Abstract: An optical apparatus includes a lens including a first surface and a plurality of side surfaces, a display device disposed on a first side surface among the plurality of side surfaces of the lens and providing light to the first side surface of the lens, an optical path control device disposed between the first side surface of the lens and the display device and selectively changing an optical path of a virtual image of the display device, and a plurality of reflecting members disposed in the lens and reflecting light of the display device to the first surface.

Abstract: A cigarette filter which includes lyocell tow made of a plurality of lyocell fibers and a binder configured to bond the lyocell fibers to each other is provided. The cigarette filter according to one embodiment of the present disclosure reduces each of tar and nicotine, which are delivered through cigarette smoke, by 70% to 95%. The cigarette filter according to one embodiment of the present disclosure has a resistance to draw of 80 mmWG to 200 mmWG. The cigarette filter according to one embodiment of the present disclosure is filled with the lyocell tow at a packing density of 0.2 g/mL to 0.6 g/mL. The cigarette filter according to one embodiment of the present disclosure addresses basic material-related problems, such as low hardness, of the lyocell tow and, further, has excellent filtration functionality as a filter.

Abstract: The present disclosure provides a smoking article filter which includes lyocell tow including lyocell fibers, a binder solution, and filter wrapping paper, and has 90% or higher biodegradation within 6 months according to the American Society for Testing and Materials (ASTM) D6691 under marine conditions at 30° C., and a smoking article including the smoking article filter.

Abstract: The present invention is to provide a method for fabricating a semiconductor device, including the steps of: (a) forming an insulating layer on a semiconductor substrate; (b) selectively removing the insulating layer and then forming an opening and the residual insulating layer on a bottom of the opening; (c) removing the residual insulating layer by wet etching in order to expose the semiconductor substrate; and (d) burying a conductive layer in the opening and then forming a conductive layer pattern connected to the semiconductor substrate.