Patents by Inventor Jer-Kuang LU

Jer-Kuang LU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipating module
    Patent number: 10067544
    Abstract: A heat dissipating module includes a bottom cover, a top cover, a fan body, and a heat dissipating structure. The top cover is disposed opposite the bottom cover, in which an air outlet is formed by the top cover and the bottom cover. The fan body is disposed between the top cover and the bottom cover, and the fan body provides an airflow toward the air outlet. The heat dissipating structure is disposed in front of the air outlet, in which the heat dissipating structure and the bottom cover are formed with a one-piece metal sheet. The heat dissipating structure is bent from the bottom cover toward the air outlet. The heat dissipating structure includes openings, such that the airflow passes through the openings from the air outlet and performs heat exchange with the heat dissipating structure.
    Type: Grant
    Filed: March 16, 2015
    Date of Patent: September 4, 2018
    Assignee: Quanta Computer Inc.
    Inventors: Ping-Sheng Kao, Jer-Kuang Lu, Wei-Cheng Liao, Jih-Sheng Yeh
  • HEAT DISSIPATING MODULE
    Publication number: 20160143188
    Abstract: A heat dissipating module includes a bottom cover, a top cover, a fan body, and a heat dissipating structure. The top cover is disposed opposite the bottom cover, in which an air outlet is formed by the top cover and the bottom cover. The fan body is disposed between the top cover and the bottom cover, and the fan body provides an airflow toward the air outlet. The heat dissipating structure is disposed in front of the air outlet, in which the heat dissipating structure and the bottom cover are formed with a one-piece metal sheet. The heat dissipating structure is bent from the bottom cover toward the air outlet. The heat dissipating structure includes openings, such that the airflow passes through the openings from the air outlet and performs heat exchange with the heat dissipating structure.
    Type: Application
    Filed: March 16, 2015
    Publication date: May 19, 2016
    Applicant: Quanta Computer Inc.
    Inventors: Ping-Sheng KAO, Jer-Kuang LU, Wei-Cheng LIAO, Jih-Sheng YEH