Patents by Inventor Jeongil Lee

Jeongil Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136920
    Abstract: The present disclosure provides power supply apparatuses and controlling methods thereof. In some embodiments, a power supply apparatus includes a power factor correction (PFC) circuit, and a control circuit configured to control the PFC circuit. The PFC circuit includes a power inputter configured to receive alternating current voltage to be rectified, an inductor having an end coupled to an end of the power inputter, a first switching element configured to be turned on and off according to a first control signal, a second switching element configured to be turned on and off according to a second control signal, and an outputter configured to output a direct current voltage through an output capacitor. The control circuit is further configured to respectively apply the first and second control signals to the first and second switching elements such that the first and the second switching elements are alternately turned on.
    Type: Application
    Filed: August 22, 2023
    Publication date: April 25, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Wonmyung Woo, Duhee Jang, Duhee Jang, Jeongil Kang, Hyungwan Kim, Sanghoon Lee
  • Publication number: 20240075442
    Abstract: The present invention relates to a hydrogen generator, and the purpose of the present invention is to provide a hydrogen generator wherein thermal efficiency is maximized, structural changes according to amounts of production are easily implemented, and DME is used as the main source material.
    Type: Application
    Filed: March 18, 2022
    Publication date: March 7, 2024
    Inventors: Wonjun CHO, Jeseol LEE, Youngsoo LEE, Wonaje CHO, Hyejin YU, Junwoo LEE, Jeongil LEE
  • Patent number: 11338255
    Abstract: A micro-bubble generating system according to an embodiment of the present invention may include an electrolytic bath configured to generate primary micro-bubbles; a water supply hose which is connected to an outlet end of the electrolytic bath; and a micro-bubble generating device which is connected to the outlet end of the water supply hose to generate secondary micro-bubbles having a smaller diameter than the primary micro-bubbles.
    Type: Grant
    Filed: December 18, 2017
    Date of Patent: May 24, 2022
    Assignees: LG Electronics Inc., Chungang University Industry Academic Cooperation Foundation
    Inventors: Hyungki Hong, Sangki Woo, Sangsoo Ahn, Jongmin Kim, Seunghoon Oh, Jeongil Lee, Minsub Hwang
  • Publication number: 20200078745
    Abstract: A micro-bubble generating system according to an embodiment of the present invention may include an electrolytic bath configured to generate primary micro-bubbles; a water supply hose which is connected to an outlet end of the electrolytic bath; and a micro-bubble generating device which is connected to the outlet end of the water supply hose to generate secondary micro-bubbles having a smaller diameter than the primary micro-bubbles.
    Type: Application
    Filed: December 18, 2017
    Publication date: March 12, 2020
    Inventors: Hyungki HONG, Sangki WOO, Sangsoo AHN, Jongmin KIM, Seunghoon OH, Jeongil LEE, Minsub HWANG
  • Patent number: 9236912
    Abstract: Generally, this disclosure provides systems, methods and platforms for power multiplexer switching operations. The system may include a near field communication (NFC) module configured to receive power through a radio frequency (RF) channel; a subscriber identity module (SIM) circuit configured with a supply voltage port; and a power multiplexer circuit configured to controllably couple the SIM circuit supply voltage port to the NFC module, wherein the NFC module provides a supply voltage to the SIM circuit such that the SIM circuit is operable in the absence of primary device power source.
    Type: Grant
    Filed: November 23, 2012
    Date of Patent: January 12, 2016
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Ni Sun, Jeongil Lee, Sam Zheng
  • Patent number: 8003447
    Abstract: A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: August 23, 2011
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Jeongil Lee, Myoungho Lee, Bigildis Dosdos, Charles Suico, Edwin Man Fai Lee, David Chong Sook Lim, Adriano M. Vilas-Boas
  • Publication number: 20110078899
    Abstract: A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.
    Type: Application
    Filed: December 9, 2010
    Publication date: April 7, 2011
    Inventors: Jeongil Lee, Myoungho Lee, Bigildis Dosdos, Charles Suico, Lee Man Fai Edwin, David Chong Sook Lim, Adriano M. Vilas-Boas
  • Patent number: 7868432
    Abstract: A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.
    Type: Grant
    Filed: February 8, 2007
    Date of Patent: January 11, 2011
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Jeongil Lee, Myoungho Lee, Bigildis Dosdos, Charles Suico, Lee Man Fai Edwin, David Chong Sook Lim, Adriano M. Vilas-Boas
  • Publication number: 20070187807
    Abstract: A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.
    Type: Application
    Filed: February 8, 2007
    Publication date: August 16, 2007
    Inventors: Jeongil Lee, Myoungho Lee, Bigildis Dosdos, Charles Suico, Lee Man Fai Edwin, David Chong Sook Lim, Adriano M. Vilas-Boas