Abstract: A semiconductor device includes a substrate having first and second regions; a first stack structure including lower gate electrodes stacked in a first direction in the first region; a first channel structure penetrating through the first stack structure; a second stack structure on the first stack structure and the first channel structure and including upper gate electrodes stacked in the first direction; a second channel structure penetrating through the second stack structure; a first mold structure including lower horizontal sacrificial layers stacked in the second region; an alignment structure penetrating through the first mold structure; and a second mold structure on the first mold structure and the alignment structure and including upper horizontal sacrificial layers stacked, wherein the number of the lower horizontal sacrificial layers is less than the number of the lower gate electrodes.

Abstract: A camera module may include an image sensor including an optical device configured to rotate about at least one of an x-axis, a y-axis, and a z-axis perpendicular to each other, in response to a mode signal, and configured to generate a plurality of first images, each first image generated when the optical device is at a different position; and an image signal processor (ISP) configured to process the plurality of first images, wherein the ISP is further configured to obtain a plurality of parameters pre-stored according to the mode signal, correct the plurality of first images by using the plurality of parameters, and generate a second image by merging the corrected first images.

Abstract: An imaging device includes an image sensor configured to generate a plurality of original images, and an image processor configured to generate a merged image based on the plurality of original images. The image processor is configured to generate the merged image by classifying the plurality of original images into a plurality of stitching groups based on a first stitching direction, stitching original images included in a same stitching group to generate a plurality of intermediate images, and stitching the plurality of intermediate images based on a second stitching direction to generate the merged image.

Abstract: A method of operating an electronic device includes displaying a preview image in response to execution of a camera application, extracting feature information from the preview image, converting user input to an input value in response to the user input generated on the preview image, setting a depth based on the feature information and the input value, and generating a result image in accordance with the depth in response to execution of an imaging operation.

Abstract: A camera module may include an image sensor including an optical device configured to rotate about at least one of an x-axis, a y-axis, and a z-axis perpendicular to each other, in response to a mode signal, and configured to generate a plurality of first images, each first image generated when the optical device is at a different position; and an image signal processor (ISP) configured to process the plurality of first images, wherein the ISP is further configured to obtain a plurality of parameters pre-stored according to the mode signal, correct the plurality of first images by using the plurality of parameters, and generate a second image by merging the corrected first images.

Abstract: A method of operating an electronic device includes displaying a preview image in response to execution of a camera application, extracting feature information from the preview image, converting user input to an input value in response to the user input generated on the preview image, setting a depth based on the feature information and the input value, and generating a result image in accordance with the depth in response to execution of an imaging operation.