Abstract: An ethylene/alpha-olefin copolymer having excellent physical properties showing reduced immersion time of a crosslinking agent and a high degree of crosslinking, and a composition for an encapsulant film, comprising the same, is described herein.

Abstract: The present invention relates to a retraction system for laparoscopic surgery. According to one embodiment of the present invention, the retraction system includes: a retraction part for holding an object or tissue to be retracted; a retraction fiber control part for retracting the retraction part at the area to be retracted by means of a retraction fiber to fix the retraction part; and an abdominal wall fixer coupled to the retraction fiber control part, wherein the abdominal wall fixer is fixed to the abdominal wall. The retraction fiber control part includes: a retraction fiber control part body having a retraction hole through which the retraction fiber connected to the retraction part passes in the lower portion thereof; and a retraction fiber fixing part disposed outside the retraction fiber control part body so as to retract the retraction fiber or fix the retraction fiber such that the retraction fiber is immovable.

Abstract: An apparatus for reducing residual stress of a semiconductor includes a stage configured to support a semiconductor wafer having the residual stress generated by a semiconductor manufacturing process. The apparatus includes an intense pulsed light (IPL) irradiation unit configured to irradiate IPL to the semiconductor wafer to reduce the residual stress of the semiconductor wafer, the IPL radiation unit being separated from the stage. The apparatus further includes at least one alignment unit configured to adjust relative positions of the stage and the IPL irradiation unit.

Abstract: The present invention relates to a retraction system for laparoscopic surgery. According to one embodiment of the present invention, the retraction system includes: a retraction part for holding an object or tissue to be retracted; a retraction fiber control part for retracting the retraction part at the area to be retracted by means of a retraction fiber to fix the retraction part; and an abdominal wall fixer coupled to the retraction fiber control part, wherein the abdominal wall fixer is fixed to the abdominal wall. The retraction fiber control part includes: a retraction fiber control part body having a retraction hole through which the retraction fiber connected to the retraction part passes in the lower portion thereof; and a retraction fiber fixing part disposed outside the retraction fiber control part body so as to retract the retraction fiber or fix the retraction fiber such that the retraction fiber is immovable.

Abstract: A trocar system for use in laparoscopic surgery is disclosed. According to an embodiment of the present invention, the trocar system includes: an upper housing having a circular or oval shape with a lower opening; a plurality of protrusion membranes provided to the upper housing to install a trocar; one or more tubes for sustaining air passage installed on the upper housing; and a lower guide formed at the lower edge of the upper housing, installed on the upper portion of a laparoscopic retractor, and conveniently removed therefrom. The trocar is fixedly installed on the protrusion membrane, and includes: a trocar body having a cylindrical shape; a valve cover disposed over the trocar body to close the upper space thereof; a recess for an installation ring disposed on the lower outer circumference of the trocar body; and an elastic press which is moved in conjunction with the side portion of an upper valve to open the upper valve; the trocar system further includes a seal part.

Abstract: A method of fabricating a semiconductor device includes preparing a semiconductor wafer having a top surface and a bottom surface. The semiconductor wafer is loaded onto a wafer chuck, and the bottom surface of the loaded semiconductor wafer faces the wafer chuck. A groove is formed in the top surface of the loaded semiconductor wafer by irradiating a second laser onto the top surface, and a reforming region is formed in the loaded semiconductor wafer under the groove by irradiating a first laser through wafer chuck and bottom surface of the semiconductor wafer into a region in which the first laser is focused. The semiconductor wafer is unloaded from the wafer chuck. The bottom surface of the semiconductor wafer is ground to decrease a thickness of the semiconductor wafer. The semiconductor wafer is separated along the groove and the reforming region, thereby forming a plurality of unit chips.

Abstract: A package substrate includes an insulating substrate having a mount region including external terminals mounted to the insulating substrate and a clamp region having an opening receiving a molding material therein, the clamp region disposed adjacent to the mount region in a first direction, a circuit pattern formed on the insulating substrate, and a blocking member blocking the molding material from moving from the clamp region to the mount region when the package substrate loaded in a mold die is pressurized to form a molding member, wherein the blocking member is disposed on at least one side of the package substrate in the clamp region, and the blocking member receives the molding material therein.

Abstract: A package substrate includes an insulating substrate having a mount region including external terminals mounted to the insulating substrate and a clamp region having an opening receiving a molding material therein, the clamp region disposed adjacent to the mount region in a first direction, a circuit pattern formed on the insulating substrate, and a blocking member blocking the molding material from moving from the clamp region to the mount region when the package substrate loaded in a mold die is pressurized to form a molding member, wherein the blocking member is disposed on at least one side of the package substrate in the clamp region, and the blocking member receives the molding material therein.