Patents by Inventor Jeongwan Choi

Jeongwan Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11932788
    Abstract: A conductive adhesive film according to an embodiment includes: an adhesive base layer including first and second major surfaces facing each other; and a plurality of discrete individual particles distributed in the adhesive base layer, wherein outer surfaces of the particles are coated with metal at least in part to form metal coatings, and the metal coatings are connected with one another and are extended between the first and second major surfaces, such that an electrically and mechanically continuous three-dimensional porous network of the metal is formed.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: March 19, 2024
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Jeongwan Choi, Taehoon Noh
  • Publication number: 20240084176
    Abstract: An electrically conductive bonding tape includes a conductive first film between, and bonded to, conductive first and second adhesive layers. The first film and the first and second adhesive layers are conductive at least along a thickness direction of the bonding tape. Each of the first and second adhesive layers includes conductive particles dispersed substantially as a single layer in a substantially insulative adhesive material. The plurality of conductive particles in each of the first and second adhesive layers has an average particle size Pav and a standard of deviation Psd, such that Psd/Pav is less than about 0.2. Each of the first and second adhesive layers has an average thickness of no more than about 15% greater than the average particle size of the particles in the adhesive layer. An average surface roughness of opposing major first and second surfaces of the first film is less than 10 microns.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 14, 2024
    Inventors: Junbeom Shin, Jeongwan Choi, Jong-Pil Kim
  • Publication number: 20230287248
    Abstract: An electrically conductive adhesive film includes an adhesive layer having opposing first and second major surfaces spaced apart a distance T in a thickness direction of the adhesive layer, where T?20 microns, and a plurality of electrically conductive particles dispersed in the adhesive layer between the first and second major surfaces. For at least 90% of the electrically conductive particles in the plurality of electrically conductive particles, the electrically conductive particles have a particle diameter D50 greater thank T/4 and a maximum size of the electrically conductive particles is less than T.
    Type: Application
    Filed: June 16, 2021
    Publication date: September 14, 2023
    Inventors: Taehoon Noh, Jeongwan Choi
  • Publication number: 20230235200
    Abstract: An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.
    Type: Application
    Filed: March 24, 2023
    Publication date: July 27, 2023
    Inventors: Jeongwan Choi, Jeffrey W. McCutcheon, Marina M. Kaplun, Steven Y. Yu, Jinbae Kim
  • Patent number: 11695195
    Abstract: An antenna includes a self-supporting electrically conductive wire having a width (W) and extending longitudinally along a length and between first and second ends of the conductive wire. The conductive wire forms one or more loops and comprises an electrically conductive layer disposed on and aligned with an adhesive layer. A width and a length of each of the conductive and adhesive layers are substantially co-extensive with the width and the length of the conductive wire.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: July 4, 2023
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Ya-Peng Fang, Jinbae Kim, Jung-ju Suh, Jeongwan Choi, Minji Kim
  • Publication number: 20230110790
    Abstract: An electrically conductive bonding tape includes a conductive self-supporting first layer conductive in each of three mutually orthogonal directions and including conductive opposing first and second major surfaces, an conductive second layer coated on the first major surface of the self-supporting first layer and having at least 60% by weight of nickel, the second layer having an exposed major surface facing away from the first major surface of the self-supporting first layer and exposing at least some of the nickel in the second layer, and a conductive adhesive third layer bonded to the second major surface of the self-supporting first layer opposite the second layer. The adhesive third layer is conductive in at least one of the three mutually orthogonal directions and includes a plurality of conductive elements dispersed in an insulative material, at least some of the conductive elements physically contacting the self-supporting first layer.
    Type: Application
    Filed: November 22, 2022
    Publication date: April 13, 2023
    Inventors: Jeongwan Choi, Jeffrey W. McCutcheon, Marina M. Kaplun, Steven Y. Yu, Jinbae Kim
  • Publication number: 20220112408
    Abstract: A conductive adhesive film according to an embodiment includes: an adhesive base layer including first and second major surfaces facing each other; and a plurality of discrete individual particles distributed in the adhesive base layer, wherein outer surfaces of the particles are coated with metal at least in part to form metal coatings, and the metal coatings are connected with one another and are extended between the first and second major surfaces, such that an electrically and mechanically continuous three-dimensional porous network of the metal is formed.
    Type: Application
    Filed: December 23, 2021
    Publication date: April 14, 2022
    Inventors: Jeongwan Choi, Taehoon Noh
  • Patent number: 11242473
    Abstract: A conductive adhesive film according to an embodiment includes: an adhesive base layer including first and second major surfaces facing each other; and a plurality of discrete individual particles distributed in the adhesive base layer, wherein outer surfaces of the particles are coated with metal at least in part to form metal coatings, and the metal coatings are connected with one another and are extended between the first and second major surfaces, such that an electrically and mechanically continuous three-dimensional porous network of the metal is formed.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: February 8, 2022
    Assignee: 3M Innovative Properties Company
    Inventors: Jeongwan Choi, Taehoon Noh
  • Publication number: 20210292612
    Abstract: The present disclosure relates to an acrylic pressure sensitive adhesive tape including a moisture barrier layer in a release layer, and to an acrylic pressure sensitive adhesive tape, which can enhance adhesion by the moisture barrier layer preventing reduction of adhesion of an acrylic adhesive layer caused by moisture.
    Type: Application
    Filed: May 3, 2018
    Publication date: September 23, 2021
    Inventors: Jeongwan Choi, Hayanmaeum Kim
  • Publication number: 20210246340
    Abstract: A conductive adhesive film according to an embodiment includes: an adhesive base layer including first and second major surfaces facing each other, and a plurality of discrete individual particles distributed in the adhesive base layer, wherein outer surfaces of the particles are coated with metal at least in part to form metal coatings, and the metal coatings am connected with one another and are extended between the first and second major surfaces, such that an electrically and mechanically continuous three-dimensional porous network of the metal is formed.
    Type: Application
    Filed: August 9, 2019
    Publication date: August 12, 2021
    Inventors: Jeongwan Choi, Taehoon Noh
  • Publication number: 20190334223
    Abstract: An antenna includes a self-supporting electrically conductive wire having a width (W) and extending longitudinally along a length and between first and second ends of the conductive wire. The conductive wire forms one or more loops and comprises an electrically conductive layer disposed on and aligned with an adhesive layer. A width and a length of each of the conductive and adhesive layers are substantially co-extensive with the width and the length of the conductive wire.
    Type: Application
    Filed: June 21, 2016
    Publication date: October 31, 2019
    Inventors: Ya-Peng Fang, Jinbae Kim, Jung-ju Suh, Jeongwan Choi, Minji Kim
  • Publication number: 20190316008
    Abstract: A stretchable conductive adhesive tape comprises an electrically-conductive pressure-sensitive adhesive layer having first and second opposed major surfaces. The electrically-conductive pressure-sensitive adhesive layer comprises electrically-conductive particles and an electrically-conductive stretchable fabric disposed within a polymer matrix. The electrically-conductive pressure-sensitive adhesive layer is electrically-conductive in all directions. An elastic backing is disposed on the first major surface of the electrically-conductive pressure-sensitive adhesive layer.
    Type: Application
    Filed: July 27, 2017
    Publication date: October 17, 2019
    Inventors: Jeongwan Choi, Jeffrey W. McCutcheon
  • Publication number: 20180249599
    Abstract: A system includes a curved circuit board with at least one electronic component mounted on the circuit board and electrically connected to a first electrically conductive trace of the circuit board. The system includes an electrically conductive curved fence conformably attached to the circuit board and surrounding the at least one electronic component. The fence is electrically connected to a different second electrically conductive trace of the circuit board. The system further includes an electrically conductive lid conformably attached to a top side of the fence. The electrically conductive lid covers the at least one electronic component. The fence comprises a plurality of spaced apart first tabs arranged along at least a first portion of a perimeter of the fence. Each first tab has a free end and is attached to the electrically conductive lid or the circuit board.
    Type: Application
    Filed: September 19, 2016
    Publication date: August 30, 2018
    Inventors: Jin-Bae Kim, Jung-Ju Suh, Jeongwan Choi
  • Publication number: 20160333232
    Abstract: An electrically conductive, single-sided tape includes a conductive adhesive layer, which includes a first conductive porous substrate having a plurality of passageways and an adhesive material positioned within at least a portion of the passageways; and a second conductive porous substrate positioned adjacent the conductive adhesive layer. Optionally, the electrically conductive, single-sided tape may include an opaque coating adjacent to a major surface of the second conductive porous substrate. Optionally, the adhesive material may include a plurality of conductive particles dispersed within the adhesive material.
    Type: Application
    Filed: January 21, 2015
    Publication date: November 17, 2016
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Jeongwan Choi, Jeffrey W. McCutcheon
  • Publication number: 20160319165
    Abstract: An electrically conductive, single-sided tape includes a conductive adhesive layer and a non-conductive polymeric layer positioned adjacent the conductive adhesive layer. The conductive adhesive layer includes a conductive, porous substrate having a plurality of passageways and an adhesive material positioned within at least a portion of the passageways. Optionally, the adhesive material may include a plurality of conductive particles dispersed within the adhesive material.
    Type: Application
    Filed: December 9, 2014
    Publication date: November 3, 2016
    Inventors: Jeongwan Choi, Jeffrey W. McCutcheon
  • Publication number: 20160312074
    Abstract: An electrically conductive, single-sided tape includes a conductive adhesive layer and a conductive polymeric layer positioned adjacent the conductive adhesive layer. The conductive adhesive layer includes a conductive, porous substrate having a plurality of passageways and an adhesive material positioned within at least a portion of the passageways. Optionally, the adhesive material may include a plurality of conductive particles dispersed within the adhesive material.
    Type: Application
    Filed: December 16, 2014
    Publication date: October 27, 2016
    Applicant: 3M Innovative Properties Company
    Inventors: Jeongwan Choi, Jeffrey W. McCutcheon
  • Patent number: 9426878
    Abstract: A conductive double-sided tape includes a conductive, nonwoven adhesive layer including an adhesive material, a nonconductive, nonwoven substrate having a plurality of passageways, and a plurality of conductive particles penetrating through the nonconductive, nonwoven substrate and the adhesive material. The nonconductive, nonwoven substrate is embedded in the adhesive material. The conductive particles have a D99 particle size larger than a thickness of the nonconductive, nonwoven substrate and the adhesive material.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: August 23, 2016
    Assignee: 3M Innovative Properties Company
    Inventor: Jeongwan Choi
  • Patent number: 9336923
    Abstract: Disclosed are polymer resins, including polymer resin sheets, having good electroconductivity and a method for manufacturing the same. The polymer resins exhibit flexibility and show electroconductivity on their surface as well as along their thickness, and thus can be used as electromagnetic wave-shielding materials having impact- and vibration-absorbing properties as well as conductivity.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: May 10, 2016
    Assignee: 3M Innovative Properties Company
    Inventors: Jeongwan Choi, Un Nyoung Sa, Won-Sik Kim
  • Publication number: 20150137046
    Abstract: Disclosed are polymer resins, including polymer resin sheets, having good electroconductivity and a method for manufacturing the same. The polymer resins exhibit flexibility and show electroconductivity on their surface as well as along their thickness, and thus can be used as electromagnetic wave-shielding materials having impact- and vibration-absorbing properties as well as conductivity.
    Type: Application
    Filed: January 29, 2015
    Publication date: May 21, 2015
    Inventors: Jeongwan Choi, Un Nyoung Sa, Won-Sik Kim
  • Patent number: 8975004
    Abstract: Disclosed are polymer resins, including polymer resin sheets, having good electroconductivity and a method for manufacturing the same. The polymer resins exhibit flexibility and show electroconductivity on their surface as well as along their thickness, and thus can be used as electromagnetic wave-shielding materials having impact- and vibration-absorbing properties as well as conductivity.
    Type: Grant
    Filed: May 15, 2006
    Date of Patent: March 10, 2015
    Assignee: 3M Innovative Properties Company
    Inventors: Jeongwan Choi, Un Nyoung Sa, Won-Sik Kim