Patents by Inventor Jeong-Min Cha

Jeong-Min Cha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11950158
    Abstract: The present invention relates to a method and device for distributing idle UE by a carrier in eNB of a multi-carrier based mobile communication system. The method of distributing idle UE in a multi-carrier based mobile communication system according to the present invention includes a process of determining a search rate by a carrier on the basis of information representing load on the carrier, a step of determining a cell reselection priority on the idle UE on the basis of the determined search rate, and a process of transmitting the determined cell reselection priority to the idle UE.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: April 2, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jeong-Jae Won, Dae-Joong Kim, Han-Seok Kim, Abhishek Roy, Hwa-Jin Cha, Jung-Min Choi
  • Patent number: 10480898
    Abstract: A low-shock separation device is characterized in that an internal locking structure is unlocked and a bolt is separated by operating a specific part of components thereof using high pressure that is generated by combustion of powder.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: November 19, 2019
    Assignee: AGENCY FOR DEFENSE DEVELOPMENT
    Inventors: Dong-Jin Kim, Zaeill Kim, Nam-Choon Kim, Yeung-Jo Lee, Jeong-Min Cha
  • Publication number: 20190249951
    Abstract: A low-shock separation device is characterized in that an internal locking structure is unlocked and a bolt is separated by operating a specific part of components thereof using high pressure that is generated by combustion of powder.
    Type: Application
    Filed: February 12, 2018
    Publication date: August 15, 2019
    Inventors: Dong-Jin KIM, ZAEILL KIM, Nam-Choon KIM, Yeung-Jo LEE, Jeong-Min Cha
  • Publication number: 20060060146
    Abstract: A semiconductor manufacturing apparatus for use with a workpiece includes a first structure, a second structure, and a current applying device. The first structure is adapted to hold the workpiece and includes a first coupling member. The second structure includes a second coupling member. The current applying device is adapted to selectively apply a current to at least one of the first and second coupling members to magnetize the at least one of the first and second coupling members such that the first coupling member is magnetically coupled with the second coupling member.
    Type: Application
    Filed: September 20, 2005
    Publication date: March 23, 2006
    Inventor: Jeong-Min Cha