Patents by Inventor Jer-Shyong Lai

Jer-Shyong Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of polishing semiconductor copper interconnect integrated with extremely low dielectric constant material
    Publication number: 20040259481
    Abstract: A method of polishing metal and barrier layer interconnect integrated with an extremely low dielectric constant material includes steps of (A) preparing a wafer composed of a copper layer and the extremely low dielectric constant material, (B) treating the copper layer chemically to produce a hard and brittle surface residual formed on the surface of the copper layer, (C) keeping polishing the surface residual by ultrasonic waves, (D) polishing a barrier layer of wafer by the ultrasonic waves, thereby polishing the wafer successfully.
    Type: Application
    Filed: July 14, 2003
    Publication date: December 23, 2004
    Applicant: CHUNG SHAN INSTITUTE OF SCIENCE & TECHNOLOGY
    Inventors: Wen-Chueh Pan, Jer-Shyong Lai, Yih-Hsing Wang, Yang-Jiann Fann, Chih-Wei Chu, Hsing-Liao Chung, Chaug-Liang Hsu, Ming-Tseh Tsay, Yeau-Ren Jeng, Meng-Shiun Tsai
  • Compensating chemical mechanical wafer polishing apparatus and method
    Patent number: 6685543
    Abstract: A compensating chemical mechanical wafer polishing apparatus and its related polishing method, which makes end point detection easy, minimizes slurry consumption, and requires less installation space and, in which a main polishing head of diameter smaller than the wafer and a compensating polishing head are used to polish the wafer, which is upwardly disposed in contact with the polishing heads. By means of the operation of the compensating polishing head to polish the wafer over the area where the main polishing head cannot effectively evenly polish, satisfactory polishing effect is achieved.
    Type: Grant
    Filed: April 8, 2002
    Date of Patent: February 3, 2004
    Assignee: Chung Shan Institute of Science & Technology
    Inventors: Jer-Shyong Lai, Wen-Chueh Pan, Yang-Jiann Fann, Yih-Hsing Wang, Chien-Cheng He, Chaug-Liang Hsu
  • Compensating chemical mechanical wafer polishing apparatus and method
    Publication number: 20030100196
    Abstract: A compensating chemical mechanical wafer polishing apparatus and its related polishing method, which makes end point detection easy, minimizes slurry consumption, and requires less installation space and, in which a main polishing head of diameter smaller than the wafer and a compensating polishing head are used to polish the wafer, which is upwardly disposed in contact with the polishing heads. By means of the operation of the compensating polishing head to polish the wafer over the area where the main polishing head cannot effectively evenly polish, satisfactory polishing effect is achieved.
    Type: Application
    Filed: April 8, 2002
    Publication date: May 29, 2003
    Applicant: CHUNG SHAN INSTITUTE OF SCIENCE & TECHNOLOGY
    Inventors: Jer-Shyong Lai, Wen-Chueh Pan, Yang-Jiann Fann, Yih-Hsing Wang, Chien-Cheng He, Chaug-Liang Hsu