light band and allowing the other thereof to pass therethrough; and a software filter for filtering a color image or a black-and-white image generated by an image signal processor (ISP) by removing, from the color image or the black-and-white image, a factor reducing a visibility distance at the front side of a lens part, wherein the filtering band of the hardware filter and whether to perform filtering by the software filter are controlled according to a filtering level corresponding to a current visibility status at the front side of the lens part among a plurality of filtering levels.Type: GrantFiled: May 8, 2017Date of Patent: October 27, 2020Assignee: ESCA (ELECTRONIC SECURITY OF THE CREATIVE ASSOCATION) CO., LTD.Inventors: Tae-woong Jeong, Jeong-il Kim
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Publication number: 20200228762Abstract: The present invention relates to a monitoring camera having an autofocusing function based on a composite filtering robust against a change in visibility status and a video monitoring system employing the same. The present invention comprises: a hardware filter for blocking one of a visible light band and an infrared light band and allowing the other thereof to pass therethrough; and a software filter for filtering a color image or a black-and-white image generated by an image signal processor (ISP) by removing, from the color image or the black-and-white image, a factor reducing a visibility distance at the front side of a lens part, wherein the filtering band of the hardware filter and whether to perform filtering by the software filter are controlled according to a filtering level corresponding to a current visibility status at the front side of the lens part among a plurality of filtering levels.Type: ApplicationFiled: May 8, 2017Publication date: July 16, 2020Inventors: Tae-woong JEONG, Jeong-il KIM
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Publication number: 20190215479Abstract: The present invention relates to a monitoring camera using a composite filtering method robust against a change in visibility status and a video monitoring system employing the same. The present invention comprises: a hardware filter for blocking one of a visible light band and an infrared light band and allowing the other thereof to pass therethrough; and a software filter for filtering a color image or a black-and-white image generated by an image signal processor (ISP) by removing, from the color image or the black-and-white image, a factor reducing a visibility distance at the front side of a lens part, wherein the filtering band of the hardware filter and whether to perform filtering by the software filter are controlled according to a filtering level corresponding to a current visibility status at the front side of the lens part among a plurality of filtering levels.Type: ApplicationFiled: May 8, 2017Publication date: July 11, 2019Applicant: ESCA(ELECTRONIC SECURITY OF THE CREATIVE ASSOCIATION) CO., LTD.Inventors: Tae-woong JEONG, Jeong-il KIM
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Patent number: 10243411Abstract: The present disclosure pertains to wireless chargers. In one embodiment, a 2×2 array of conductive coils produces magnetic fields. Adjacent coils receive current having different directions to cancel magnetic fields around a periphery of the array. A wireless charging platform may include at least four such coils. Regions between and above the coils may include magnetic fields approximately parallel to the surface of the platform so that electronic devices may be charged while standing up during operation by a user with reduced exposure to magnetic radiation. An electronic device may also be placed flat on each coil for charging.Type: GrantFiled: September 18, 2014Date of Patent: March 26, 2019Assignee: QUALCOMM IncorporatedInventors: Seong Heon Jeong, Jeong Il Kim
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Publication number: 20190051616Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: ApplicationFiled: October 18, 2018Publication date: February 14, 2019Applicant: AMKOR TECHNOLOGY INC.Inventors: Jun Ho JEON, Kyeong Sool SEONG, Seok Ho NA, Jeong Il KIM, Young Kyu KIM, Sung Ho JEON, Deok In LIM, Sung Moo HONG, Sung Jung KIM, Sung Han RYU, Kyung Nam KANG, Seong Hak YOO