Patents by Inventor Jeongil Lee
Jeongil Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136920Abstract: The present disclosure provides power supply apparatuses and controlling methods thereof. In some embodiments, a power supply apparatus includes a power factor correction (PFC) circuit, and a control circuit configured to control the PFC circuit. The PFC circuit includes a power inputter configured to receive alternating current voltage to be rectified, an inductor having an end coupled to an end of the power inputter, a first switching element configured to be turned on and off according to a first control signal, a second switching element configured to be turned on and off according to a second control signal, and an outputter configured to output a direct current voltage through an output capacitor. The control circuit is further configured to respectively apply the first and second control signals to the first and second switching elements such that the first and the second switching elements are alternately turned on.Type: ApplicationFiled: August 22, 2023Publication date: April 25, 2024Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Wonmyung Woo, Duhee Jang, Duhee Jang, Jeongil Kang, Hyungwan Kim, Sanghoon Lee
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Publication number: 20240075442Abstract: The present invention relates to a hydrogen generator, and the purpose of the present invention is to provide a hydrogen generator wherein thermal efficiency is maximized, structural changes according to amounts of production are easily implemented, and DME is used as the main source material.Type: ApplicationFiled: March 18, 2022Publication date: March 7, 2024Inventors: Wonjun CHO, Jeseol LEE, Youngsoo LEE, Wonaje CHO, Hyejin YU, Junwoo LEE, Jeongil LEE
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Patent number: 11338255Abstract: A micro-bubble generating system according to an embodiment of the present invention may include an electrolytic bath configured to generate primary micro-bubbles; a water supply hose which is connected to an outlet end of the electrolytic bath; and a micro-bubble generating device which is connected to the outlet end of the water supply hose to generate secondary micro-bubbles having a smaller diameter than the primary micro-bubbles.Type: GrantFiled: December 18, 2017Date of Patent: May 24, 2022Assignees: LG Electronics Inc., Chungang University Industry Academic Cooperation FoundationInventors: Hyungki Hong, Sangki Woo, Sangsoo Ahn, Jongmin Kim, Seunghoon Oh, Jeongil Lee, Minsub Hwang
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Publication number: 20200078745Abstract: A micro-bubble generating system according to an embodiment of the present invention may include an electrolytic bath configured to generate primary micro-bubbles; a water supply hose which is connected to an outlet end of the electrolytic bath; and a micro-bubble generating device which is connected to the outlet end of the water supply hose to generate secondary micro-bubbles having a smaller diameter than the primary micro-bubbles.Type: ApplicationFiled: December 18, 2017Publication date: March 12, 2020Inventors: Hyungki HONG, Sangki WOO, Sangsoo AHN, Jongmin KIM, Seunghoon OH, Jeongil LEE, Minsub HWANG
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Patent number: 9236912Abstract: Generally, this disclosure provides systems, methods and platforms for power multiplexer switching operations. The system may include a near field communication (NFC) module configured to receive power through a radio frequency (RF) channel; a subscriber identity module (SIM) circuit configured with a supply voltage port; and a power multiplexer circuit configured to controllably couple the SIM circuit supply voltage port to the NFC module, wherein the NFC module provides a supply voltage to the SIM circuit such that the SIM circuit is operable in the absence of primary device power source.Type: GrantFiled: November 23, 2012Date of Patent: January 12, 2016Assignee: Fairchild Semiconductor CorporationInventors: Ni Sun, Jeongil Lee, Sam Zheng
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Patent number: 8003447Abstract: A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.Type: GrantFiled: December 9, 2010Date of Patent: August 23, 2011Assignee: Fairchild Semiconductor CorporationInventors: Jeongil Lee, Myoungho Lee, Bigildis Dosdos, Charles Suico, Edwin Man Fai Lee, David Chong Sook Lim, Adriano M. Vilas-Boas
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Publication number: 20110078899Abstract: A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.Type: ApplicationFiled: December 9, 2010Publication date: April 7, 2011Inventors: Jeongil Lee, Myoungho Lee, Bigildis Dosdos, Charles Suico, Lee Man Fai Edwin, David Chong Sook Lim, Adriano M. Vilas-Boas
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Patent number: 7868432Abstract: A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.Type: GrantFiled: February 8, 2007Date of Patent: January 11, 2011Assignee: Fairchild Semiconductor CorporationInventors: Jeongil Lee, Myoungho Lee, Bigildis Dosdos, Charles Suico, Lee Man Fai Edwin, David Chong Sook Lim, Adriano M. Vilas-Boas
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Publication number: 20070187807Abstract: A multi-chip module suitable for use in a battery protection circuit. The multi-chip module includes an integrated circuit chip, a first power transistor, a second power transistor, a first connection structure electrically coupling the integrated circuit chip to the first power transistor, a second connection structure electrically coupling the integrated circuit chip to the second power transistor, and a leadframe structure comprising a first lead, a second lead, a third lead and a fourth lead, wherein the integrated circuit chip, the first power transistor, and the second power transistor are mounted on the leadframe structure. A molding material covers at least part of the integrated circuit chip, the first power transistor, the second power transistor, the first connection structure, and the second connection structure.Type: ApplicationFiled: February 8, 2007Publication date: August 16, 2007Inventors: Jeongil Lee, Myoungho Lee, Bigildis Dosdos, Charles Suico, Lee Man Fai Edwin, David Chong Sook Lim, Adriano M. Vilas-Boas