Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on the body and connected to the internal electrode layer. A region, containing nickel (Ni) and carbon (C), is present between the internal electrode layer and the dielectric layer.

Abstract: Provided is a stack package comprising: a substrate comprising a cavity; a first semiconductor chip disposed in the cavity; and a second semiconductor chip stacked on the substrate and electrically connected to the substrate by a plurality of conductive external terminals such as conductive bumps. Since both a horizontal packaging method using bonding wires and a flip-chip packaging method are used and the bonding wires of the horizontal package and the conductive external terminals for the flip-chip bonding are formed on substantially the same plane, the total height of the stack package is reduced.