Abstract: A semiconductor package includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first semiconductor chip includes a plurality of through electrodes, first bonding pads provided on a first surface of a first substrate, a first passivation layer provided on the first surface and exposing the first bonding pads, a polishing stop layer pattern provided on a second surface of the first substrate and exposing end portions of the plurality of through electrodes, and second bonding pads provided on the polishing stop layer pattern. The second semiconductor chip includes third bonding pads provided on a first surface of a second substrate, and a second passivation layer provided on the first surface of the second substrate and exposing the third bonding pads. The first bonding pads and the third bonding pads are directly bonded to each other.

Abstract: A measurement system according to an embodiment of the present invention comprises: an analyzer; a first expansion module for transmitting a first electromagnetic wave signal to a first antenna under control of the analyzer; a second expansion module for receiving a second electromagnetic wave signal through a second antenna; a first signal generator for generating a first local oscillation signal under control of the analyzer, and detecting a reference characteristic of the first electromagnetic wave signal and a first test characteristic of the first antenna by using the first local oscillation signal; and a second signal generator for generating a second local oscillation signal under control of the analyzer, and detecting a second test characteristic of the second antenna by using the second local oscillation signal, wherein the first signal generator comprises a controller for converting instructions transmitted from the analyzer into internal instructions, and a local oscillation signal generator for ge

Abstract: A measurement system according to an embodiment of the present invention comprises: an analyzer; a first expansion module for transmitting a first electromagnetic wave signal to a first antenna under control of the analyzer; a second expansion module for receiving a second electromagnetic wave signal through a second antenna; a first signal generator for generating a first local oscillation signal under control of the analyzer, and detecting a reference characteristic of the first electromagnetic wave signal and a first test characteristic of the first antenna by using the first local oscillation signal; and a second signal generator for generating a second local oscillation signal under control of the analyzer, and detecting a second test characteristic of the second antenna by using the second local oscillation signal, wherein the first signal generator comprises a controller for converting instructions transmitted from the analyzer into internal instructions, and a local oscillation signal generator for ge

Abstract: A multi-cylinder compressor includes a valve plate having a plurality of cylinder suction ports formed therethrough, and a plurality of cylinder bores centered on an arc having a radius (R). The cylinder bores are substantially equally spaced from each other, and have a diameter (D). The compressor also includes a suction chamber having a substantially annular shape and adapted to be in fluid communication with each of the cylinder bores via the suction ports. Moreover, a center of a first of the suction ports is radially offset in a predetermined direction from a center of a predetermined suction port by a first angle, in which the predetermined suction port has a diameter (d), and the first angle equals {[(360°/N)·([N?1]?n)]+X°}.