Abstract: A water-cooling thermal dissipating method controls at least one of a fan, a pump, and a throttle valve to cool a heat generating element inside an electronic device through a cooling liquid. The method includes steps of: (a) performing a self-condition inspection, (b) detecting whether a working temperature of the cooling liquid is greater than a first predetermined temperature, and detecting whether a working temperature of the heat generating element is greater than a second predetermined temperature, (c) outputting a first warning signal if the working temperature of the cooling liquid is greater than the first predetermined temperature and a liquid level of the cooling liquid is not lower than a threshold liquid level, and outputting a second warning signal if the working temperature of the heat generating element is greater than the second predetermined temperature, and (d) displaying the first warning signal and the second warning signal.

Abstract: A water-cooling thermal dissipating method controls at least one of a fan, a pump, and a throttle valve to cool a heat generating element inside an electronic device through a cooling liquid. The method includes steps of: (a) performing a self-condition inspection, (b) detecting whether a working temperature of the cooling liquid is greater than a first predetermined temperature, and detecting whether a working temperature of the heat generating element is greater than a second predetermined temperature, (c) outputting a first warning signal if the working temperature of the cooling liquid is greater than the first predetermined temperature and a liquid level of the cooling liquid is not lower than a threshold liquid level, and outputting a second warning signal if the working temperature of the heat generating element is greater than the second predetermined temperature, and (d) displaying the first warning signal and the second warning signal.

Abstract: A water-cooling thermal dissipating system includes an electronic device and a thermal dissipating device. The electronic device includes a computing module includes a computing unit releasing heat when operation. The thermal dissipating device includes a thermal conducting unit, a pump, a tank, a thermal exchanger, and a controlling module; the thermal conductive unit is attached to the computing unit for thermal conduction; the pump is coupled to the thermal conductive unit, the pump, the tank, and the thermal exchanger for pumping a cooling-liquid therethrough, such that the cooling liquid is allowed to flow into the thermal conductive unit for absorbing heat. The controlling module generates an abnormal signal when the thermal dissipating device is sensed to be in an abnormal state, and the computing module forces to shut down the electronic device after continually receiving the abnormal signal for a predetermined time.

Abstract: A water-cooling thermal dissipating system includes an electronic device and a thermal dissipating device. The electronic device includes a computing module includes a computing unit releasing heat when operation. The thermal dissipating device includes a thermal conducting unit, a pump, a tank, a thermal exchanger, and a controlling module; the thermal conductive unit is attached to the computing unit for thermal conduction; the pump is coupled to the thermal conductive unit, the pump, the tank, and the thermal exchanger for pumping a cooling-liquid therethrough, such that the cooling liquid is allowed to flow into the thermal conductive unit for absorbing heat. The controlling module generates an abnormal signal when the thermal dissipating device is sensed to be in an abnormal state, and the computing module forces to shut down the electronic device after continually receiving the abnormal signal for a predetermined time.

Abstract: A water-cooling thermal dissipating system includes an electronic device and a thermal dissipating device. The electronic device includes a computing module includes a computing unit releasing heat when operation. The thermal dissipating device includes a thermal conducting unit, a pump, a tank, a thermal exchanger, and a controlling module; the thermal conductive unit is attached to the computing unit for thermal conduction; the pump is coupled to the thermal conductive unit, the pump, the tank, and the thermal exchanger for pumping a cooling-liquid therethrough, such that the cooling liquid is allowed to flow into the thermal conductive unit for absorbing heat. The controlling module generates an abnormal signal when the thermal dissipating device is sensed to be in an abnormal state, and the computing module forces to shut down the electronic device after continually receiving the abnormal signal for a predetermined time.

Abstract: A water-cooling thermal dissipating system includes an electronic device and a thermal dissipating device. The electronic device includes a computing module includes a computing unit releasing heat when operation. The thermal dissipating device includes a thermal conducting unit, a pump, a tank, a thermal exchanger, and a controlling module; the thermal conductive unit is attached to the computing unit for thermal conduction; the pump is coupled to the thermal conductive unit, the pump, the tank, and the thermal exchanger for pumping a cooling-liquid therethrough, such that the cooling liquid is allowed to flow into the thermal conductive unit for absorbing heat. The controlling module generates an abnormal signal when the thermal dissipating device is sensed to be in an abnormal state, and the computing module forces to shut down the electronic device after continually receiving the abnormal signal for a predetermined time.

Abstract: A liquid cooling heat exchanger module filled with a cooling liquid includes a casing (10) and a cooling structure (11), and the interior of the casing (10) is hollow, and the cooling structure (11) is installed in the casing (10), and the cooling structure (11) is formed by a plurality of fins (14) erected vertically and arranged equidistantly apart from one another to form a plurality of flow channels (15), and the cooling structure (11) includes one or more of transversally cut grooves (111) between the fins (15), so as to achieve the effects of extending the time for the cooling liquid to stay in the heat exchanger module (1), maximizing the cooling effect of the cooling liquid, and improving the heat dissipating efficiency.

Abstract: A liquid cooling heat exchanger module filled with a cooling liquid includes a casing (10) and a cooling structure (11), and the interior of the casing (10) is hollow, and the casing (10) has an inlet (100) and an outlet (101) interconnected to the interior, and the cooling structure (11) is installed in the casing (10), and the cooling structure (11) has a vortex generating area (110) concavely formed at a position opposite to the inlet (100), such that a cooling liquid is filled from the inlet (100) into the casing (10) and impacted in the vortex generating area (110) to form a vortex, so as to achieve the effects of extending the time for the cooling liquid to stay in the heat exchanger module (1), maximizing the cooling effect of the cooling liquid, and improving the heat dissipating efficiency.

Abstract: A heat dissipating apparatus with a vortex generator includes a heat conducting base, a heat pipe, and a plurality of heat dissipating fins. Each heat dissipating fin has a pair of vortex generators installed with an interval apart and disposed adjacent to a side of the heat pipe, and each vortex generator has two guiding oblique surfaces protruding from a surface of the heat dissipating fin, and the two guiding oblique surfaces protrude in a tapered form. A through hole is formed at a wide position of the tapered form and penetrates through the heat dissipating fin, such that the vortex generators of each heat dissipating fin induce a stack effect at corresponding upper and lower part of the heat dissipating fin to improve the heat dissipating efficiency.

Abstract: A liquid-cooling heat-dissipating module is configured for allowing a cooling liquid to be filled therein and includes a casing and a cooling assembly. The casing has a hollow interior and is provided with an inlet and an outlet in communication with its interior. The cooling assembly is provided in the casing and formed with a conical eddy generation region at a position corresponding to the outlet. The cooling liquid generates an eddy in the eddy generation region to flow into the outlet. By this structure, the staying time of the cooling liquid in the heat exchange module is increased, so that the cooling effect and the heat-dissipating efficiency of the cooling liquid are improved greatly.

Abstract: A water-cooling thermal dissipation system is connected to an electronic device for dissipating heat generated by a thermal generating member. The electronic device includes a motherboard where the heat generating member disposed. The water-cooling heat dissipation system includes at least one thermal-cycling loop, a controlling module, and a connecting member. A cooling liquid of the thermal-cycling loop flows in at least one pump and at least one thermal exchanger through a plurality pipes. The controlling module is electrically connected to the thermal-cycling loop and monitors the operating temperatures of the thermal generating member and the cooling liquid, and outputs a warning signal when one of operation temperatures of the thermal generating member and the cooling liquid is higher than a predetermined value. The connecting member is connected to the controlling module and the motherboard, so that signals can transmit between the controlling module and the motherboard.

Abstract: A liquid-cooling heat-dissipating module is configured for allowing a cooling liquid to be filled therein and includes a casing and a cooling assembly. The casing has a hollow interior and is provided with an inlet and an outlet in communication with its interior. The cooling assembly is provided in the casing and formed with a conical eddy generation region at a position corresponding to the outlet. The cooling liquid generates an eddy in the eddy generation region to flow into the outlet. By this structure, the staying time of the cooling liquid in the heat exchange module is increased, so that the cooling effect and the heat-dissipating efficiency of the cooling liquid are improved greatly.

Abstract: A liquid cooling heat exchanger module filled with a cooling liquid includes a casing (10) and a cooling structure (11), and the interior of the casing (10) is hollow, and the casing (10) has an inlet (100) and an outlet (101) interconnected to the interior, and the cooling structure (11) is installed in the casing (10), and the cooling structure (11) has a vortex generating area (110) concavely formed at a position opposite to the inlet (100), such that a cooling liquid is filled from the inlet (100) into the casing (10) and impacted in the vortex generating area (110) to form a vortex, so as to achieve the effects of extending the time for the cooling liquid to stay in the heat exchanger module (1), maximizing the cooling effect of the cooling liquid, and improving the heat dissipating efficiency.

Abstract: A heat dissipating apparatus with a vortex generator includes a heat conducting base, a heat pipe, and a plurality of heat dissipating fins. Each heat dissipating fin has a vortex generator installed thereon and disposed adjacent to a side of the heat pipe. The vortex generator has two guiding oblique surfaces protruding from a surface of the heat dissipating fin. The two guiding oblique surfaces are disposed with an included angle there between. A through hole is formed at a position opposite to a side of the heat dissipating fin, such that the vortex generator of each heat dissipating fin induces a stack effect at corresponding upper and lower parts of the heat dissipating fin to improve the heat dissipating efficiency.

Abstract: A heat dissipating apparatus with a vortex generator includes a heat conducting base, a heat pipe, and a plurality of heat dissipating fins. Each heat dissipating fin has a pair of vortex generators installed with an interval apart and disposed adjacent to a side of the heat pipe, and each vortex generator has two guiding oblique surfaces protruding from a surface of the heat dissipating fin, and the two guiding oblique surfaces protrude in a tapered form. A through hole is formed at a wide position of the tapered form and penetrates through the heat dissipating fin, such that the vortex generators of each heat dissipating fin induce a stack effect at corresponding upper and lower part of the heat dissipating fin to improve the heat dissipating efficiency.